DRV8833PWPR (TSSOP-16-EP) — Symbol, Footprint IPC-7351B & 3D STEP Model

DRV8833PWPR

TIID: C50506TSSOP-16-EP · 17 Pins · Pitch 0.65mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · DRV8833PWPR (TSSOP-16-EP)1nSLEEP2AOUT13AISEN4AOUT25BOUT26BISEN7BOUT18nFault9BIN117GND16AIN115AIN214VINT13GND12VM11VCP10BIN2Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.817.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617E=4.40mm · Pitch e=0.65mmD=5.00mm-5-4-3-2-101234543210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 4.40mm × 5.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1nSLEEPI/OMultiplexed I/O & Peripheral Pin nSLEEP (General)
2AOUT1I/OMultiplexed I/O & Peripheral Pin AOUT1 (General)
3AISENI/OMultiplexed I/O & Peripheral Pin AISEN (General)
4AOUT2I/OMultiplexed I/O & Peripheral Pin AOUT2 (General)
5BOUT2I/OMultiplexed I/O & Peripheral Pin BOUT2 (General)
6BISENI/OMultiplexed I/O & Peripheral Pin BISEN (General)
7BOUT1I/OMultiplexed I/O & Peripheral Pin BOUT1 (General)
8nFaultI/OMultiplexed I/O & Peripheral Pin nFault (General)
9BIN1I/OMultiplexed I/O & Peripheral Pin BIN1 (General)
10BIN2I/OMultiplexed I/O & Peripheral Pin BIN2 (General)
11VCPI/OMultiplexed I/O & Peripheral Pin VCP (General)
12VMI/OMultiplexed I/O & Peripheral Pin VM (General)
13GNDGNDGround Reference Pin (GND)
14VINTPowerPower Supply Input (VINT — 2.7 V to 10.8 V)
15AIN2I/OMultiplexed I/O & Peripheral Pin AIN2 (ADC)
16AIN1I/OMultiplexed I/O & Peripheral Pin AIN1 (ADC)
17GNDGNDGround Reference Pin (GND)
PIN 1 nSLEEP
I/O
Multiplexed I/O & Peripheral Pin nSLEEP (General)
Design note: Sleepmodeinput
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 15 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: DRV8833PWPR (TI · TSSOP-16-EP)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
DRV8833PWPR (TSSOP-16-EP) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
DRV8833PWPR (TSSOP-16-EP) - 2. Standard Pinout (Top View)
True package pinout (17 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
DRV8833PWPR (TSSOP-16-EP) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
DRV8833PWPR (TSSOP-16-EP) - 4. Package Dimensions (D×E×A)
TSSOP-16-EP · 4.40×5.00mm · Pitch 0.65mmExpand ›
5. Recommended Land PatternLAND PATTERN
DRV8833PWPR (TSSOP-16-EP) - 5. Recommended Land Pattern
IPC-7351B Footprint (17 Pads)Expand ›
6. Application SchematicSCHEMATIC
DRV8833PWPR (TSSOP-16-EP) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (15 figures · Page 1/2)
Showing 1–12 of 15 uncropped original figures for DRV8833
P3 · p03_fig02EXACT PACKAGE
DRV8833PWPR (TSSOP-16-EP) — 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 16 | 15 | 14 | 13 | 12 | 11 | 10 | 9 | GND (PPAD) | AOUT1 | nSLEEP | AIN1 | AIN2 | VINT GND VM VCP | BIN1 | BIN2 | BOUT1 | nFAULT | BOUT2 | BISEN | AOUT2 | AISEN | PWP Package RTY Package 16-Pin HTSSOP 16-Pin
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 16 | 15 | 14 | 13 | 12 | 11 | 10 | 9 | GND (PPAD) | AOUT1 | nSLEEP | AIN1 | AIN2 | VINT GND VM VCP | BIN1 | BIN2 | BOUT1 | nFAULT | BOUT2 | BISEN | AOUT2 | AISEN | PWP Package RTY Package 16-Pin HTSSOP 16-Pin
P27 · p27_fig01EXACT PACKAGE
DRV8833PWPR (TSSOP-16-EP) — LAND PATTERN DATA - PwP (R-PDSO-G16) PowerPAD™ PLASTIC SMALL OUTLINE - Example Boord Loyout Stencil Openings
LAND PATTERN DATA - PwP (R-PDSO-G16) PowerPAD™ PLASTIC SMALL OUTLINE - Example Boord Loyout Stencil Openings
P1 · p01_fig01988×574px
DRV8833PWPR (TSSOP-16-EP) — 4 Simplified Schematic
4 Simplified Schematic
P3 · p03_fig011560×1049px
DRV8833PWPR (TSSOP-16-EP) — 6 Pin Configuration and Functions
6 Pin Configuration and Functions
P3 · p03_fig03704×538px
DRV8833PWPR (TSSOP-16-EP) — Pin Functions
Pin Functions
P3 · p03_fig02P3
DRV8833PWPR (TSSOP-16-EP) — Datasheet Page 3 (p03_fig02)
Datasheet Page 3 (p03_fig02)
P3 · p03_fig04P3
DRV8833PWPR (TSSOP-16-EP) — Datasheet Page 3 (p03_fig04)
Datasheet Page 3 (p03_fig04)
P12 · p12_fig011345×769px
DRV8833PWPR (TSSOP-16-EP) — Figure 7. Parallel Mode
Figure 7. Parallel Mode
P12 · p12_fig01P12
DRV8833PWPR (TSSOP-16-EP) — Datasheet Page 12 (p12_fig01)
Datasheet Page 12 (p12_fig01)
P19 · p19_fig01P19
DRV8833PWPR (TSSOP-16-EP) — Datasheet Page 19 (p19_fig01)
Datasheet Page 19 (p19_fig01)
P25 · p25_fig011711×2223px
DRV8833PWPR (TSSOP-16-EP) — MECHANICAL DATA - PwPe (R-PDSO-G'16) PowerPAD™ PLASTIC SMALL OUTLINE
MECHANICAL DATA - PwPe (R-PDSO-G'16) PowerPAD™ PLASTIC SMALL OUTLINE
P27 · p27_fig01P27
DRV8833PWPR (TSSOP-16-EP) — Datasheet Page 27 (p27_fig01)
Datasheet Page 27 (p27_fig01)
Page 1 / 2 (15 extracted figures)

