ChipDocs.org
⌘K
2284 PARTSUpload PDF
CH582F (QFN-28-EP(4x4)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH582F

WCHID: C3001175QFN-28-EP(4x4) · 29 Pins · Pitch 0.40mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH582F (QFN-28-EP(4x4))1PA11/X32KO/T2PA10/X32KI/T3VDCID4VSW5VIO33/VDD336PA8/RXD1/AIN7PA9/TMR0/TXD8PB15/TCK/MIS9IO410IO511IO612PB11/UD+/TMR13PB10/UD-/TMR14PB7/TXD0/PWM15PB4/RXD0/PWM29EP28PA12/SCS/PWM27PA13/SCK0/PW26PA14/MOSI/TX25PA15/MISO/RX24PA5/TXD3/AIN23PA4/RXD3/AIN22VDCIA21ANT20VINTA19X32MI18X32MO17PB22/TMR3/RX16IO18Grid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.225.420.315.210.25.10-5.1-10.2-15.2-20.3-25.4mm
2. 2D FOOTPRINT
1234567891011121314151617181920212223242526272829E=4.00mm · Pitch e=0.40mmD=4.00mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 4.00mm × 4.00mm · Pitch: 0.40mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (29/29)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1PA11/X32KO/TMR2I/OMultiplexed I/O & Peripheral Pin PA11/X32KO/TMR2 (General)
2PA10/X32KI/TMR1I/OMultiplexed I/O & Peripheral Pin PA10/X32KI/TMR1 (General)
3VDCIDI/OMultiplexed I/O & Peripheral Pin VDCID (General)
4VSWI/OMultiplexed I/O & Peripheral Pin VSW (General)
5VIO33/VDD33PowerPower Supply Input (VIO33/VDD33 — 3.3V / 5.0V Standard Logic)
6PA8/RXD1/AIN12I/OMultiplexed I/O & Peripheral Pin PA8/RXD1/AIN12 (UART, ADC)
7PA9/TMR0/TXD1/AIN13I/OMultiplexed I/O & Peripheral Pin PA9/TMR0/TXD1/AIN13 (UART, ADC)
8PB15/TCK/MISO_/DTR_I/OMultiplexed I/O & Peripheral Pin PB15/TCK/MISO_/DTR_ (UART, SPI)
9IO4I/OGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5I/OGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11IO6I/OGPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5
12PB11/UD+/TMR2_I/OMultiplexed I/O & Peripheral Pin PB11/UD+/TMR2_ (USB)
13PB10/UD-/TMR1_I/OMultiplexed I/O & Peripheral Pin PB10/UD-/TMR1_ (USB)
14PB7/TXD0/PWM9I/OMultiplexed I/O & Peripheral Pin PB7/TXD0/PWM9 (UART, PWM)
15PB4/RXD0/PWM7I/OMultiplexed I/O & Peripheral Pin PB4/RXD0/PWM7 (UART, PWM)
16IO18I/OGPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17PB22/TMR3/RXD2I/OMultiplexed I/O & Peripheral Pin PB22/TMR3/RXD2 (UART)
18X32MOI/OMultiplexed I/O & Peripheral Pin X32MO (General)
19X32MII/OMultiplexed I/O & Peripheral Pin X32MI (General)
20VINTAPowerPower Supply Input (VINTA — 3.3V / 5.0V Standard Logic)
21ANTI/OMultiplexed I/O & Peripheral Pin ANT (General)
22VDCIAI/OMultiplexed I/O & Peripheral Pin VDCIA (General)
23PA4/RXD3/AIN0I/OMultiplexed I/O & Peripheral Pin PA4/RXD3/AIN0 (UART, ADC)
24PA5/TXD3/AIN1I/OMultiplexed I/O & Peripheral Pin PA5/TXD3/AIN1 (UART, ADC)
25PA15/MISO/RXD0_/AIN5I/OMultiplexed I/O & Peripheral Pin PA15/MISO/RXD0_/AIN5 (UART, SPI, ADC)
26PA14/MOSI/TXD0_/AIN4I/OMultiplexed I/O & Peripheral Pin PA14/MOSI/TXD0_/AIN4 (UART, SPI, ADC)
