QFN-48-EP(5x5) · 49P预览PinoutFootprint尺寸3DESP32-S0WDC473011ESPRESSIF·QFN-48-EP(5x5)READY49P5.0×5.0×0.85mmP=0.35mmWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
- · 99P预览PinoutFootprint尺寸3DESP32-S31-WROOM-3-N16R16VC55371223ESPRESSIF·-READY99P30.0×22.0×3.10mmP=0.85mmWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
Through Hole,Right Angle,P=2mm · 10P预览PinoutFootprint尺寸3DHX PM2.0-1x10P WC H6.35C46061742hanxia·Through Hole,Right Angle,P=2mmREADY10P22.0×6.3×6.35mmP=2mm系列 HX PM2.0 (6)标准电子与连接器元件
SOP-7 · 7P预览PinoutFootprint尺寸3DKP1063MSPAC2692504Kiwi Instruments·SOP-7READY7P4.9×3.9×1.50mmP=1.27mm标准电子与连接器元件
SOP-7 · 7P预览PinoutFootprint尺寸3DKP1264FMSPAC2692375Kiwi Instruments·SOP-7READY7P4.9×3.9×1.50mmP=1.27mm标准电子与连接器元件
SOIC-8 · 8P预览PinoutFootprint尺寸3DKP1466SPAC2692525Kiwi Instruments·SOIC-8READY8P4.9×3.9×1.75mmP=1.27mm标准电子与连接器元件
ASOP-7-150mil · 7P预览PinoutFootprint尺寸3DKP311AWPAC554034Kiwi Instruments·ASOP-7-150milREADY7P6.2×3.9×1.75mmP=1.27mm标准电子与连接器元件
TQFP-64(10x10) · 64P预览PinoutFootprint尺寸3DLAN8187I-JTC184729MICROCHIP·TQFP-64(10x10)READY64P10.0×10.0×1.20mmP=0.5mm3.3V to 1.8V标准电子与连接器元件
TFBGA · 48P预览PinoutFootprint尺寸3DMX29LV160DBXBI-70GTRC2803170MXIC·TFBGAREADY48P4.0×6.0×1.12mmP=0.5mm2.7 V to 3.6 V系列 MX29LV160DBX / MX29LV160DTX (2)标准电子与连接器元件
WFBGA-48 · 48P预览PinoutFootprint尺寸3DMX29LV160DTXHI-70GC2803176MXIC·WFBGA-48READY48P4.0×6.0×1.35mmP=0.5mm2.7 V to 3.6 V标准电子与连接器元件
WFBGA-48 · 48P预览PinoutFootprint尺寸3DMX29SL802CBXHI-90GC2802743MXIC·WFBGA-48READY48P4.0×6.0×1.35mmP=0.5mm系列 MX29SL802CBX / MX29SL802CTX (2)标准电子与连接器元件
WFBGA-48 · 48P预览PinoutFootprint尺寸3DMX29SL802CTXHI-90GC2802744MXIC·WFBGA-48READY48P4.0×6.0×1.35mmP=0.5mm标准电子与连接器元件
SOP-16-300mil · 16P预览PinoutFootprint尺寸3DPCF8574TC398075HGSEMI·SOP-16-300milREADY16P10.3×7.5×2.10mmP=1.27mm2.5 to 6 V标准电子与连接器元件
DIP-28 · 28P预览PinoutFootprint尺寸3DPIC16F1938-I/SPC185807MICROCHIP·DIP-28READY28P35.0×6.3×4.20mmP=2.54mm1.8V-5.5V标准电子与连接器元件
TSSOP-14 · 14P预览PinoutFootprint尺寸3DPIC16LF1825-I/STC50134MICROCHIP·TSSOP-14READY14P5.0×4.4×1.00mmP=0.65mm标准电子与连接器元件