CH32M007E8U7 (QFN26C(3x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH32M007E8U7

WCHID: C55014311QFN26C(3x3) · 26 Pins · Pitch 0.40mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH32M007E8U7 (QFN26C(3x3))1PC4/A22PC5/RST/T2C13VSS4PD2/T2C3/CP25PD1/SWIO/T1C6PD3/OP2/A47PD4/A78PD5/CN1/A59PD6/A610PD7/OP1/A+11PA4/ON2/A-12PA5/OO1/AO13VDD26PA1/ON0/A125PC2/CN0/SCL24PC123PC0/TX_/CPO22PB3/SWCK/T1B21LO3(PD0/T1C320HO3(PB1/T1C319LO2(PA2/T1C218HO2(PB0/T1C217LO1(PA0/T1C116HO1(PA3/T1C115VHV14VHREGGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.822.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9mm
2. 2D FOOTPRINT
1245678910111213141516171819202122232425263E=3.00mm · Pitch e=0.40mmD=3.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.40mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (26/26)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PC4/A2I/OMultiplexed I/O & Peripheral Pin PC4/A2 (General)
2PC5/RST/T2C1/CP0I/OMultiplexed I/O & Peripheral Pin PC5/RST/T2C1/CP0 (General)
3VSSGNDGround Reference Pin (VSS)
4PD2/T2C3/CP2/A3I/OMultiplexed I/O & Peripheral Pin PD2/T2C3/CP2/A3 (General)
5PD1/SWIO/T1C4/OP3I/OMultiplexed I/O & Peripheral Pin PD1/SWIO/T1C4/OP3 (General)
6PD3/OP2/A4I/OMultiplexed I/O & Peripheral Pin PD3/OP2/A4 (General)
7PD4/A7I/OMultiplexed I/O & Peripheral Pin PD4/A7 (General)
8PD5/CN1/A5I/OMultiplexed I/O & Peripheral Pin PD5/CN1/A5 (General)
9PD6/A6I/OMultiplexed I/O & Peripheral Pin PD6/A6 (General)
10PD7/OP1/A+I/OMultiplexed I/O & Peripheral Pin PD7/OP1/A+ (General)
11PA4/ON2/A-I/OMultiplexed I/O & Peripheral Pin PA4/ON2/A- (General)
12PA5/OO1/AOI/OMultiplexed I/O & Peripheral Pin PA5/OO1/AO (General)
13VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
14VHREGI/OMultiplexed I/O & Peripheral Pin VHREG (General)
15VHVI/OMultiplexed I/O & Peripheral Pin VHV (General)
16HO1(PA3/T1C1)I/OMultiplexed I/O & Peripheral Pin HO1(PA3/T1C1) (General)
17LO1(PA0/T1C1N)I/OMultiplexed I/O & Peripheral Pin LO1(PA0/T1C1N) (General)
18HO2(PB0/T1C2)I/OMultiplexed I/O & Peripheral Pin HO2(PB0/T1C2) (General)
19LO2(PA2/T1C2N)I/OMultiplexed I/O & Peripheral Pin LO2(PA2/T1C2N) (General)
20HO3(PB1/T1C3)I/OMultiplexed I/O & Peripheral Pin HO3(PB1/T1C3) (General)
21LO3(PD0/T1C3N)I/OMultiplexed I/O & Peripheral Pin LO3(PD0/T1C3N) (General)
22PB3/SWCK/T1BK/T2C2/CP1I/OMultiplexed I/O & Peripheral Pin PB3/SWCK/T1BK/T2C2/CP1 (General)
23PC0/TX_/CPOI/OMultiplexed I/O & Peripheral Pin PC0/TX_/CPO (General)
24PC1I/OMultiplexed I/O & Peripheral Pin PC1 (SPI, I2C)
25PC2/CN0/SCLI/OMultiplexed I/O & Peripheral Pin PC2/CN0/SCL (I2C)
26PA1/ON0/A1I/OMultiplexed I/O & Peripheral Pin PA1/ON0/A1 (General)
PIN 1 PC4/A2
I/O