27PA13/SCK0/PWM5/AIN3I/OMultiplexed I/O & Peripheral Pin PA13/SCK0/PWM5/AIN3 (SPI, ADC, PWM)
28PA12/SCS/PWM4/AIN2I/OMultiplexed I/O & Peripheral Pin PA12/SCS/PWM4/AIN2 (ADC, PWM)
29EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 PA11/X32KO/TMR2
I/O
Multiplexed I/O & Peripheral Pin PA11/X32KO/TMR2 (General)
Design note: Signal terminal PA11/X32KO/TMR2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA11/X32KO/TMR2. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH582F (WCH · QFN-28-EP(4x4))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH582F (QFN-28-EP(4x4)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH582F (QFN-28-EP(4x4)) - 2. Standard Pinout (Top View)
True package pinout (29 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH582F (QFN-28-EP(4x4)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH582F (QFN-28-EP(4x4)) - 4. Package Dimensions (D×E×A)
QFN-28-EP(4x4) · 4.00×4.00mm · Pitch 0.40mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH582F (QFN-28-EP(4x4)) - 5. Recommended Land Pattern
IPC-7351B Footprint (29 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH582F (QFN-28-EP(4x4)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)
Showing 1–9 of 9 uncropped original figures for CH582 / CH583
P3 · p03_fig01EXACT PACKAGE
CH582F (QFN-28-EP(4x4)) — 图1-1 CH582M/CH583M(QFN48)和CH582F(QFN28)封装引脚排列
图1-1 CH582M/CH583M(QFN48)和CH582F(QFN28)封装引脚排列
P111 · p111_fig01EXACT PACKAGE
CH582F (QFN-28-EP(4x4)) — QFN48 5*5mm 0.35mm 13.8mil 方形无引线48 脚 CH583M QFN48 5*5mm 0.35mm 13.8mil 方形无引线48 脚 CH582M QFN28 4*4mm 0.4mm 15.7mil 方形无引线28 脚 CH582F 说明：尺寸标注的单位是mm（毫米），引脚中心间距是标称值，除此之外的尺寸误差不大于±0.2mm。 QFN48_5X5
QFN48 5*5mm 0.35mm 13.8mil 方形无引线48 脚 CH583M QFN48 5*5mm 0.35mm 13.8mil 方形无引线48 脚 CH582M QFN28 4*4mm 0.4mm 15.7mil 方形无引线28 脚 CH582F 说明：尺寸标注的单位是mm（毫米），引脚中心间距是标称值，除此之外的尺寸误差不大于±0.2mm。 QFN48_5X5
P1 · p01_fig01288×163px
CH582F (QFN-28-EP(4x4)) — CH583 是集成BLE 无线通讯的RISC-V MCU 微控制器（SoC）。片上集成2Mbps 低功耗蓝牙BLE 通 讯模块、2 个全速USB 主机和设备控制器及收发器、2 个SPI、4 个串口、14 路ADC、触摸按键检测模 块、RTC 等丰富的外设资源。 功能
CH583 是集成BLE 无线通讯的RISC-V MCU 微控制器（SoC）。片上集成2Mbps 低功耗蓝牙BLE 通 讯模块、2 个全速USB 主机和设备控制器及收发器、2 个SPI、4 个串口、14 路ADC、触摸按键检测模 块、RTC 等丰富的外设资源。 功能
P3 · p03_fig01P3
CH582F (QFN-28-EP(4x4)) — Datasheet Page 3 (p03_fig01)
Datasheet Page 3 (p03_fig01)
P67 · p67_fig011713×2650px
CH582F (QFN-28-EP(4x4)) — V1.9 67 WCH
V1.9 67 WCH
P68 · p68_fig011713×2645px
CH582F (QFN-28-EP(4x4)) — V1.9 68 WCH
V1.9 68 WCH
P69 · p69_fig011713×802px
CH582F (QFN-28-EP(4x4)) — CH583/CH582 数据手册 https://wch.cn
CH583/CH582 数据手册 https://wch.cn
P69 · p69_fig021713×989px
CH582F (QFN-28-EP(4x4)) — SPI 支持模式0 和模式3 两种传输格式，通过设置R8_SPIx_CTRL_MOD 的RB_SPI_MST_SCK_MOD 进 行选择。总是在SCK 上升沿采样串行数据输入，在下降沿输出串行数据。
SPI 支持模式0 和模式3 两种传输格式，通过设置R8_SPIx_CTRL_MOD 的RB_SPI_MST_SCK_MOD 进 行选择。总是在SCK 上升沿采样串行数据输入，在下降沿输出串行数据。
P110 · p110_fig011345×1019px
CH582F (QFN-28-EP(4x4)) — 封装形式 塑体宽度 引脚间距 封装说明 订货型号 [-]
