MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6))?

Manufactured by MICROCHIP, the MIC5303-2.5YMT-TR is housed in a UDFN-4-EP(1.2x1.6) package with 5 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.3V to 5.5V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (GND: Ground Reference Pin (GND)), 3 (VIN: Power Supply Input (VIN — 2.3V to 5.5V)), 4 (VOUT: Regulated Power Output (VOUT — 2.3V to 5.5V)), 5 (EP: Exposed Thermal & Ground Pad (EP)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5303-2.5YMT-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) has a nominal body envelope of 1.20 × 1.60 mm, pitch e = 0.50 mm, and 5 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5303-2.5YMT-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5303-2.5YMT-TR (MICROCHIP, UDFN-4-EP(1.2x1.6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 1.20mm × 1.60mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (5/5)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	EN	I	System Enable & Hardware Reset (EN)
2	GND	GND	Ground Reference Pin (GND)
3	VIN	Power	Power Supply Input (VIN — 2.3V to 5.5V)
4	VOUT	Power	Regulated Power Output (VOUT — 2.3V to 5.5V)
5	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 EN

System Enable & Hardware Reset (EN)

Design note: EnableInput ActiveHigh High=on low=off Donotleavefloating . . , . .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 11 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 2. Standard Pinout (Top View)

True package pinout (5 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 4. Package Dimensions (D×E×A)

UDFN-4-EP(1.2x1.6) · 1.20×1.60mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 5. Recommended Land Pattern

IPC-7351B Footprint (5 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)

Showing 1–11 of 11 uncropped original figures for MIC5303

P1 · p01_fig011018×589px

ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.

P1 · p01_fig02574×619px

ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P2 · p02_fig011668×993px

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) — Micrel, Inc. MIC5303 | Block Diagram | VIN | EN | VOUT | GND | Current | Limit | LDO | Quick- | Start VREF | Thermal Shutdown | Error Amp | MIC5303 Block Diagram

P3 · p03_fig01667×243px

4-Pin 1.2mm x 1.6mm Thin MLF® (MT) Pin Description

P3 · p03_fig01P3

Datasheet Page 3 (p03_fig01)

P6 · p06_fig01704×558px

Time (10µs/div)

P6 · p06_fig02704×557px

Time (40µs/div)

P6 · p06_fig03697×554px

Time (40µs/div)

P7 · p07_fig01999×333px

MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) — The table below shows junction-to-ambient thermal resistance for the MIC5303 in the 4-pin 1.2mm x 1.6mm MLF® package. | Package θJA Recommended Minimum Footprint | 4-Pin 1.2x1.6 MLF® 173°C/W | Thermal Resistance

The table below shows junction-to-ambient thermal resistance for the MIC5303 in the 4-pin 1.2mm x 1.6mm MLF® package. | Package θJA Recommended Minimum Footprint | 4-Pin 1.2x1.6 MLF® 173°C/W | Thermal Resistance

P8 · p08_fig011825×1371px

Micrel, Inc. MIC5303 | Package Information | 4-Pin 1.2mm x 1.6mm Thin MLF® (MT)

Technical Specifications & Part Details (MIC5303-2.5YMT-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) is a 4-pin standard electronic & interconnect component featuring a 1.60 × 1.20 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.3V to 5.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

2.3V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +125°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

1kHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

85µA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

1.60 × 1.20 × 0.85 mm (A1=0.03 mm)

Package family: DFN (UDFN-4-EP(1.2x1.6))

Pin Count & Lead PitchN / e

4 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol5 auto-grouped pins

IPC-7351B Land Pattern5 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (UDFN-4-EP(1.2x1.6))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

1.60 × 1.20 mm

Height (A) & Pitch (e)IPC-7351B

A=0.85mm · e=0.50mm

Pad Size (W × L)Level B

0.28 × 0.58 mm

Pins / Total PadsTopology

5P / 5Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit UDFN-4-EP(1.2x1.6)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6))?

Manufactured by MICROCHIP, the MIC5303-2.5YMT-TR is housed in a UDFN-4-EP(1.2x1.6) package with 5 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.3V to 5.5V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (GND: Ground Reference Pin (GND)), 3 (VIN: Power Supply Input (VIN — 2.3V to 5.5V)), 4 (VOUT: Regulated Power Output (VOUT — 2.3V to 5.5V)), 5 (EP: Exposed Thermal & Ground Pad (EP)).

What are the IPC-7351B PCB Footprint dimensions for MIC5303-2.5YMT-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5303-2.5YMT-TR (UDFN-4-EP(1.2x1.6)) has a nominal body envelope of 1.20 × 1.60 mm, pitch e = 0.50 mm, and 5 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5303-2.5YMT-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5303-2.5YMT-TR (MICROCHIP, UDFN-4-EP(1.2x1.6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (5 pins) & MIC5303 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
2	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3	VIN	Power_In	Primary positive power supply input (VIN) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
4	VOUT	Power_Out	Regulated power output rail (VOUT) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
5	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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