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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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PDIP-28 · 28P

AT28HC64BF-12PU (PDIP-28) - 3D-Modell (PDIP-28)

AT28HC64BF-12PU

MICROCHIP·PDIP-28

READY

28P35.0×14.1×4.20mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

- · 44P

ATXMEGA16D4-AN (-) - 3D-Modell (-)

ATXMEGA16D4-AN

READY

44P10.0×10.0×1.00mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

- · 16P

AT89LP216-20PU (-) - 3D-Modell (-)

AT89LP216-20PU

READY

16P19.8×6.3×4.20mmP=2.54mm2.4V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27C256R-55TI (TSOP-28) - 3D-Modell (TSOP-28)

AT27C256R-55TI

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm

Standard-Elektronik- & Steckverbinderbauteil

PDIP-28 · 28P

AT27C256R-70PI (PDIP-28) - 3D-Modell (PDIP-28)

AT27C256R-70PI

MICROCHIP·PDIP-28

READY

28P35.0×13.8×4.20mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

SY88913KC-TR (MSOP-10) - 3D-Modell (MSOP-10)

SY88913KC-TR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

MLF-16(3x3) · 17P

SY88953LMI (MLF-16(3x3)) - 3D-Modell (MLF-16(3x3))

SY88953LMI

MICROCHIP·MLF-16(3x3)

READY

17P3.0×3.0×1.00mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24FJ128GB202-I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24FJ128GB202-I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm2.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

MCP120-485GI/TO (TO-92-3) - 3D-Modell (TO-92-3)

MCP120-485GI/TO

MICROCHIP·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PDIP-40 · 40P

ATMEGA8535L-8PU (PDIP-40) - 3D-Modell (PDIP-40)

ATMEGA8535L-8PU

MICROCHIP·PDIP-40

READY

40P10.0×10.0×3.85mmP=2.54mm

Eingebetteter Mikrocontroller (MCU)

PLCC-28(11.5x11.5) · 28P

MIC58P01YV (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

MIC58P01YV

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18F2221-E/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F2221-E/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-16-EP(4x4) · 17P

MCP4261-104E/ML (QFN-16-EP(4x4)) - 3D-Modell (QFN-16-EP(4x4))

MCP4261-104E/ML

MICROCHIP·QFN-16-EP(4x4)

READY

17P4.0×4.0×0.85mmP=0.5mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

25LC160B-I/MS (MSOP-8) - 3D-Modell (MSOP-8)

25LC160B-I/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP3422A0-E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP3422A0-E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.85mmP=0.5mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MCP4161-103E/SN (SOIC-8) - 3D-Modell (SOIC-8)

MCP4161-103E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

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