封装形式 塑体宽度 引脚间距 封装说明 订货型号 [-]

Technical Specifications & Part Details (CH582F)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH582F (QFN-28-EP(4x4)) is a 28-pin standard electronic & interconnect component featuring a 4.00 × 4.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Bluetooth / BLE, USB, SPI, I2C, ADC, PWM, UART interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
20MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.00 × 4.00 × 0.85 mm (A1=0.03 mm)
Package family: QFN (QFN-28-EP(4x4))
Pin Count & Lead PitchN / e
28 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Bluetooth / BLE, USB, SPI, I2C, ADC, PWM, UART
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol29 auto-grouped pins
OK
IPC-7351B Land Pattern29 pads · Pitch 0.40mm
OK
IPC-7525 60% Solder PasteEPAD 2.80×2.80mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — CH582 / CH583 (4)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (QFN-28-EP(4x4))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.00 × 4.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.40mm
Pad Size (W × L)Level B
0.28 × 0.80 mm
Pins / Total PadsTopology
29P / 29Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-28-EP(4x4)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH582F (QFN-28-EP(4x4))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH582F (QFN-28-EP(4x4))?

Manufactured by WCH, the CH582F is housed in a QFN-28-EP(4x4) package with 29 pins and a 0.40 mm lead pitch. Key pins include: 1 (PA11/X32KO/TMR2: Multiplexed I/O & Peripheral Pin PA11/X32KO/TMR2 (General)), 2 (PA10/X32KI/TMR1: Multiplexed I/O & Peripheral Pin PA10/X32KI/TMR1 (General)), 3 (VDCID: Multiplexed I/O & Peripheral Pin VDCID (General)), 4 (VSW: Multiplexed I/O & Peripheral Pin VSW (General)), 5 (VIO33/VDD33: Power Supply Input (VIO33/VDD33 — 3.3V / 5.0V Standard Logic)), 6 (PA8/RXD1/AIN12: Multiplexed I/O & Peripheral Pin PA8/RXD1/AIN12 (UART, ADC)).

What are the IPC-7351B PCB Footprint dimensions for CH582F?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH582F (QFN-28-EP(4x4)) has a nominal body envelope of 4.00 × 4.00 mm, pitch e = 0.40 mm, and 29 copper pads plus a central exposed thermal pad (EPAD) of 2.80 × 2.80 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH582F?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH582F (WCH, QFN-28-EP(4x4)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (29 pins) & CH582 / CH583 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1PA11/X32KO/TMR2Digital_IOSignal terminal PA11/X32KO/TMR2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA11/X32KO/TMR2. Supported peripheral buses: General.
2PA10/X32KI/TMR1Digital_IOSignal terminal PA10/X32KI/TMR1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA10/X32KI/TMR1. Supported peripheral buses: General.
