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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3964 款元器件 · 第 193/248)

显示 3073–3088 共 3964 款元器件

WLCSP-144(5.2x5.2) · 144P

STM32L4S9ZIY6TR (WLCSP-144(5.2x5.2)) - 3D模型 (WLCSP-144(5.2x5.2))

STM32L4S9ZIY6TR

ST·WLCSP-144(5.2x5.2)

READY

144P5.2×5.2×0.59mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L162VDY6XTR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L162VDY6XTR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.55mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-104(4.1x5.1) · 104P

STM32L152VEY6TR (WLCSP-104(4.1x5.1)) - 3D模型 (WLCSP-104(4.1x5.1))

STM32L152VEY6TR

ST·WLCSP-104(4.1x5.1)

READY

104P5.1×4.1×0.56mmP=0.4mm1.65 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-144(5.2x5.2) · 144P

STM32L4R9ZIY6TR (WLCSP-144(5.2x5.2)) - 3D模型 (WLCSP-144(5.2x5.2))

STM32L4R9ZIY6TR

ST·WLCSP-144(5.2x5.2)

READY

144P5.2×5.2×0.59mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H745IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H745IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm

嵌入式微控制器芯片 (MCU)

WLCSP-52(3.1x3.2) · 52P

STM32U385CGY6QTR (WLCSP-52(3.1x3.2)) - 3D模型 (WLCSP-52(3.1x3.2))

STM32U385CGY6QTR

ST·WLCSP-52(3.1x3.2)

READY

52P3.1×3.2×0.55mmP=0.39mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

WLCSP-72(3.8x4.4) · 72P

STM32L476JGY6TR (WLCSP-72(3.8x4.4)) - 3D模型 (WLCSP-72(3.8x4.4))

STM32L476JGY6TR

ST·WLCSP-72(3.8x4.4)

READY

72P3.8×4.4×0.56mmP=0.4mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-73(5x5) · 73P

STM32WL54JCI6 (UFBGA-73(5x5)) - 3D模型 (UFBGA-73(5x5))

STM32WL54JCI6

ST(意法半导体)·UFBGA-73(5x5)

READY

73P5.0×5.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-100(7x7) · 100P

STM32F373VCH6 (UFBGA-100(7x7)) - 3D模型 (UFBGA-100(7x7))

STM32F373VCH6

ST·UFBGA-100(7x7)

READY

100P7.0×7.0×0.53mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U575QGI6 (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U575QGI6

ST(意法半导体)·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

WLCSP24 · 24P

STM32C092ECY6TR (WLCSP24) - 3D模型 (WLCSP24)

STM32C092ECY6TR

ST(意法半导体)·WLCSP24

READY

24P2.6×1.7×0.55mmP=0.31mm

嵌入式微控制器芯片 (MCU)

VFBGA-424(14x14) · 424P

STM32MP257DAK3 (VFBGA-424(14x14)) - 3D模型 (VFBGA-424(14x14))

STM32MP257DAK3

ST·VFBGA-424(14x14)

READY

424P14.0×14.0×0.80mmP=0.5mm

嵌入式微控制器芯片 (MCU)

- · 40P

LCKFB-DKX-STM32F103C8T6 (-) - 3D模型 (-)

LCKFB-DKX-STM32F103C8T6

READY

40P53.3×22.9×3.85mm

嵌入式微控制器芯片 (MCU)

LFLGA-86 · 86P

STM32WB5MMGH6TR (LFLGA-86) - 3D模型 (LFLGA-86)

STM32WB5MMGH6TR

READY

86P11.0×7.3×1.15mmP=0.45mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265(14x14) · 265P

STM32H747XIH6 (TFBGA-265(14x14)) - 3D模型 (TFBGA-265(14x14))

STM32H747XIH6

ST·TFBGA-265(14x14)

READY

265P14.0×14.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H725IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H725IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm1.62 V to 3.6 V

嵌入式微控制器芯片 (MCU)

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