PIC32MX274F256BT-I/SO (SOIC-28-300mil) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC32MX274F256BT-I/SO (SOIC-28-300mil)?

Manufactured by MICROCHIP, the PIC32MX274F256BT-I/SO is housed in a SOIC-28-300mil package with 28 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.5V to 3.6V. Key pins include: 1 (#MCLR: Multiplexed I/O & Peripheral Pin #MCLR (General)), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (NC: No Connect (Leave Floating)), 5 (IO2: GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1), 6 (IO3: GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC32MX274F256BT-I/SO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC32MX274F256BT-I/SO (SOIC-28-300mil) has a nominal body envelope of 7.50 × 17.90 mm, pitch e = 1.27 mm, and 28 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC32MX274F256BT-I/SO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC32MX274F256BT-I/SO (MICROCHIP, SOIC-28-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 7.50mm × 17.90mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (28/28)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	#MCLR	I/O	Multiplexed I/O & Peripheral Pin #MCLR (General)
2	IO2	I/O	General Purpose Digital I/O Pin IO2
3	3V3	Power	3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4	NC	NC	No Connect (Leave Floating)
5	IO2	I/O	GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6	IO3	I/O	GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7	NC	NC	No Connect (Leave Floating)
8	VSS	GND	Ground Reference Pin (VSS)
9	OSC1/CLKI/RPA2/RA2	I/O	Multiplexed I/O & Peripheral Pin OSC1/CLKI/RPA2/RA2 (RTC/CLK)
10	IO5	I/O	GPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11	SOSCI/RPB4/CTED11/RB4	I/O	Multiplexed I/O & Peripheral Pin SOSCI/RPB4/CTED11/RB4 (General)
12	IO7	I/O	GPIO7 / RTC_GPIO7 / TOUCH7 / ADC1_CH6
13	VDD	Power	Power Supply Input (VDD — 2.5V to 3.6V)
14	TMS/RPB5/USBID/RB5	I/O	Multiplexed I/O & Peripheral Pin TMS/RPB5/USBID/RB5 (USB)
15	VBUS	Power	Power Supply Input (VBUS — 2.5V to 3.6V)
16	IO18	I/O	GPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17	IO8	I/O	GPIO8 / RTC_GPIO8 / TOUCH8 / ADC1_CH7 / SUBSPICS1
18	IO19	I/O	GPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19	VSS	GND	Ground Reference Pin (VSS)
20	VCAP	I/O	Multiplexed I/O & Peripheral Pin VCAP (General)
21	D+	I/O	Multiplexed I/O & Peripheral Pin D+ (USB)
22	D-	I/O	Multiplexed I/O & Peripheral Pin D- (USB)
23	VUSB3V3	Power	Power Supply Input (VUSB3V3 — 2.5V to 3.6V)
24	IO13	I/O	GPIO13 / RTC_GPIO13 / TOUCH13 / ADC2_CH2 / FSPIQ
25	IO14	I/O	GPIO14 / RTC_GPIO14 / TOUCH14 / ADC2_CH3 / FSPIWP
26	IO21	I/O	GPIO21 / RTC_GPIO21
27	AVSS	GND	Ground Reference Pin (AVSS)
28	AVDD	Power	Power Supply Input (AVDD — 2.5V to 3.6V)

PIN 1 #MCLR

I/O

Multiplexed I/O & Peripheral Pin #MCLR (General)

Design note: Signal terminal #MCLR (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: #MCLR. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 10 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 2. Standard Pinout (Top View)

True package pinout (28 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 4. Package Dimensions (D×E×A)

SOIC-28-300mil · 7.50×17.90mm · Pitch 1.27mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 5. Recommended Land Pattern

IPC-7351B Footprint (28 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC32MX274F256BT-I/SO (SOIC-28-300mil) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (10 figures · Page 1/1)

Showing 1–10 of 10 uncropped original figures for PIC32MX274F2

P1 · p01_fig01377×200px

PIC32MX274F256BT-I/SO (SOIC-28-300mil) — 32-bit XLP Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

32-bit XLP Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

P19 · p19_fig011557×1653px

FIGURE 1-1: BLOCK DIAGRAM

P37 · p37_fig011369×806px

FIGURE 2-5: REMOTE SENSING APPLICATION

P37 · p37_fig021778×1378px

FIGURE 2-6: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

P37 · p37_fig02P37

Datasheet Page 37 (p37_fig02)

P149 · p149_fig01867×929px

FIGURE 12-2: REMAPPABLE INPUT EXAMPLE FOR U1RX

P211 · p211_fig011726×671px

Figure 22-1 illustrates the PMP module block diagram.

P211 · p211_fig021195×1043px

FIGURE 22-1: PMP MODULE PINOUT AND CONNECTIONS TO EXTERNAL DEVICES

P211 · p211_fig02P211

Datasheet Page 211 (p211_fig02)

P347 · p347_fig011778×2571px

PIC32MX1XX/2XX 28/44-PIN XLP FAMILY

Technical Specifications & Part Details (PIC32MX274F256BT-I/SO)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC32MX274F256BT-I/SO (SOIC-28-300mil) is a 28-pin standard electronic & interconnect component featuring a 17.90 × 7.50 × 2.70 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 2.5V to 3.6V supply operation across -40°C to +85°C with integrated USB, UART, SPI, I2C, I2S, ADC, PWM, JTAG / SWD, IrDA, RTC/CLK interfaces.

