MCP1790-3302E/DB (SOT-223-3) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MCP1790-3302E/DB (SOT-223-3)?

Manufactured by MICROCHIP, the MCP1790-3302E/DB is housed in a SOT-223-3 package with 4 pins and a 2.30 mm lead pitch, supporting a VCC supply range of 6.0V - 30.0V. Key pins include: 1 (SHDN: Multiplexed I/O & Peripheral Pin SHDN (General)), 2 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 3 (GND: Ground Reference Pin (GND)), 4 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MCP1790-3302E/DB?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1790-3302E/DB (SOT-223-3) has a nominal body envelope of 3.50 × 6.50 mm, pitch e = 2.30 mm, and 4 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1790-3302E/DB?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1790-3302E/DB (MICROCHIP, SOT-223-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 6.50mm × 3.50mm · Pitch: 2.30mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (4/4)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	SHDN	I/O	Multiplexed I/O & Peripheral Pin SHDN (General)
2	V IN	I/O	Multiplexed I/O & Peripheral Pin V IN (General)
3	GND	GND	Ground Reference Pin (GND)
4	V OUT	I/O	Multiplexed I/O & Peripheral Pin V OUT (General)

PIN 1 SHDN

I/O

Multiplexed I/O & Peripheral Pin SHDN (General)

Design note: ShutdownInput

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MCP1790-3302E/DB (SOT-223-3) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MCP1790-3302E/DB (SOT-223-3) - 2. Standard Pinout (Top View)

True package pinout (4 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MCP1790-3302E/DB (SOT-223-3) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MCP1790-3302E/DB (SOT-223-3) - 4. Package Dimensions (D×E×A)

SOT-223-3 · 6.50×3.50mm · Pitch 2.30mmExpand ›

5. Recommended Land PatternLAND PATTERN

MCP1790-3302E/DB (SOT-223-3) - 5. Recommended Land Pattern

IPC-7351B Footprint (4 Pads)Expand ›

6. Application SchematicSCHEMATIC

MCP1790-3302E/DB (SOT-223-3) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)

Showing 1–11 of 11 uncropped original figures for MCP1790

P2 · p02_fig01EXACT PACKAGE

P20 · p20_fig01EXACT PACKAGE

MCP1790-3302E/DB (SOT-223-3) — MCP1790/MCP1791 | 6.0 PACKAGING INFORMATION | 6.1 Package Marking Information | Example: 3-Lead DDPAK (MCP1790) | 1 2 3 | XXXXXXXXX XXXXXXXXX | YYWWNNN | 1 2 3 | MCP1790 | 50EEB^^ 0730256 | 3 e | 3-Lead SOT-223 (MCP1790) | XXXXXXX XXXYYWW |

P23 · p23_fig01EXACT PACKAGE

MCP1790-3302E/DB (SOT-223-3) — 3-Lead Plastic Small Outline Transistor (DB) [SOT-223] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http://www.microchip.com/packaging | © 2008 Microchip Technology Inc. DS2207

3-Lead Plastic Small Outline Transistor (DB) [SOT-223] - Note: For the most current package drawings, please see the Microchip Packaging Specification located at - http://www.microchip.com/packaging | © 2008 Microchip Technology Inc. DS2207

P24 · p24_fig01EXACT PACKAGE

P2 · p02_fig02589×545px

1 2 3 | Pin | 1 VIN 2 GND (TAB) | 3 VOUT 4 GND (TAB) | 1 2 3

P2 · p02_fig03598×593px

1 2 3 4 5 | Pin | 1 SHDN | 2 VIN 3 GND (TAB) | 4 VOUT 5 PWRGD | 6 GND (TAB) | 1 2 3 4 5

P3 · p03_fig011777×1461px

MCP1790/MCP1791

P18 · p18_fig011777×2430px

MCP1790-3302E/DB (SOT-223-3) — DS22075A-page 18 © 2008 Microchip Technology Inc.

P18 · p18_fig01P18

Datasheet Page 18 (p18_fig01)

P20 · p20_fig021777×785px

MCP1790-3302E/DB (SOT-223-3) — DS22075A-page 20 © 2008 Microchip Technology Inc. | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spec

DS22075A-page 20 © 2008 Microchip Technology Inc. | Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-spec

P20 · p20_fig01P20

Datasheet Page 20 (p20_fig01)

Technical Specifications & Part Details (MCP1790-3302E/DB)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Low-Dropout Linear Voltage Regulator (LDO)

Detailed Overview:MCP1790-3302E/DB (SOT-223-3) is a 4-pin low-dropout linear voltage regulator (ldo) featuring a 6.50 × 3.50 × 1.60 mm mechanical envelope (lead pitch e = 2.30 mm). Rated for 6.0V - 30.0V supply operation across -40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

6.0V - 30.0V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1 kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

70 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

6.50 × 3.50 × 1.60 mm (A1=0.06 mm)

Package family: SOT223 (SOT-223-3)

Pin Count & Lead PitchN / e

4 Pins | Pitch e = 2.30 mm (90.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol4 auto-grouped pins

IPC-7351B Land Pattern4 pads · Pitch 2.30mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOT-223-3)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

6.50 × 3.50 mm

Height (A) & Pitch (e)IPC-7351B

A=1.60mm · e=2.30mm

Pad Size (W × L)Level B

0.95 × 2.00 mm

Pins / Total PadsTopology

4P / 4Pad (SOT_TAB)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SOT-223-3	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MCP1790-3302E/DB (SOT-223-3)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MCP1790-3302E/DB (SOT-223-3)?

Manufactured by MICROCHIP, the MCP1790-3302E/DB is housed in a SOT-223-3 package with 4 pins and a 2.30 mm lead pitch, supporting a VCC supply range of 6.0V - 30.0V. Key pins include: 1 (SHDN: Multiplexed I/O & Peripheral Pin SHDN (General)), 2 (V IN: Multiplexed I/O & Peripheral Pin V IN (General)), 3 (GND: Ground Reference Pin (GND)), 4 (V OUT: Multiplexed I/O & Peripheral Pin V OUT (General)).

What are the IPC-7351B PCB Footprint dimensions for MCP1790-3302E/DB?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MCP1790-3302E/DB (SOT-223-3) has a nominal body envelope of 3.50 × 6.50 mm, pitch e = 2.30 mm, and 4 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MCP1790-3302E/DB?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MCP1790-3302E/DB (MICROCHIP, SOT-223-3) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (4 pins) & MCP1790 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	SHDN	Digital_IO	Signal terminal SHDN (I/O, 6.0V - 30.0V domain). Multiplexed alternate functions: SHDN. Supported peripheral buses: General.
2	V IN	Digital_IO	Signal terminal V IN (I/O, 6.0V - 30.0V domain). Multiplexed alternate functions: V IN. Supported peripheral buses: General.
3	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4	V OUT	Digital_IO	Signal terminal V OUT (I/O, 6.0V - 30.0V domain). Multiplexed alternate functions: V OUT. Supported peripheral buses: General.

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