3VDCIDDigital_IOSignal terminal VDCID (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VDCID. Supported peripheral buses: General.
4VSWDigital_IOSignal terminal VSW (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VSW. Supported peripheral buses: General.
5VIO33/VDD33Power_InPrimary positive power supply input (VIO33/VDD33) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
6PA8/RXD1/AIN12Digital_IOSignal terminal PA8/RXD1/AIN12 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA8/RXD1/AIN12. Supported peripheral buses: UART, ADC.
7PA9/TMR0/TXD1/AIN13Digital_IOSignal terminal PA9/TMR0/TXD1/AIN13 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA9/TMR0/TXD1/AIN13. Supported peripheral buses: UART, ADC.
8PB15/TCK/MISO_/DTR_Digital_IOSignal terminal PB15/TCK/MISO_/DTR_ (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB15/TCK/MISO_/DTR_. Supported peripheral buses: UART, SPI.
9IO4Digital_IOGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5Digital_IOGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11IO6Digital_IOGPIO6 / RTC_GPIO6 / TOUCH6 / ADC1_CH5
12PB11/UD+/TMR2_Digital_IOSignal terminal PB11/UD+/TMR2_ (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB11/UD+/TMR2_. Supported peripheral buses: USB.
13PB10/UD-/TMR1_Digital_IOSignal terminal PB10/UD-/TMR1_ (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB10/UD-/TMR1_. Supported peripheral buses: USB.
14PB7/TXD0/PWM9Digital_IOSignal terminal PB7/TXD0/PWM9 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB7/TXD0/PWM9. Supported peripheral buses: UART, PWM.
15PB4/RXD0/PWM7Digital_IOSignal terminal PB4/RXD0/PWM7 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB4/RXD0/PWM7. Supported peripheral buses: UART, PWM.
16IO18Digital_IOGPIO18 / RTC_GPIO18 / U1RXD / ADC2_CH7 / CLK_OUT3
17PB22/TMR3/RXD2Digital_IOSignal terminal PB22/TMR3/RXD2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PB22/TMR3/RXD2. Supported peripheral buses: UART.
18X32MODigital_IOSignal terminal X32MO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: X32MO. Supported peripheral buses: General.
19X32MIDigital_IOSignal terminal X32MI (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: X32MI. Supported peripheral buses: General.
20VINTAPower_InPrimary positive power supply input (VINTA) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
21ANTRF_50OhmSignal terminal ANT (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: ANT. Supported peripheral buses: General.
22VDCIADigital_IOSignal terminal VDCIA (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VDCIA. Supported peripheral buses: General.
23PA4/RXD3/AIN0Digital_IOSignal terminal PA4/RXD3/AIN0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA4/RXD3/AIN0. Supported peripheral buses: UART, ADC.
24PA5/TXD3/AIN1Digital_IOSignal terminal PA5/TXD3/AIN1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA5/TXD3/AIN1. Supported peripheral buses: UART, ADC.
25PA15/MISO/RXD0_/AIN5Digital_IOSignal terminal PA15/MISO/RXD0_/AIN5 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA15/MISO/RXD0_/AIN5. Supported peripheral buses: UART, SPI, ADC.
26PA14/MOSI/TXD0_/AIN4Digital_IOSignal terminal PA14/MOSI/TXD0_/AIN4 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA14/MOSI/TXD0_/AIN4. Supported peripheral buses: UART, SPI, ADC.
27PA13/SCK0/PWM5/AIN3Digital_IOSignal terminal PA13/SCK0/PWM5/AIN3 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA13/SCK0/PWM5/AIN3. Supported peripheral buses: SPI, ADC, PWM.
28PA12/SCS/PWM4/AIN2AnalogSignal terminal PA12/SCS/PWM4/AIN2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PA12/SCS/PWM4/AIN2. Supported peripheral buses: ADC, PWM.
29EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
ExplorePartsPackagesMFRsUpload