MCP1727-3302E/MF (DFN-8-EP(3x3)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MCP1727-3302E/MF (DFN-8-EP(3x3))?

Manufactured by MICROCHIP, the MCP1727-3302E/MF is housed in a DFN-8-EP(3x3) package with 9 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.3V to 6.0V. Key pins include: 1 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 2 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 3 (SHDN: Multiplexed I/O & Peripheral Pin SHDN (General)), 4 (GND: Ground Reference Pin (GND)), 5 (PWRGD: Multiplexed I/O & Peripheral Pin PWRGD (General)), 6 (C DELAY: Multiplexed I/O & Peripheral Pin C DELAY (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MCP1727-3302E/MF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1727-3302E/MF (DFN-8-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.25 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1727-3302E/MF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1727-3302E/MF (MICROCHIP, DFN-8-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	V IN	I/O	Multiplexed I/O & Peripheral Pin V IN (General)
2	V IN	I/O	Multiplexed I/O & Peripheral Pin V IN (General)
3	SHDN	I/O	Multiplexed I/O & Peripheral Pin SHDN (General)
4	GND	GND	Ground Reference Pin (GND)
5	PWRGD	I/O	Multiplexed I/O & Peripheral Pin PWRGD (General)
6	C DELAY	I/O	Multiplexed I/O & Peripheral Pin C DELAY (General)
7	Sense	I/O	Multiplexed I/O & Peripheral Pin Sense (General)
8	V OUT	I/O	Multiplexed I/O & Peripheral Pin V OUT (General)
9	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 V IN

I/O

Multiplexed I/O & Peripheral Pin V IN (General)

Design note: InputVoltageSupply

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 13 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 2. Standard Pinout (Top View)

True package pinout (9 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 4. Package Dimensions (D×E×A)

DFN-8-EP(3x3) · 3.00×3.00mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 5. Recommended Land Pattern

IPC-7351B Footprint (9 Pads)Expand ›

6. Application SchematicSCHEMATIC

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (13 figures · Page 1/2)

Showing 1–12 of 13 uncropped original figures for MCP1727

P20 · p20_fig01EXACT PACKAGE

5.1 Typical Application

P1 · p01_fig011777×645px

MCP1727-3302E/MF (DFN-8-EP(3x3)) — © 2007 Microchip Technology Inc. DS21999B-page 1 | Package Types | VIN VIN | SHDN | GND PWRGD | CDELAY | Sense | VOUT VIN VIN | SHDN | GND PWRGD | CDELAY | ADJ | VOUT | Adjustable (SOIC-8) Fixed (SOIC-8) | VIN | VIN | SHDN | GND PWRGD | CDE

P2 · p02_fig011777×1579px

MCP1727

P16 · p16_fig011450×884px

FIGURE 4-1: Typical adjustable output voltage application circuit.

P20 · p20_fig021777×1200px

FIGURE 5-1: Typical Application Circuit. 5.1.1 APPLICATION CONDITIONS

P20 · p20_fig01P20

Datasheet Page 20 (p20_fig01)

P21 · p21_fig011755×1391px

5.3 Typical Application

P23 · p23_fig011777×888px

8-Lead SOIC (150 mil) Example:

P23 · p23_fig021451×494px

P23 · p23_fig031777×785px

MCP1727-3302E/MF (DFN-8-EP(3x3)) — © 2007 Microchip Technology Inc. DS21999B-page 23 | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spec

© 2007 Microchip Technology Inc. DS21999B-page 23 | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spec

P23 · p23_fig01P23

Datasheet Page 23 (p23_fig01)

P24 · p24_fig011777×2481px

MCP1727-3302E/MF (DFN-8-EP(3x3)) — DS21999B-page 24 © 2007 Microchip Technology Inc. | 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www

DS21999B-page 24 © 2007 Microchip Technology Inc. | 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www

Page 1 / 2 (13 extracted figures)

Technical Specifications & Part Details (MCP1727-3302E/MF)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MCP1727-3302E/MF (DFN-8-EP(3x3)) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.90 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.3V to 6.0V supply operation across -65°C to +150°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.3V to 6.0V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-65°C to +150°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1 kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

120 µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 0.90 mm (A1=0.03 mm)

Package family: DFN (DFN-8-EP(3x3))

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol9 auto-grouped pins

IPC-7351B Land Pattern9 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteEPAD 2.25×1.50mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DFN-8-EP(3x3))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.90mm · e=0.65mm

Pad Size (W × L)Level B

0.28 × 0.63 mm

Pins / Total PadsTopology

9P / 9Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit DFN-8-EP(3x3)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP1727-3302E/MF (DFN-8-EP(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP1727-3302E/MF (DFN-8-EP(3x3))?

Manufactured by MICROCHIP, the MCP1727-3302E/MF is housed in a DFN-8-EP(3x3) package with 9 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.3V to 6.0V. Key pins include: 1 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 2 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 3 (SHDN: Multiplexed I/O & Peripheral Pin SHDN (General)), 4 (GND: Ground Reference Pin (GND)), 5 (PWRGD: Multiplexed I/O & Peripheral Pin PWRGD (General)), 6 (C DELAY: Multiplexed I/O & Peripheral Pin C DELAY (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP1727-3302E/MF?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1727-3302E/MF (DFN-8-EP(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 2.25 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1727-3302E/MF?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1727-3302E/MF (MICROCHIP, DFN-8-EP(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & MCP1727 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	V IN	Digital_IO	Signal terminal V IN (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
2	V IN	Digital_IO	Signal terminal V IN (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
3	SHDN	Digital_IO	Signal terminal SHDN (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: SHDN. Supported peripheral buses: General.
4	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
5	PWRGD	Open_Drain	Signal terminal PWRGD (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: PWRGD. Supported peripheral buses: General.
6	C DELAY	Digital_IO	Signal terminal C DELAY (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: C DELAY. Supported peripheral buses: General.
7	Sense	Digital_IO	Signal terminal Sense (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: Sense. Supported peripheral buses: General.
8	V OUT	Digital_IO	Signal terminal V OUT (I/O, 2.3V to 6.0V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.
9	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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