Multiplexed I/O & Peripheral Pin PC4/A2 (General)
Design note: Signal terminal PC4/A2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PC4/A2. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
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PDF VIEWEROfficial Datasheet Document: CH32M007E8U7 (WCH · QFN26C(3x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH32M007E8U7 (QFN26C(3x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH32M007E8U7 (QFN26C(3x3)) - 2. Standard Pinout (Top View)
True package pinout (26 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH32M007E8U7 (QFN26C(3x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH32M007E8U7 (QFN26C(3x3)) - 4. Package Dimensions (D×E×A)
QFN26C(3x3) · 3.00×3.00mm · Pitch 0.40mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH32M007E8U7 (QFN26C(3x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (26 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH32M007E8U7 (QFN26C(3x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for CH32M007
P2 · p02_fig012022×848px
CH32M007E8U7 (QFN26C(3x3)) — 型号 闪存RAM | 通 用 I/O | 高 级 定 时 器 | 通 用 定 时 | 器 | 精 简 定 时 | 器 | 看 门 狗 | 三相预驱 | ADC | 电容 触摸 按键 | OPA 运放 | OPA 轮询CMP 串 | 口I2C SPI | 最大 工作 环境 温度 | 封装 形式 电压结构 | CH32M007E8R6 62K 8K 15 1 1 1 2 24V P+N 7+2 7 路 1 3 路 2 2 1 1 85℃ QSOP24 | CH32M007E8U7
型号 闪存RAM | 通 用 I/O | 高 级 定 时 器 | 通 用 定 时 | 器 | 精 简 定 时 | 器 | 看 门 狗 | 三相预驱 | ADC | 电容 触摸 按键 | OPA 运放 | OPA 轮询CMP 串 | 口I2C SPI | 最大 工作 环境 温度 | 封装 形式 电压结构 | CH32M007E8R6 62K 8K 15 1 1 1 2 24V P+N 7+2 7 路 1 3 路 2 2 1 1 85℃ QSOP24 | CH32M007E8U7
P14 · p14_fig011396×1406px
CH32M007E8U7 (QFN26C(3x3)) — 24 CH32V007E8R
24 CH32V007E8R
P14 · p14_fig02999×651px
CH32M007E8U7 (QFN26C(3x3)) — V1.8 9
V1.8 9
P14 · p14_fig01P14
CH32M007E8U7 (QFN26C(3x3)) — Datasheet Page 14 (p14_fig01)
Datasheet Page 14 (p14_fig01)
P15 · p15_fig011082×1076px
CH32M007E8U7 (QFN26C(3x3)) — 2.1.2 CH32M007 引脚排列 | 12 | 17 | 9 | 14 | 18 19 | 10 | 16 | 11 | 15 | 20 | 13 | 21 22 | 24 23 | CH32M007K8U7 | 27 | 29 30 31 32 | 26 25 | 28 PC5/RST/T2C1/CP0 | PC4/A2 PD2/T2C3/CP2/A3 PD3/OP2/A4 PD4/A7 | PA1/ON0/A1 PC2/CN0/SCL | PC7 | VS1 | L
2.1.2 CH32M007 引脚排列 | 12 | 17 | 9 | 14 | 18 19 | 10 | 16 | 11 | 15 | 20 | 13 | 21 22 | 24 23 | CH32M007K8U7 | 27 | 29 30 31 32 | 26 25 | 28 PC5/RST/T2C1/CP0 | PC4/A2 PD2/T2C3/CP2/A3 PD3/OP2/A4 PD4/A7 | PA1/ON0/A1 PC2/CN0/SCL | PC7 | VS1 | L
P15 · p15_fig02979×750px
CH32M007E8U7 (QFN26C(3x3)) — 2.1.2 CH32M007 引脚排列 | VSS | HO2(PB0/T1C2) | HO1(PA3/T1C1) | VS3 VB3 | VB2 VS2 | HO3(PB1/T1C3) | PC2/CN0/PD1/SWIO/T1C4/OP3 | PC5/RST/T2C1/SCL/CP0 | PC4/SDA/A2 | PA4/ON2/A- | PA1/ON0/A1 | PB3/SWCK/T1BK/T2C2/CP1 | CH32M007G8R6 | VDD | VCC12V V
