CH445P (QFN-16(3x3)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH445P

WCHID: C2683595QFN-16(3x3) · 17 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH445P (QFN-16(3x3))1IN2S1A S1B 、 、 3S2A S2B 、 、 4DA DB 、 、 DC5S1A S1B 、 、 6S2A S2B 、 、 7DA DB 、 、 DC8GND9DA DB 、 、 DC17GND16VCC15EN#14S1A S1B 、 、 13S2A S2B 、 、 12DA DB 、 、 DC11S1A S1B 、 、 10S2A S2B 、 、 Grid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.217.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617E=3.00mm · Pitch e=0.50mmD=3.00mm-4-3-2-10123443210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1INI/OMultiplexed I/O & Peripheral Pin IN (General)
2S1A S1B 、 、 S1C S1D 、I/OMultiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)
3S2A S2B 、 、 S2C S2D 、I/OMultiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)
4DA DB 、 、 DC DD 、I/OMultiplexed I/O & Peripheral Pin DA DB 、 、 DC DD 、 (General)
5S1A S1B 、 、 S1C S1D 、I/OMultiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)
6S2A S2B 、 、 S2C S2D 、I/OMultiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)
7DA DB 、 、 DC DD 、I/OMultiplexed I/O & Peripheral Pin DA DB 、 、 DC DD 、 (General)
8GNDGNDGround Reference Pin (GND)
9DA DB 、 、 DC DD 、I/OMultiplexed I/O & Peripheral Pin DA DB 、 、 DC DD 、 (General)
10S2A S2B 、 、 S2C S2D 、I/OMultiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)
11S1A S1B 、 、 S1C S1D 、I/OMultiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)
12DA DB 、 、 DC DD 、I/OMultiplexed I/O & Peripheral Pin DA DB 、 、 DC DD 、 (General)
13S2A S2B 、 、 S2C S2D 、I/OMultiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)
14S1A S1B 、 、 S1C S1D 、I/OMultiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)
15EN#I/OMultiplexed I/O & Peripheral Pin EN# (General)
16VCCPowerPower Supply Input (VCC — 3.3V / 5.0V Standard Logic)
17GNDGNDGround Reference Pin (GND)
PIN 1 IN
I/O
Multiplexed I/O & Peripheral Pin IN (General)
Design note: 二选 一模拟开关选择输入 : 高电平选择2#端(S2x) ;低电平选择1#端(S1x)
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 12 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH445P (WCH · QFN-16(3x3))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH445P (QFN-16(3x3)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH445P (QFN-16(3x3)) - 2. Standard Pinout (Top View)
True package pinout (17 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH445P (QFN-16(3x3)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH445P (QFN-16(3x3)) - 4. Package Dimensions (D×E×A)
