4034 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (886 Bauteilen · Seite 1/56)

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SOIC-8 · 8P

SY100EL16VBZI-TR (SOIC-8) - 3D-Modell (SOIC-8)

SY100EL16VBZI-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20 · 20P

SY100EL17VZC-TR (SOIC-20) - 3D-Modell (SOIC-20)

SY100EL17VZC-TR

MICROCHIP·SOIC-20

READY

20P12.8×7.5×2.70mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

LMC7101AYM5-TR (SOT-23-5) - 3D-Modell (SOT-23-5)

LMC7101AYM5-TR

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.7V to 12V

Standard-Elektronik- & Steckverbinderbauteil

DFN-10(3x3) · 11P

MCP73213-B6SI/MF (DFN-10(3x3)) - 3D-Modell (DFN-10(3x3))

MCP73213-B6SI/MF

MICROCHIP·DFN-10(3x3)

READY

11P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

SST25VF020-20-4C-SAE (SOIC-8) - 3D-Modell (SOIC-8)

SST25VF020-20-4C-SAE

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

AT30TS750A-XM8M-T (MSOP-8) - 3D-Modell (MSOP-8)

AT30TS750A-XM8M-T

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm1.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

TC642BEUA (MSOP-8) - 3D-Modell (MSOP-8)

TC642BEUA

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm3.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MCP6401T-E/OT (SOT-23-5) - 3D-Modell (SOT-23-5)

MCP6401T-E/OT

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm1.8V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-EP · 9P

MIC5280YME (SOIC-8-EP) - 3D-Modell (SOIC-8-EP)

MIC5280YME

MICROCHIP·SOIC-8-EP

READY

9P4.9×3.9×1.70mmP=1.27mm4.5V to 120V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

MIC4684YM-TR (SOIC-8) - 3D-Modell (SOIC-8)

MIC4684YM-TR

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm4V to 30V

Standard-Elektronik- & Steckverbinderbauteil

TDFN-8-EP(2x3) · 9P

MCP6H02T-E/MNY (TDFN-8-EP(2x3)) - 3D-Modell (TDFN-8-EP(2x3))

MCP6H02T-E/MNY

MICROCHIP·TDFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm3.5V to 16V

Standard-Elektronik- & Steckverbinderbauteil

DIP-14 · 14P

PIC16LF1614-I/P (DIP-14) - 3D-Modell (DIP-14)

PIC16LF1614-I/P

MICROCHIP·DIP-14

READY

14P20.0×6.7×4.20mmP=2.54mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-3 · 3P

MCP1700T-3502E/TT (SOT-23-3) - 3D-Modell (SOT-23-3)

MCP1700T-3502E/TT

MICROCHIP·SOT-23-3

READY

3P2.9×1.3×1.10mmP=1.9mm2.3V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

25LC080DT-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

25LC080DT-E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.5V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

25LC080CT-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

25LC080CT-E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.5V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-8 · 8P

25LC320AX-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

25LC320AX-I/ST

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

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