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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SSOP-20-208mil · 20P

CH558T (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

CH558T

WCH·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-16(3x3) · 17P

CH282P (QFN-16(3x3)) - 3D-Modell (QFN-16(3x3))

CH282P

WCH(南京沁恒)·QFN-16(3x3)

READY

17P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

CH372 (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

CH372

WCH·SSOP-20-208mil

READY

20P7.2×5.3×2.00mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20 · 20P

CH372B (SSOP-20) - 3D-Modell (SSOP-20)

CH372B

READY

20P7.2×5.3×1.85mmP=0.65mm3.3V to 5V

Standard-Elektronik- & Steckverbinderbauteil

SOP-28-300mil · 28P

CH340S (SOP-28-300mil) - 3D-Modell (SOP-28-300mil)

CH340S

WCH·SOP-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm3.3V to 5V

Schnittstellen-Bridge & Takt-/Timer-IC

- · 100P

CH32V307VCT6+CH32V307V-EVT-R1 (-) - 3D-Modell (-)

CH32V307VCT6+CH32V307V-EVT-R1

READY

100P14.0×14.0×1.40mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

Through Hole,Right Angle,P=2mm · 10P

HX PM2.0-2x5P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x5P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

10P10.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole · 3P

H3-B1-1D00S (Through Hole) - 3D-Modell (Through Hole)

H3-B1-1D00S

Kinghor·Through Hole

READY

3P18.5×8.1×9.50mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,Right Angle,P=2mm · 14P

HX PM2.0-2x7P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x7P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

14P14.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,Right Angle,P=2mm · 6P

HX PM2.0-1x6P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x6P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

6P12.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,Right Angle,P=2mm · 7P

HX PM2.0-1x7P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x7P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

7P14.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,7.5x4.7mm · 4P

HX-ESE24SH1-WC HB (Through Hole,7.5x4.7mm) - 3D-Modell (Through Hole,7.5x4.7mm)

HX-ESE24SH1-WC HB

hanxia·Through Hole,7.5x4.7mm

READY

4P7.9×8.6×4.20mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-41P · 41P

ESP32-S2-SOLO-2-N4R2 (SMD-41P) - 3D-Modell (SMD-41P)

ESP32-S2-SOLO-2-N4R2

ESPRESSIF·SMD-41P

READY

41P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-38P · 39P

ESP32-WROOM-32E (4MB HIGH TEMP) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E (4MB HIGH TEMP)

ESPRESSIF(乐鑫)·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,16.6x13.2mm · 53P

ESP8684-MINI-1-H2X (SMD,16.6x13.2mm) - 3D-Modell (SMD,16.6x13.2mm)

ESP8684-MINI-1-H2X

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,13.2x12.5mm · 61P

ESP8684-MINI-1U-H4 (SMD,13.2x12.5mm) - 3D-Modell (SMD,13.2x12.5mm)

ESP8684-MINI-1U-H4

ESPRESSIF·SMD,13.2x12.5mm

READY

61P13.2×12.5×2.40mmP=0.8mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

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