3712 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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QFN-16-EP(4x4) · 17P

MCP4261-104E/ML (QFN-16-EP(4x4)) - 3D-Modell (QFN-16-EP(4x4))

MCP4261-104E/ML

MICROCHIP·QFN-16-EP(4x4)

READY

17P4.0×4.0×0.85mmP=0.5mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

25LC160B-I/MS (MSOP-8) - 3D-Modell (MSOP-8)

25LC160B-I/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

MCP3422A0-E/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

MCP3422A0-E/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.85mmP=0.5mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MCP4161-103E/SN (SOIC-8) - 3D-Modell (SOIC-8)

MCP4161-103E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DIP-28 · 28P

PIC16F1938-I/SP (DIP-28) - 3D-Modell (DIP-28)

PIC16F1938-I/SP

MICROCHIP·DIP-28

READY

28P35.0×6.3×4.20mmP=2.54mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18LF2520-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18LF2520-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-18 · 18P

PIC16F84-04/P (PDIP-18) - 3D-Modell (PDIP-18)

PIC16F84-04/P

MICROCHIP·PDIP-18

READY

18P22.3×6.3×3.50mmP=2.54mm2.0V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64-EP(9x9) · 65P

AT32UC3B0128-Z2UT (QFN-64-EP(9x9)) - 3D-Modell (QFN-64-EP(9x9))

AT32UC3B0128-Z2UT

MICROCHIP·QFN-64-EP(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm1.8V-3.3V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(5x6) · 9P

TC4420VMF (DFN-8-EP(5x6)) - 3D-Modell (DFN-8-EP(5x6))

TC4420VMF

MICROCHIP·DFN-8-EP(5x6)

READY

9P6.0×5.0×1.00mmP=1.27mm4.5V to 18V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-40 · 40P

PIC16C65A-20I/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC16C65A-20I/P

MICROCHIP·PDIP-40

READY

40P48.3×14.1×3.85mmP=2.54mm2.5V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-16 · 16P

PL123S-09SC (SOIC-16) - 3D-Modell (SOIC-16)

PL123S-09SC

MICROCHIP·SOIC-16

READY

16P9.9×3.9×1.75mmP=1.27mm0.5V to 4.6V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-100(12x12) · 100P

PIC32MZ1024EFG100-I/PT (TQFP-100(12x12)) - 3D-Modell (TQFP-100(12x12))

PIC32MZ1024EFG100-I/PT

MICROCHIP·TQFP-100(12x12)

READY

100P12.0×12.0×1.20mmP=0.4mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

TCN75-5.0MOA (SOIC-8) - 3D-Modell (SOIC-8)

TCN75-5.0MOA

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MCP4011-503E/SN (SOIC-8) - 3D-Modell (SOIC-8)

MCP4011-503E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-18-300mil · 18P

PIC16F628-04/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

PIC16F628-04/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm3.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

BGA-324(19x19) · 324P

VSC7436XMT (BGA-324(19x19)) - 3D-Modell (BGA-324(19x19))

VSC7436XMT

MICROCHIP·BGA-324(19x19)

READY

324P19.0×19.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

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