Operating Supply VoltageV_CC / V_DD

2.5V to 3.6V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

72 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

17.90 × 7.50 × 2.70 mm (A1=0.20 mm)

Package family: SOIC (SOIC-28-300mil)

Pin Count & Lead PitchN / e

28 Pins | Pitch e = 1.27 mm (50.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

USB, UART, SPI, I2C, I2S, ADC, PWM, JTAG / SWD, IrDA, RTC/CLK

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol28 auto-grouped pins

IPC-7351B Land Pattern28 pads · Pitch 1.27mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-28-300mil)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

17.90 × 7.50 mm

Height (A) & Pitch (e)IPC-7351B

A=2.70mm · e=1.27mm

Pad Size (W × L)Level B

0.60 × 1.90 mm

Pins / Total PadsTopology

28P / 28Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SOIC-28-300mil	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC32MX274F256BT-I/SO (SOIC-28-300mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC32MX274F256BT-I/SO (SOIC-28-300mil)?

Manufactured by MICROCHIP, the PIC32MX274F256BT-I/SO is housed in a SOIC-28-300mil package with 28 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.5V to 3.6V. Key pins include: 1 (#MCLR: Multiplexed I/O & Peripheral Pin #MCLR (General)), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 (NC: No Connect (Leave Floating)), 5 (IO2: GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1), 6 (IO3: GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)).

What are the IPC-7351B PCB Footprint dimensions for PIC32MX274F256BT-I/SO?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC32MX274F256BT-I/SO (SOIC-28-300mil) has a nominal body envelope of 7.50 × 17.90 mm, pitch e = 1.27 mm, and 28 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC32MX274F256BT-I/SO?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC32MX274F256BT-I/SO (MICROCHIP, SOIC-28-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (28 pins) & PIC32MX274F2 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	#MCLR	Digital_IO	Signal terminal #MCLR (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: #MCLR. Supported peripheral buses: General.
2	IO2	Digital_IO	General Purpose Digital I/O Pin IO2
3	3V3	Power_In	3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4	NC	No_Connect	No Connect (Leave Floating)
5	IO2	Digital_IO	GPIO2 / RTC_GPIO2 / TOUCH2 / ADC1_CH1
6	IO3	Digital_IO	GPIO3 / RTC_GPIO3 / TOUCH3 / ADC1_CH2 (JTAG Source Strap)
7	NC	No_Connect	No Connect (Leave Floating)
8	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
9	OSC1/CLKI/RPA2/RA2	Digital_IO	Signal terminal OSC1/CLKI/RPA2/RA2 (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: OSC1/CLKI/RPA2/RA2. Supported peripheral buses: RTC/CLK.
10	IO5	Digital_IO	GPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11	SOSCI/RPB4/CTED11/RB4	Digital_IO	Signal terminal SOSCI/RPB4/CTED11/RB4 (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: SOSCI/RPB4/CTED11/RB4. Supported peripheral buses: General.
12	IO7	Digital_IO	GPIO7 / RTC_GPIO7 / TOUCH7 / ADC1_CH6
13	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.5V to 3.6V domain (Max rating: 3.6V).
14	TMS/RPB5/USBID/RB5	Digital_IO	Signal terminal TMS/RPB5/USBID/RB5 (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: TMS/RPB5/USBID/RB5. Supported peripheral buses: USB.
15	VBUS	Power_In	Primary positive power supply input (VBUS) operating in the 2.5V to 3.6V domain (Max rating: 3.6V).
16	IO18	Digital_IO	GPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17	IO8	Digital_IO	GPIO8 / RTC_GPIO8 / TOUCH8 / ADC1_CH7 / SUBSPICS1
18	IO19	Digital_IO	GPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
20	VCAP	Digital_IO	Signal terminal VCAP (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: VCAP. Supported peripheral buses: General.
21	D+	Digital_IO	Signal terminal D+ (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: D+. Supported peripheral buses: USB.
22	D-	Digital_IO	Signal terminal D- (I/O, 2.5V to 3.6V domain). Multiplexed alternate functions: D-. Supported peripheral buses: USB.
23	VUSB3V3	Power_In	Primary positive power supply input (VUSB3V3) operating in the 2.5V to 3.6V domain (Max rating: 3.6V).
24	IO13	Digital_IO	GPIO13 / RTC_GPIO13 / TOUCH13 / ADC2_CH2 / FSPIQ
25	IO14	Digital_IO	GPIO14 / RTC_GPIO14 / TOUCH14 / ADC2_CH3 / FSPIWP
26	IO21	Digital_IO	GPIO21 / RTC_GPIO21
27	AVSS	GND	0V electrical ground return terminal (AVSS) for internal core logic, I/O drivers, and analog sub-blocks.
28	AVDD	Power_In	Primary positive power supply input (AVDD) operating in the 2.5V to 3.6V domain (Max rating: 3.6V).

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