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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3804 Bauteilen · Seite 221/238)

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SOT-23-6 · 6P

DW01A (SOT-23-6) - 3D-Modell (SOT-23-6)

DW01A

PJSEMI·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

HT7333-A (TO-92-3) - 3D-Modell (TO-92-3)

HT7333-A

HOLTEK·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm4.5 V to 40 V

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

XL4015E1 (TO-263-5) - 3D-Modell (TO-263-5)

XL4015E1

XLSEMI·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm8V to 36V

Standard-Elektronik- & Steckverbinderbauteil

SOP-16-300mil · 16P

PCF8574T (SOP-16-300mil) - 3D-Modell (SOP-16-300mil)

PCF8574T

HGSEMI·SOP-16-300mil

READY

16P10.3×7.5×2.10mmP=1.27mm2.5 to 6 V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL · 8P

C23069945 (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL) - 3D-Modell (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL)

C23069945

Generic·SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

DS1307ZN-778/HG (DIP-8) - 3D-Modell (DIP-8)

DS1307ZN-778/HG

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-20 · 20P

STM32G030F6P6TR (TSSOP-20) - 3D-Modell (TSSOP-20)

STM32G030F6P6TR

READY

20P6.5×4.4×1.20mmP=0.65mm2.0 V to 3.6 V

Eingebetteter Mikrocontroller (MCU)

LQFP-48(7x7) · 48P

GD32F103C8T6 (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

GD32F103C8T6

GigaDevice Semicon Beijing·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

W25Q64JVSSIQ (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

W25Q64JVSSIQ

Winbond·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(5x5) · 29P

CP2102N-A02-GQFN28R (QFN-28-EP(5x5)) - 3D-Modell (QFN-28-EP(5x5))

CP2102N-A02-GQFN28R

SILICON LABS·QFN-28-EP(5x5)

READY

29P5.0×5.0×0.75mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LQFP-100(14x14) · 100P

STM32F103VET6 (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

STM32F103VET6

ST·LQFP-100(14x14)

READY

100P13.9×13.9×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

SSOP-28-208mil · 28P

FT232RL-REEL (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

FT232RL-REEL

FTDI·SSOP-28-208mil

READY

28P10.2×5.3×2.00mmP=0.65mm3.3 - 5.25 V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-18-300mil · 18P

MCP2515-I/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

MCP2515-I/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm2.7V – 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

SN65HVD230DR (SOIC-8) - 3D-Modell (SOIC-8)

SN65HVD230DR

READY

8P4.9×3.9×1.75mmP=1.27mm3 V to 6 V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

SY8089AAAC (SOT-23-5) - 3D-Modell (SOT-23-5)

SY8089AAAC

Silergy·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

MT3608 (SOT-23-6) - 3D-Modell (SOT-23-6)

MT3608

XI'AN Aerosemi Tech·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm2V to 24V

Standard-Elektronik- & Steckverbinderbauteil

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