3899 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3904 Bauteilen · Seite 72/244)

Zeige 1137–1152 von 3904 Bauteilen

SOIC-8-150mil · 8P

ATA663254-GAQW-VAO (SOIC-8-150mil) - 3D-Modell (SOIC-8-150mil)

ATA663254-GAQW-VAO

MICROCHIP·SOIC-8-150mil

READY

8P4.9×3.9×1.75mmP=1.27mm5V to 28V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-48(7x7) · 48P

MAX3674ECM2T (TQFP-48(7x7)) - 3D-Modell (TQFP-48(7x7))

MAX3674ECM2T

MICROCHIP·TQFP-48(7x7)

READY

48P7.0×7.0×1.20mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

TO-220-5 · 5P

TC33372VAV (TO-220-5) - 3D-Modell (TO-220-5)

TC33372VAV

MICROCHIP·TO-220-5

READY

5P10.2×4.5×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-24(4x4) · 25P

SM802124UMG-TR (QFN-24(4x4)) - 3D-Modell (QFN-24(4x4))

SM802124UMG-TR

MICROCHIP·QFN-24(4x4)

READY

25P4.0×4.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY10E142JC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY10E142JC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TSOP-32 · 32P

AT27C020-90TI (TSOP-32) - 3D-Modell (TSOP-32)

AT27C020-90TI

MICROCHIP·TSOP-32

READY

32P8.0×18.4×2.45mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-44(16.6x16.6) · 44P

AT27C4096-70JI (PLCC-44(16.6x16.6)) - 3D-Modell (PLCC-44(16.6x16.6))

AT27C4096-70JI

MICROCHIP·PLCC-44(16.6x16.6)

READY

44P16.6×16.6×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PLCC-20_L9.0-W9.0-P1.27-LS9.9-T · 20P

C17384612 (PLCC-20_L9.0-W9.0-P1.27-LS9.9-T) - 3D-Modell (PLCC-20_L9.0-W9.0-P1.27-LS9.9-T)

C17384612

Generic·PLCC-20_L9.0-W9.0-P1.27-LS9.9-T

READY

20P9.0×9.0×1.15mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20 · 20P

ATTINY826-XUR (SSOP-20) - 3D-Modell (SSOP-20)

ATTINY826-XUR

MICROCHIP·SSOP-20

READY

20P7.2×5.3×1.85mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

VSOP-40 · 40P

AT27C4096-12VC (VSOP-40) - 3D-Modell (VSOP-40)

AT27C4096-12VC

MICROCHIP·VSOP-40

READY

40P12.4×10.0×2.45mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

- · 8P

FDC9216BP (-) - 3D-Modell (-)

FDC9216BP

READY

8P9.6×6.3×4.20mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

TO-264 · 3P

APT70GR120L (TO-264) - 3D-Modell (TO-264)

APT70GR120L

MICROCHIP·TO-264

READY

3P20.0×5.0×2.00mm

Standard-Elektronik- & Steckverbinderbauteil

TO-204AA(TO-3) · 4P

JAN2N6383 (TO-204AA(TO-3)) - 3D-Modell (TO-204AA(TO-3))

JAN2N6383

MICROCHIP·TO-204AA(TO-3)

READY

4P39.4×26.7×8.50mm

Standard-Elektronik- & Steckverbinderbauteil

TO-204AA(TO-3) · 4P

2N6384 (TO-204AA(TO-3)) - 3D-Modell (TO-204AA(TO-3))

2N6384

MICROCHIP·TO-204AA(TO-3)

READY

4P39.4×26.7×8.50mm

Standard-Elektronik- & Steckverbinderbauteil

MAP-8(3x4.9) · 9P

AT25010AY1-10YI-1.8 (MAP-8(3x4.9)) - 3D-Modell (MAP-8(3x4.9))

AT25010AY1-10YI-1.8

MICROCHIP·MAP-8(3x4.9)

READY

9P4.9×3.0×1.00mmP=0.65mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

AT25020AN-10SI-2.7 (SOIC-8) - 3D-Modell (SOIC-8)

AT25020AN-10SI-2.7

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

Entdecken Bauteile Gehäuse Hersteller Upload