MIC2178YWM (SOIC-20-300mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC2178YWM

MICROCHIPSOIC-20-300mil · 20 Pins · Pitch 1.27mmIPC TOLERANCE VARIATION5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC2178YWM (SOIC-20-300mil)1VIN2VIN3SW4PGND5PGND6PGND7PGND8SW9VIN10PWM#20EN19BIAS18SYNC17SGND16SGND15SGND14SGND13COMP12FB11PWRGDGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.817.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617181920E=7.50mm · Pitch e=1.27mmD=12.80mm-9-7-5-3-11357997531-1-3-5-7-9mm
3. 3D CAD MODEL
Package Body: 7.50mm × 12.80mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (20/20)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VINPowerPower Supply Input (VIN — 4.5V to 16.5V)
2VINPowerPower Supply Input (VIN — 4.5V to 16.5V)
3SWI/OMultiplexed I/O & Peripheral Pin SW (General)
4PGNDGNDGround Reference Pin (PGND)
5PGNDGNDGround Reference Pin (PGND)
6PGNDGNDGround Reference Pin (PGND)
7PGNDGNDGround Reference Pin (PGND)
8SWI/OMultiplexed I/O & Peripheral Pin SW (General)
9VINPowerPower Supply Input (VIN — 4.5V to 16.5V)
10PWM#I/OMultiplexed I/O & Peripheral Pin PWM# (PWM)
11PWRGDI/OMultiplexed I/O & Peripheral Pin PWRGD (General)
12FBI/OMultiplexed I/O & Peripheral Pin FB (General)
13COMPI/OMultiplexed I/O & Peripheral Pin COMP (General)
14SGNDGNDGround Reference Pin (SGND)
15SGNDGNDGround Reference Pin (SGND)
16SGNDGNDGround Reference Pin (SGND)
17SGNDGNDGround Reference Pin (SGND)
18SYNCI/OMultiplexed I/O & Peripheral Pin SYNC (General)
19BIASI/OMultiplexed I/O & Peripheral Pin BIAS (General)
20ENISystem Enable & Hardware Reset (EN)
PIN 1 VIN
Power
Power Supply Input (VIN — 4.5V to 16.5V)
Design note: Primary positive power supply input (VIN) operating in the 4.5V to 16.5V domain (Max rating: 16.5V).
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
MIC2178YWM (SOIC-20-300mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC2178YWM (SOIC-20-300mil) - 2. Standard Pinout (Top View)
True package pinout (20 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC2178YWM (SOIC-20-300mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC2178YWM (SOIC-20-300mil) - 4. Package Dimensions (D×E×A)
SOIC-20-300mil · 7.50×12.80mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC2178YWM (SOIC-20-300mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (20 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC2178YWM (SOIC-20-300mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for MIC2178
P1 · p01_fig012038×1799px
MIC2178YWM (SOIC-20-300mil) — VIN 5.4V to 18V
VIN 5.4V to 18V
P1 · p01_fig021929×738px
MIC2178YWM (SOIC-20-300mil) — Typical Application
Typical Application
P1 · p01_fig01P1
MIC2178YWM (SOIC-20-300mil) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig012038×2595px
MIC2178YWM (SOIC-20-300mil) — MIC2178 Micrel, Inc.
MIC2178 Micrel, Inc.
P2 · p02_fig01P2
MIC2178YWM (SOIC-20-300mil) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P12 · p12_fig011264×779px
MIC2178YWM (SOIC-20-300mil) — Figure 1. MIC2178 4.5V-16.5V to 3.3V/1A Regulator
Figure 1. MIC2178 4.5V-16.5V to 3.3V/1A Regulator
P12 · p12_fig021322×779px
MIC2178YWM (SOIC-20-300mil) — Figure 2. MIC2178 5.4V-16.5V to 5V/1A Regulator
Figure 2. MIC2178 5.4V-16.5V to 5V/1A Regulator
P15 · p15_fig011727×956px
MIC2178YWM (SOIC-20-300mil) — MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

Technical Specifications & Part Details (MIC2178YWM)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC2178YWM (SOIC-20-300mil) is a 20-pin standard electronic & interconnect component featuring a 12.80 × 7.50 × 2.70 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 4.5V to 16.5V supply operation across 40°C to +85°C with integrated PWM interfaces.
Operating Supply VoltageV_CC / V_DD
4.5V to 16.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
200kHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
12.80 × 7.50 × 2.70 mm (A1=0.20 mm)
Package family: SOIC (SOIC-20-300mil)
Pin Count & Lead PitchN / e
20 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol20 auto-grouped pins
OK
IPC-7351B Land Pattern20 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-20-300mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
12.80 × 7.50 mm
Height (A) & Pitch (e)IPC-7351B
A=2.70mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.90 mm
Pins / Total PadsTopology
20P / 20Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-20-300mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC2178YWM (SOIC-20-300mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC2178YWM (SOIC-20-300mil)?

Manufactured by MICROCHIP, the MIC2178YWM is housed in a SOIC-20-300mil package with 20 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 4.5V to 16.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 4.5V to 16.5V)), 2 (VIN: Power Supply Input (VIN — 4.5V to 16.5V)), 3 (SW: Multiplexed I/O & Peripheral Pin SW (General)), 4 (PGND: Ground Reference Pin (PGND)), 5 (PGND: Ground Reference Pin (PGND)), 6 (PGND: Ground Reference Pin (PGND)).

What are the IPC-7351B PCB Footprint dimensions for MIC2178YWM?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC2178YWM (SOIC-20-300mil) has a nominal body envelope of 7.50 × 12.80 mm, pitch e = 1.27 mm, and 20 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC2178YWM?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC2178YWM (MICROCHIP, SOIC-20-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (20 pins) & MIC2178 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VINPower_InPrimary positive power supply input (VIN) operating in the 4.5V to 16.5V domain (Max rating: 16.5V).
2VINPower_InPrimary positive power supply input (VIN) operating in the 4.5V to 16.5V domain (Max rating: 16.5V).
3SWDigital_IOSignal terminal SW (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
4PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
5PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
6PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
7PGNDGND0V electrical ground return terminal (PGND) for internal core logic, I/O drivers, and analog sub-blocks.
8SWDigital_IOSignal terminal SW (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: SW. Supported peripheral buses: General.
9VINPower_InPrimary positive power supply input (VIN) operating in the 4.5V to 16.5V domain (Max rating: 16.5V).
10PWM#Digital_IOSignal terminal PWM# (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: PWM#. Supported peripheral buses: PWM.
11PWRGDOpen_DrainSignal terminal PWRGD (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: PWRGD. Supported peripheral buses: General.
12FBDigital_IOSignal terminal FB (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: FB. Supported peripheral buses: General.
13COMPDigital_IOSignal terminal COMP (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: COMP. Supported peripheral buses: General.
14SGNDGND0V electrical ground return terminal (SGND) for internal core logic, I/O drivers, and analog sub-blocks.
15SGNDGND0V electrical ground return terminal (SGND) for internal core logic, I/O drivers, and analog sub-blocks.
16SGNDGND0V electrical ground return terminal (SGND) for internal core logic, I/O drivers, and analog sub-blocks.
17SGNDGND0V electrical ground return terminal (SGND) for internal core logic, I/O drivers, and analog sub-blocks.
18SYNCDigital_IOSignal terminal SYNC (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: SYNC. Supported peripheral buses: General.
19BIASDigital_IOSignal terminal BIAS (I/O, 4.5V to 16.5V domain). Multiplexed alternate functions: BIAS. Supported peripheral buses: General.
20ENDigital_IOChip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.