4006 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4024 Bauteilen · Seite 250/252)

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- · 57P

ESP32-S3-DEVKITM-1-N8 (-) - 3D-Modell (-)

ESP32-S3-DEVKITM-1-N8

READY

57P7.0×7.0×0.90mmP=0.4mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-18P · 19P

ESP-WROOM-02U(M1102H3200UH3Q0) (SMD-18P) - 3D-Modell (SMD-18P)

ESP-WROOM-02U(M1102H3200UH3Q0)

ESPRESSIF·SMD-18P

READY

19P18.0×14.3×3.20mmP=1.5mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,15.4x15.4mm · 65P

ESP32-S2-MINI-2U-N4 (SMD,15.4x15.4mm) - 3D-Modell (SMD,15.4x15.4mm)

ESP32-S2-MINI-2U-N4

ESPRESSIF·SMD,15.4x15.4mm

READY

65P15.4×15.4×2.40mmP=0.85mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

VFQFN-56-EP · 65P

ESP32-S3-MINI-1U-N8 (VFQFN-56-EP) - 3D-Modell (VFQFN-56-EP)

ESP32-S3-MINI-1U-N8

ESPRESSIF·VFQFN-56-EP

READY

65P15.4×15.4×2.40mmP=0.85mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,15.4x15.4mm · 65P

ESP32-S3-MINI-1U-N4R2 (SMD,15.4x15.4mm) - 3D-Modell (SMD,15.4x15.4mm)

ESP32-S3-MINI-1U-N4R2

ESPRESSIF·SMD,15.4x15.4mm

READY

65P15.4×15.4×2.40mmP=0.85mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

VFQFN-56-EP · 65P

ESP32-S2-MINI-2U-N4R2 (VFQFN-56-EP) - 3D-Modell (VFQFN-56-EP)

ESP32-S2-MINI-2U-N4R2

ESPRESSIF·VFQFN-56-EP

READY

65P15.4×15.4×2.40mmP=0.85mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

- · 41P

ESP32-S2-SOLO-N8 (-) - 3D-Modell (-)

ESP32-S2-SOLO-N8

ESPRESSIF(乐鑫)·-

READY

41P25.5×18.0×3.10mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

- · 41P

ESP32-S2-SOLO-N4 (-) - 3D-Modell (-)

ESP32-S2-SOLO-N4

Espressif Systems·-

READY

41P25.5×18.0×3.10mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

Through Hole,Right Angle,P=2mm · 10P

HX PM2.0-1x10P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x10P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

10P22.0×6.3×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,D=5mm · 2P

HL-508H256WC-HD_6000K_ (Through Hole,D=5mm) - 3D-Modell (Through Hole,D=5mm)

HL-508H256WC-HD_6000K_

HONGLITRONIC·Through Hole,D=5mm

READY

2P5.0×5.0×7.70mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

- · 41P

ESP32-S2-SOLO-U-N4 (-) - 3D-Modell (-)

ESP32-S2-SOLO-U-N4

Espressif Systems·-

READY

41P19.2×18.0×3.10mmP=1.27mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD,20x18mm · 19P

ESP32-C3-WROOM-02-N4 (SMD,20x18mm) - 3D-Modell (SMD,20x18mm)

ESP32-C3-WROOM-02-N4

ESPRESSIF·SMD,20x18mm

READY

19P20.0×18.0×3.20mmP=1.5mm

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SMD-41P · 41P

ESP32-S2-SOLO-2U-N4R2 (SMD-41P) - 3D-Modell (SMD-41P)

ESP32-S2-SOLO-2U-N4R2

ESPRESSIF·SMD-41P

READY

41P19.2×18.0×3.20mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SOP-16 · 16P

CH340G (SOP-16) - 3D-Modell (SOP-16)

CH340G

READY

16P9.9×3.9×1.75mmP=1.27mm3.3V to 5V

Schnittstellen-Bridge & Takt-/Timer-IC

LQFP-48(7x7) · 48P

STM32F103C8T6 (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

STM32F103C8T6

ST·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

SOP-16 · 16P

CH340C (SOP-16) - 3D-Modell (SOP-16)

CH340C

READY

16P9.9×3.9×1.75mmP=1.27mm

Schnittstellen-Bridge & Takt-/Timer-IC

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