QFN-16(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH445P (QFN-16(3x3)) - 5. Recommended Land Pattern
IPC-7351B Footprint (17 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH445P (QFN-16(3x3)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (12 figures · Page 1/1)
Showing 1–12 of 12 uncropped original figures for CH445 / CH448 / CH440
P13 · p13_fig01EXACT PACKAGE
CH445P (QFN-16(3x3)) — 8.2. QFN16-3X3X0.75 (CH440P/CH444P)
8.2. QFN16-3X3X0.75 (CH440P/CH444P)
P13 · p13_fig02EXACT PACKAGE
CH445P (QFN-16(3x3)) — 8.2. QFN16-3X3X0.75 (CH440P/CH444P)
8.2. QFN16-3X3X0.75 (CH440P/CH444P)
P2 · p02_fig011491×1615px
CH445P (QFN-16(3x3)) — 3、引脚排列
3、引脚排列
P2 · p02_fig01P2
CH445P (QFN-16(3x3)) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P3 · p03_fig011729×2206px
CH445P (QFN-16(3x3)) — 2、QFN 或DFN 封装的底板标示为0#引脚,对于CH448F 是必要连接。 3、CH442Q 与CH9442Q 引脚兼容,CH9442Q 支持Type-C 充电口USB 信号,耐压28V。 4、原型号CH440E 已用新型号CH442E 代替,引脚和功能相同。 5、CH340K 为盘装,每盘整包装数量为3000 只。 6、CH442Q、CH340K、CH443L 封装体积较小,正面印字仅有代号42、43、43 而不含全部型号。 | 4、引脚定义 | 4.1. CH340G
2、QFN 或DFN 封装的底板标示为0#引脚,对于CH448F 是必要连接。 3、CH442Q 与CH9442Q 引脚兼容,CH9442Q 支持Type-C 充电口USB 信号,耐压28V。 4、原型号CH440E 已用新型号CH442E 代替,引脚和功能相同。 5、CH340K 为盘装,每盘整包装数量为3000 只。 6、CH442Q、CH340K、CH443L 封装体积较小,正面印字仅有代号42、43、43 而不含全部型号。 | 4、引脚定义 | 4.1. CH340G
P9 · p09_fig011725×2761px
CH445P (QFN-16(3x3)) — CH440/CH442/CH443/CH444/CH445/CH448 手册 9 | 6.3. 额定5V 芯片电气参数@3.3V(测试条件:TA=25℃,VCC=VDD=3.3V,不含CH445) | 6.4. 额定5V 芯片模拟开关时序参数(测试条件:TA=25℃,VCC=VDD=5V,VANA=0V,不含CH445) | 名称 参数说明 最小值 典型值 最大值 单位 CIN 数字输入引脚电容,F=1MHz 4 8 pF | COFF CH448 开关关闭时模拟信号引脚电容
CH440/CH442/CH443/CH444/CH445/CH448 手册 9 | 6.3. 额定5V 芯片电气参数@3.3V(测试条件:TA=25℃,VCC=VDD=3.3V,不含CH445) | 6.4. 额定5V 芯片模拟开关时序参数(测试条件:TA=25℃,VCC=VDD=5V,VANA=0V,不含CH445) | 名称 参数说明 最小值 典型值 最大值 单位 CIN 数字输入引脚电容,F=1MHz 4 8 pF | COFF CH448 开关关闭时模拟信号引脚电容
P9 · p09_fig01P9
CH445P (QFN-16(3x3)) — Datasheet Page 9 (p09_fig01)
Datasheet Page 9 (p09_fig01)
P11 · p11_fig011506×749px
CH445P (QFN-16(3x3)) — VCOM(V) 6.8.2 CH445 的模拟开关导通电阻RON 与模拟信号电压VCOM 的相关性(TA=25℃) RON (Ω)
VCOM(V) 6.8.2 CH445 的模拟开关导通电阻RON 与模拟信号电压VCOM 的相关性(TA=25℃) RON (Ω)
P11 · p11_fig021543×684px
CH445P (QFN-16(3x3)) — VCOM(V)
VCOM(V)
P17 · p17_fig011210×1387px
CH445P (QFN-16(3x3)) — D 6 =a] 7 1 a a TEE.
D 6 =a] 7 1 a a TEE.
P14 · p14_fig021341×1017px
CH445P (QFN-16(3x3)) — 8.4. QFN16-3*3 [MSOP-10]
8.4. QFN16-3*3 [MSOP-10]
P15 · p15_fig011210×1386px
CH445P (QFN-16(3x3)) — PACKAGE_DIMENSIONS — CH440E (MSOP-10)
PACKAGE_DIMENSIONS — CH440E (MSOP-10)

