QFN-24-EP(4x4) · 25P预览实物照片3D CADPinoutFootprint尺寸MPU-6050TDK InvenSense·QFN-24-EP(4x4)READY25P4.0×4.0×0.90mmP=0.5mm2.375V-3.46V标准电子与连接器元件
TSSOP-28 · 28P预览实物照片3D CADPinoutFootprint尺寸PCA9685PW,118NXP·TSSOP-28READY28P9.7×4.4×1.00mmP=0.65mm标准电子与连接器元件
VSSOP-10 · 10P预览实物照片3D CADPinoutFootprint尺寸ADS1115IDGSRTI·VSSOP-10READY10P3.0×3.0×1.10mmP=0.5mm2.0V to 5.5V标准电子与连接器元件
DIP-8 · 8P预览实物照片3D CADPinoutFootprint尺寸AT24C02CNHGSEMI·DIP-8READY8P9.6×6.3×4.20mmP=2.54mm1.7V to 5.5V标准电子与连接器元件
TSSOP-20-175mil · 20P预览实物照片3D CADPinoutFootprint尺寸CH32V003F4P6WCH·TSSOP-20-175milREADY20P6.5×4.4×1.00mmP=0.65mm2.7V~5.5V嵌入式微控制器芯片 (MCU)
MSOP-10 · 10P预览实物照片3D CADPinoutFootprint尺寸CH340EWCH·MSOP-10READY10P3.0×3.0×1.10mmP=0.5mm3.3V to 5V接口转换与时钟定时器芯片
SOP-8 · 8P预览实物照片3D CADPinoutFootprint尺寸CH340NWCH·SOP-8READY8P4.9×3.9×1.75mmP=1.27mm3.3V to 5V接口转换与时钟定时器芯片
LQFP-64(10x10) · 64P预览实物照片3D CADPinoutFootprint尺寸STM32F405RGT6ST·LQFP-64(10x10)READY64P10.0×10.0×1.60mmP=0.5mm1.8 V to 3.6 V嵌入式微控制器芯片 (MCU)
SOIC-8-EP · 9P预览实物照片3D CADPinoutFootprint尺寸TPS5430DDARTI·SOIC-8-EPREADY9P4.9×3.9×1.70mmP=1.27mm5.5 V to 36 V标准电子与连接器元件
SOIC-8 · 8P预览实物照片3D CADPinoutFootprint尺寸LM358DRTI·SOIC-8READY8P4.9×3.9×1.75mmP=1.27mm3 V to 32 V标准电子与连接器元件
SOIC-8-208mil · 8P预览实物照片3D CADPinoutFootprint尺寸W25Q128JVSIQWinbond·SOIC-8-208milREADY8P5.3×5.3×1.90mmP=1.27mm标准电子与连接器元件
LED0402-RD_WHITE · 2P预览实物照片3D CADPinoutFootprint尺寸C9900204131Generic·LED0402-RD_WHITEREADY2P1.0×0.5×0.55mmP=1.08mm标准电子与连接器元件
MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GT · 10P预览实物照片3D CADPinoutFootprint尺寸C9900189595Generic·MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GTREADY10P3.0×3.0×1.10mmP=0.5mm接口转换与时钟定时器芯片
SMD,16.6x13.2mm · 53P预览实物照片3D CADPinoutFootprint尺寸ESP32-C3-MINI-1-H4XESPRESSIF·SMD,16.6x13.2mmREADY53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 VWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组