MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC23356YFT-TR

MICROCHIPPTQFN-16(2.5x2.5) · 11 Pins · Pitch 0.50mmDISCREPANCY REVIEW REQUIRED5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC23356YFT-TR (PTQFN-16(2.5x2.5))1SW3PGND4PV IN6SV IN7SCL8SDA13PGND12A GND11V OUT10PG9ENGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
413111097681213E=2.50mm · Pitch e=0.50mmD=2.50mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.50mm × 2.50mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1SWI/OMultiplexed I/O & Peripheral Pin SW (General)
3PGNDGNDGround Reference Pin (PGND)
4PV INI/OMultiplexed I/O & Peripheral Pin PV IN (General)
6SV INI/OMultiplexed I/O & Peripheral Pin SV IN (General)
7SCLI/OMultiplexed I/O & Peripheral Pin SCL (I2C)
8SDAI/OMultiplexed I/O & Peripheral Pin SDA (I2C)
9ENISystem Enable & Hardware Reset (EN)
10PGI/OMultiplexed I/O & Peripheral Pin PG (General)
11V OUTI/OMultiplexed I/O & Peripheral Pin V OUT (General)
12A GNDGNDGround Reference Pin (A GND)
13PGNDGNDGround Reference Pin (PGND)
PIN 1 SW
I/O
Multiplexed I/O & Peripheral Pin SW (General)
Design note: SwitchNode
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 12 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 2. Standard Pinout (Top View)
True package pinout (11 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 4. Package Dimensions (D×E×A)
PTQFN-16(2.5x2.5) · 2.50×2.50mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 5. Recommended Land Pattern
IPC-7351B Footprint (11 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (12 figures · Page 1/1)
Showing 1–12 of 12 uncropped original figures for MIC23356
P1 · p01_fig01376×200px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — 3A, Step-Down Converter with HyperLight Load™ and I2C Interface
3A, Step-Down Converter with HyperLight Load™ and I2C Interface
P2 · p02_fig011518×965px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — Typical Application
Typical Application
P2 · p02_fig021182×880px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — Ordering Information
Ordering Information
P2 · p02_fig02P2
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — Datasheet Page 2 (p02_fig02)
Datasheet Page 2 (p02_fig02)
P3 · p03_fig011777×1586px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — MIC23356
MIC23356
P19 · p19_fig01867×797px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — EQUATION 5-3:
EQUATION 5-3:
P19 · p19_fig02867×292px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — The RMS inductor current is used to calculate the I2R losses in the inductor.
The RMS inductor current is used to calculate the I2R losses in the inductor.
P30 · p30_fig011399×863px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — 16-Lead FTQFN 2.5 mm x 2.5 mm Example | 23356 | 7256 WNNN | Part Number Marking Marking Code | MIC23356YFT XXXX 23356 | MIC23356-FAYFT XXXX 356FA | MIC23356-HAYFT XXXX 356HA | MIC23356-SAYFT XXXX 356SA
16-Lead FTQFN 2.5 mm x 2.5 mm Example | 23356 | 7256 WNNN | Part Number Marking Marking Code | MIC23356YFT XXXX 23356 | MIC23356-FAYFT XXXX 356FA | MIC23356-HAYFT XXXX 356HA | MIC23356-SAYFT XXXX 356SA
P30 · p30_fig02412×248px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — 16-Lead FTQFN 2.5 mm x 2.5 mm Example
16-Lead FTQFN 2.5 mm x 2.5 mm Example
P30 · p30_fig03408×246px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — 16-Lead FTQFN 2.5 mm x 2.5 mm Example
16-Lead FTQFN 2.5 mm x 2.5 mm Example
P30 · p30_fig041361×615px
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) —  2019 Microchip Technology Inc. DS20006130A-page 30
 2019 Microchip Technology Inc. DS20006130A-page 30
P30 · p30_fig02P30
MIC23356YFT-TR (PTQFN-16(2.5x2.5)) — Datasheet Page 30 (p30_fig02)
Datasheet Page 30 (p30_fig02)

Technical Specifications & Part Details (MIC23356YFT-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC23356YFT-TR (PTQFN-16(2.5x2.5)) is a 10-pin standard electronic & interconnect component featuring a 2.50 × 2.50 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.4V to 5.5V supply operation across -40°C to +125°C with integrated I2C, DAC interfaces.
Operating Supply VoltageV_CC / V_DD
2.4V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
3.4 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.50 × 2.50 × 0.85 mm (A1=0.03 mm)
Package family: QFN (PTQFN-16(2.5x2.5))
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
I2C, DAC
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol11 auto-grouped pins
OK
IPC-7351B Land Pattern11 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (PTQFN-16(2.5x2.5))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.50 × 2.50 mm
Height (A) & Pitch (e)IPC-7351B
A=0.85mm · e=0.50mm
Pad Size (W × L)Level B
0.25 × 0.50 mm
Pins / Total PadsTopology
11P / 11Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
PTQFN-16(2.5x2.5)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC23356YFT-TR (PTQFN-16(2.5x2.5))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC23356YFT-TR (PTQFN-16(2.5x2.5))?

Manufactured by MICROCHIP, the MIC23356YFT-TR is housed in a PTQFN-16(2.5x2.5) package with 11 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.4V to 5.5V. Key pins include: 1 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 3 (PGND: Ground Reference Pin (PGND)), 4 (PV IN: Multiplexed I/O & Peripheral Pin PV IN (General)), 6 (SV IN: Multiplexed I/O & Peripheral Pin SV IN (General)), 7 (SCL: Multiplexed I/O & Peripheral Pin SCL (I2C)), 8 (SDA: Multiplexed I/O & Peripheral Pin SDA (I2C)).

What are the IPC-7351B PCB Footprint dimensions for MIC23356YFT-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC23356YFT-TR (PTQFN-16(2.5x2.5)) has a nominal body envelope of 2.50 × 2.50 mm, pitch e = 0.50 mm, and 11 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC23356YFT-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC23356YFT-TR (MICROCHIP, PTQFN-16(2.5x2.5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & MIC23356 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1SWDigital_IOSignal terminal SW (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
3PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
4PV INDigital_IOSignal terminal PV IN (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: PV IN. Supported peripheral buses: General.
6SV INDigital_IOSignal terminal SV IN (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: SV IN. Supported peripheral buses: General.
7SCLDigital_IOSignal terminal SCL (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: SCL. Supported peripheral buses: I2C.
8SDADigital_IOSignal terminal SDA (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: SDA. Supported peripheral buses: I2C.
9ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
10PGOpen_DrainSignal terminal PG (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: PG. Supported peripheral buses: General.
11V OUTDigital_IOSignal terminal V OUT (I/O, 2.4V to 5.5V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
12A GNDGND0V electrical ground return terminal (A GND) for internal core logic, I/O drivers, and analog sub-blocks.
13PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.