Technical Specifications & Part Details (CH445P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH445P (QFN-16(3x3)) is a 16-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.00 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated USB interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
550 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 1.00 mm (A1=0.03 mm)
Package family: QFN (QFN-16(3x3))
Pin Count & Lead PitchN / e
16 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol17 auto-grouped pins
OK
IPC-7351B Land Pattern17 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteEPAD 1.70×1.70mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified
IPC-7351B

Family Variants & Same Datasheet Chips — CH445 / CH448 / CH440 (10)

Select package variant or sibling MPN sharing this datasheet

Mechanical Dimensions & Land Pattern (QFN-16(3x3))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=0.50mm
Pad Size (W × L)Level B
0.29 × 0.77 mm
Pins / Total PadsTopology
17P / 17Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-16(3x3)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH445P (QFN-16(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH445P (QFN-16(3x3))?

Manufactured by WCH, the CH445P is housed in a QFN-16(3x3) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (S1A S1B 、 、 S1C S1D 、: Multiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)), 3 (S2A S2B 、 、 S2C S2D 、: Multiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)), 4 (DA DB 、 、 DC DD 、: Multiplexed I/O & Peripheral Pin DA DB 、 、 DC DD 、 (General)), 5 (S1A S1B 、 、 S1C S1D 、: Multiplexed I/O & Peripheral Pin S1A S1B 、 、 S1C S1D 、 (General)), 6 (S2A S2B 、 、 S2C S2D 、: Multiplexed I/O & Peripheral Pin S2A S2B 、 、 S2C S2D 、 (General)).

What are the IPC-7351B PCB Footprint dimensions for CH445P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH445P (QFN-16(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 1.70 × 1.70 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH445P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH445P (WCH, QFN-16(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & CH445 / CH448 / CH440 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1INDigital_IOSignal terminal IN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
2S1A S1B 、 、 S1C S1D 、Digital_IOSignal terminal S1A S1B 、 、 S1C S1D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S1A S1B 、 、 S1C S1D 、. Supported peripheral buses: General.
3S2A S2B 、 、 S2C S2D 、Digital_IOSignal terminal S2A S2B 、 、 S2C S2D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S2A S2B 、 、 S2C S2D 、. Supported peripheral buses: General.
4DA DB 、 、 DC DD 、Digital_IOSignal terminal DA DB 、 、 DC DD 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DA DB 、 、 DC DD 、. Supported peripheral buses: General.
5S1A S1B 、 、 S1C S1D 、Digital_IOSignal terminal S1A S1B 、 、 S1C S1D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S1A S1B 、 、 S1C S1D 、. Supported peripheral buses: General.
6S2A S2B 、 、 S2C S2D 、Digital_IOSignal terminal S2A S2B 、 、 S2C S2D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S2A S2B 、 、 S2C S2D 、. Supported peripheral buses: General.
7DA DB 、 、 DC DD 、Digital_IOSignal terminal DA DB 、 、 DC DD 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DA DB 、 、 DC DD 、. Supported peripheral buses: General.
8GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
9DA DB 、 、 DC DD 、Digital_IOSignal terminal DA DB 、 、 DC DD 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DA DB 、 、 DC DD 、. Supported peripheral buses: General.
10S2A S2B 、 、 S2C S2D 、Digital_IOSignal terminal S2A S2B 、 、 S2C S2D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S2A S2B 、 、 S2C S2D 、. Supported peripheral buses: General.
11S1A S1B 、 、 S1C S1D 、Digital_IOSignal terminal S1A S1B 、 、 S1C S1D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S1A S1B 、 、 S1C S1D 、. Supported peripheral buses: General.
12DA DB 、 、 DC DD 、Digital_IOSignal terminal DA DB 、 、 DC DD 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DA DB 、 、 DC DD 、. Supported peripheral buses: General.
13S2A S2B 、 、 S2C S2D 、Digital_IOSignal terminal S2A S2B 、 、 S2C S2D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S2A S2B 、 、 S2C S2D 、. Supported peripheral buses: General.
14S1A S1B 、 、 S1C S1D 、Digital_IOSignal terminal S1A S1B 、 、 S1C S1D 、 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: S1A S1B 、 、 S1C S1D 、. Supported peripheral buses: General.
15EN#Digital_IOSignal terminal EN# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: EN#. Supported peripheral buses: General.
16VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
17GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.