2.1.2 CH32M007 引脚排列 | VSS | HO2(PB0/T1C2) | HO1(PA3/T1C1) | VS3 VB3 | VB2 VS2 | HO3(PB1/T1C3) | PC2/CN0/PD1/SWIO/T1C4/OP3 | PC5/RST/T2C1/SCL/CP0 | PC4/SDA/A2 | PA4/ON2/A- | PA1/ON0/A1 | PB3/SWCK/T1BK/T2C2/CP1 | CH32M007G8R6 | VDD | VCC12V V
P27 · p27_fig01638×567px
CH32M007E8U7 (QFN26C(3x3)) — 图3-1-1 CH32V007 常规供电典型电路 VDD
图3-1-1 CH32V007 常规供电典型电路 VDD
P27 · p27_fig021186×1032px
CH32M007E8U7 (QFN26C(3x3)) — 图3-1-2 CH32M007K8U7 和CH32M007G8R6 常规供电典型电路 VHV
图3-1-2 CH32M007K8U7 和CH32M007G8R6 常规供电典型电路 VHV
P28 · p28_fig01752×1026px
CH32M007E8U7 (QFN26C(3x3)) — 图3-1-3 CH32M007E8U7 常规供电典型电路
图3-1-3 CH32M007E8U7 常规供电典型电路
P28 · p28_fig02757×808px
CH32M007E8U7 (QFN26C(3x3)) — 图3-1-4 CH32M007E8R6 常规供电典型电路 VHV
图3-1-4 CH32M007E8R6 常规供电典型电路 VHV
P28 · p28_fig01P28
CH32M007E8U7 (QFN26C(3x3)) — Datasheet Page 28 (p28_fig01)
Datasheet Page 28 (p28_fig01)

Technical Specifications & Part Details (CH32M007E8U7)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH32M007E8U7 (QFN26C(3x3)) is a 26-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.90 mm mechanical envelope (lead pitch e = 0.40 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated UART, SPI, I2C, ADC, PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
25MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 0.90 mm (A1=0.03 mm)
Package family: QFN (QFN26C(3x3))
Pin Count & Lead PitchN / e
26 Pins | Pitch e = 0.40 mm (15.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
UART, SPI, I2C, ADC, PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol26 auto-grouped pins
OK
IPC-7351B Land Pattern26 pads · Pitch 0.40mm
OK
IPC-7525 60% Solder PasteEPAD 2.10×2.75mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — CH32M007 (2)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (QFN26C(3x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.90mm · e=0.40mm
Pad Size (W × L)Level B
0.20 × 0.40 mm
Pins / Total PadsTopology
26P / 26Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN26C(3x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH32M007E8U7 (QFN26C(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH32M007E8U7 (QFN26C(3x3))?

Manufactured by WCH, the CH32M007E8U7 is housed in a QFN26C(3x3) package with 26 pins and a 0.40 mm lead pitch. Key pins include: 1 (PC4/A2: Multiplexed I/O & Peripheral Pin PC4/A2 (General)), 2 (PC5/RST/T2C1/CP0: Multiplexed I/O & Peripheral Pin PC5/RST/T2C1/CP0 (General)), 3 (VSS: Ground Reference Pin (VSS)), 4 (PD2/T2C3/CP2/A3: Multiplexed I/O & Peripheral Pin PD2/T2C3/CP2/A3 (General)), 5 (PD1/SWIO/T1C4/OP3: Multiplexed I/O & Peripheral Pin PD1/SWIO/T1C4/OP3 (General)), 6 (PD3/OP2/A4: Multiplexed I/O & Peripheral Pin PD3/OP2/A4 (General)).