Technical Specifications & Part Details (DRV8833PWPR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:DRV8833PWPR (TSSOP-16-EP) is a 16-pin standard electronic & interconnect component featuring a 5.00 × 4.40 × 1.20 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.7 V to 10.8 V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated PWM, ADC interfaces.
Operating Supply VoltageV_CC / V_DD
2.7 V to 10.8 V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
50 kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
5.00 × 4.40 × 1.20 mm (A1=0.00 mm)
Package family: TSSOP (TSSOP-16-EP)
Pin Count & Lead PitchN / e
16 Pins | Pitch e = 0.65 mm (25.6 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM, ADC
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol17 auto-grouped pins
OK
IPC-7351B Land Pattern17 pads · Pitch 0.65mm
OK
IPC-7525 60% Solder PasteEPAD 2.73×3.20mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (TSSOP-16-EP)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
5.00 × 4.40 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=0.65mm
Pad Size (W × L)Level B
0.42 × 1.45 mm
Pins / Total PadsTopology
17P / 17Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
TSSOP-16-EP
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — DRV8833PWPR (TSSOP-16-EP)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of DRV8833PWPR (TSSOP-16-EP)?

Manufactured by TI, the DRV8833PWPR is housed in a TSSOP-16-EP package with 17 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.7 V to 10.8 V. Key pins include: 1 (nSLEEP: Multiplexed I/O & Peripheral Pin nSLEEP (General)), 2 (AOUT1: Multiplexed I/O & Peripheral Pin AOUT1 (General)), 3 (AISEN: Multiplexed I/O & Peripheral Pin AISEN (General)), 4 (AOUT2: Multiplexed I/O & Peripheral Pin AOUT2 (General)), 5 (BOUT2: Multiplexed I/O & Peripheral Pin BOUT2 (General)), 6 (BISEN: Multiplexed I/O & Peripheral Pin BISEN (General)).

What are the IPC-7351B PCB Footprint dimensions for DRV8833PWPR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), DRV8833PWPR (TSSOP-16-EP) has a nominal body envelope of 4.40 × 5.00 mm, pitch e = 0.65 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 2.73 × 3.20 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for DRV8833PWPR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for DRV8833PWPR (TI, TSSOP-16-EP) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & DRV8833 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1nSLEEPDigital_IOSignal terminal nSLEEP (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: nSLEEP. Supported peripheral buses: General.
2AOUT1Digital_IOSignal terminal AOUT1 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: AOUT1. Supported peripheral buses: General.
3AISENDigital_IOSignal terminal AISEN (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: AISEN. Supported peripheral buses: General.
4AOUT2Digital_IOSignal terminal AOUT2 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: AOUT2. Supported peripheral buses: General.
5BOUT2Digital_IOSignal terminal BOUT2 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: BOUT2. Supported peripheral buses: General.
6BISENDigital_IOSignal terminal BISEN (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: BISEN. Supported peripheral buses: General.
7BOUT1Digital_IOSignal terminal BOUT1 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: BOUT1. Supported peripheral buses: General.
8nFaultDigital_IOSignal terminal nFault (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: nFault. Supported peripheral buses: General.
9BIN1Digital_IOSignal terminal BIN1 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: BIN1. Supported peripheral buses: General.
10BIN2Digital_IOSignal terminal BIN2 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: BIN2. Supported peripheral buses: General.
11VCPDigital_IOSignal terminal VCP (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: VCP. Supported peripheral buses: General.
12VMDigital_IOSignal terminal VM (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: VM. Supported peripheral buses: General.
13GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
14VINTPower_InPrimary positive power supply input (VINT) operating in the 2.7 V to 10.8 V domain (Max rating: 10.8V).
15AIN2AnalogSignal terminal AIN2 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: AIN2. Supported peripheral buses: ADC.
16AIN1AnalogSignal terminal AIN1 (I/O, 2.7 V to 10.8 V domain). Multiplexed alternate functions: AIN1. Supported peripheral buses: ADC.
17GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.