3994 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4004 Bauteilen · Seite 87/251)

Zeige 1377–1392 von 4004 Bauteilen

QFN-16(4x4) · 17P

EQCO62X20C1-I/8EX (QFN-16(4x4)) - 3D-Modell (QFN-16(4x4))

EQCO62X20C1-I/8EX

MICROCHIP·QFN-16(4x4)

READY

17P4.0×4.0×0.90mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole · 2P

1N4097 (Through Hole) - 3D-Modell (Through Hole)

1N4097

MICROCHIP·Through Hole

READY

2P2.0×2.0×0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

PIC12C509A-04I/SM (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

PIC12C509A-04I/SM

MICROCHIP·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-14 · 14P

PIC16C505-04I/P (DIP-14) - 3D-Modell (DIP-14)

PIC16C505-04I/P

MICROCHIP·DIP-14

READY

14P17.2×6.3×3.50mmP=2.54mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

AT89C55WD-24AU (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

AT89C55WD-24AU

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.00mmP=0.8mm4V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DIP-18 · 18P

PIC16C54C-04/P (DIP-18) - 3D-Modell (DIP-18)

PIC16C54C-04/P

MICROCHIP·DIP-18

READY

18P22.3×6.3×3.50mmP=2.54mm2.0V to 6.25V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-48(7x7) · 49P

ATA6613C-PLQW-1 (VQFN-48(7x7)) - 3D-Modell (VQFN-48(7x7))

ATA6613C-PLQW-1

MICROCHIP·VQFN-48(7x7)

READY

49P7.0×7.0×0.85mmP=0.5mm5V to 27V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-44(10x10) · 44P

AT89C51RC-24AU (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

AT89C51RC-24AU

MICROCHIP·TQFP-44(10x10)

READY

44P10.0×10.0×1.00mmP=0.8mm4V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

MCP6022-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

MCP6022-I/ST

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-44(16.6x16.6) · 44P

AT89LS52-16JU (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

AT89LS52-16JU

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.00mmP=1.27mm2.7V to 4.0V

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

PIC12F1822-I/P (DIP-8) - 3D-Modell (DIP-8)

PIC12F1822-I/P

MICROCHIP·DIP-8

READY

8P3.0×3.0×3.50mmP=2.54mm1.8V-3.6V

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

MIC29152WU (TO-263-5) - 3D-Modell (TO-263-5)

MIC29152WU

MICROCHIP·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-28-600mil · 28P

PIC16F57-I/P (DIP-28-600mil) - 3D-Modell (DIP-28-600mil)

PIC16F57-I/P

MICROCHIP·DIP-28-600mil

READY

28P35.0×14.3×4.20mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

VSOP-32 · 32P

AT27LV010A-70VI (VSOP-32) - 3D-Modell (VSOP-32)

AT27LV010A-70VI

MICROCHIP·VSOP-32

READY

32P12.4×8.0×2.45mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TSOP-28 · 28P

AT27BV256-90TC (TSOP-28) - 3D-Modell (TSOP-28)

AT27BV256-90TC

MICROCHIP·TSOP-28

READY

28P11.8×8.0×2.50mmP=0.55mm2.7V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

FPBGA-256(17x17) · 256P

M7A3P1000-2FG256I (FPBGA-256(17x17)) - 3D-Modell (FPBGA-256(17x17))

M7A3P1000-2FG256I

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm2.7 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

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