Electronic Component Catalog — IEEE-315 Symbols, IPC-7351B Footprints & 3D STEP/GLB (Package BULETM · Page 243)

LQFN-56(7x7) · 57P

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

Embedded Microcontroller Unit (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Wireless Wi-Fi / Bluetooth LE SoC Module

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Interface Bridge / Precision Clock & Timer IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Embedded Microcontroller Unit (MCU)

SOIC-8 · 8P

HV9930LG-G

MICROCHIP(美国微芯)·SOIC-8

READY

8P

HV9930LG-G

SOIC-8 · 8P

HV830LG-G

MICROCHIP(美国微芯)·SOIC-8

READY

8P

高压电致发光灯驱动IC

SSOP-20-208mil · 8P

PIC16F1828T-I/SS

MICROCHIP(美国微芯)·SSOP-20-208mil

READY

8P

采用XLP技术的14/20引脚闪存微控制器

SSOP-20-208mil · 8P

PIC16C715T-20I/SS

MICROCHIP(美国微芯)·SSOP-20-208mil

READY

8P

PIC16C715T-20I/SS

SSOP-20-5.2mm · 8P

PIC16C56AT-20/SS

MICROCHIP(美国微芯)·SSOP-20-5.2mm

READY

8P

PIC16C56AT-20/SS

QFN-28-EP(6x6) · 8P

dsPIC33EV32GM002T-I/MM

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

dsPIC33EV32GM002T-I/MM

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

Components (3884 components · Page 243/243)