What are the IPC-7351B PCB Footprint dimensions for CH32M007E8U7?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH32M007E8U7 (QFN26C(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.40 mm, and 26 copper pads plus a central exposed thermal pad (EPAD) of 2.10 × 2.75 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH32M007E8U7?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH32M007E8U7 (WCH, QFN26C(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (26 pins) & CH32M007 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PC4/A2Digital_IOSignal terminal PC4/A2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PC4/A2. Supported peripheral buses: General.
2PC5/RST/T2C1/CP0Digital_IOSignal terminal PC5/RST/T2C1/CP0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PC5/RST/T2C1/CP0. Supported peripheral buses: General.
3VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
4PD2/T2C3/CP2/A3Digital_IOSignal terminal PD2/T2C3/CP2/A3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD2/T2C3/CP2/A3. Supported peripheral buses: General.
5PD1/SWIO/T1C4/OP3Digital_IOSignal terminal PD1/SWIO/T1C4/OP3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD1/SWIO/T1C4/OP3. Supported peripheral buses: General.
6PD3/OP2/A4Digital_IOSignal terminal PD3/OP2/A4 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD3/OP2/A4. Supported peripheral buses: General.
7PD4/A7Digital_IOSignal terminal PD4/A7 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD4/A7. Supported peripheral buses: General.
8PD5/CN1/A5Digital_IOSignal terminal PD5/CN1/A5 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD5/CN1/A5. Supported peripheral buses: General.
9PD6/A6Digital_IOSignal terminal PD6/A6 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD6/A6. Supported peripheral buses: General.
10PD7/OP1/A+Digital_IOSignal terminal PD7/OP1/A+ (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PD7/OP1/A+. Supported peripheral buses: General.
11PA4/ON2/A-Digital_IOSignal terminal PA4/ON2/A- (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA4/ON2/A-. Supported peripheral buses: General.
12PA5/OO1/AODigital_IOSignal terminal PA5/OO1/AO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA5/OO1/AO. Supported peripheral buses: General.
13VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
14VHREGDigital_IOSignal terminal VHREG (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VHREG. Supported peripheral buses: General.
15VHVDigital_IOSignal terminal VHV (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VHV. Supported peripheral buses: General.
16HO1(PA3/T1C1)Digital_IOSignal terminal HO1(PA3/T1C1) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO1(PA3/T1C1). Supported peripheral buses: General.
17LO1(PA0/T1C1N)Digital_IOSignal terminal LO1(PA0/T1C1N) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO1(PA0/T1C1N). Supported peripheral buses: General.
18HO2(PB0/T1C2)Digital_IOSignal terminal HO2(PB0/T1C2) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO2(PB0/T1C2). Supported peripheral buses: General.
19LO2(PA2/T1C2N)Digital_IOSignal terminal LO2(PA2/T1C2N) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO2(PA2/T1C2N). Supported peripheral buses: General.
20HO3(PB1/T1C3)Digital_IOSignal terminal HO3(PB1/T1C3) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: HO3(PB1/T1C3). Supported peripheral buses: General.
21LO3(PD0/T1C3N)Digital_IOSignal terminal LO3(PD0/T1C3N) (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: LO3(PD0/T1C3N). Supported peripheral buses: General.
22PB3/SWCK/T1BK/T2C2/CP1Digital_IOSignal terminal PB3/SWCK/T1BK/T2C2/CP1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB3/SWCK/T1BK/T2C2/CP1. Supported peripheral buses: General.
23PC0/TX_/CPODigital_IOSignal terminal PC0/TX_/CPO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PC0/TX_/CPO. Supported peripheral buses: General.
24PC1Digital_IOSignal terminal PC1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: I2C_SDA, SPI_NSS_. Supported peripheral buses: SPI, I2C.
25PC2/CN0/SCLDigital_IOSignal terminal PC2/CN0/SCL (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PC2/CN0/SCL. Supported peripheral buses: I2C.
26PA1/ON0/A1Digital_IOSignal terminal PA1/ON0/A1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA1/ON0/A1. Supported peripheral buses: General.