LQFP-48(7x7) · 48P预览PinoutFootprint尺寸3DCH9344LC2762852WCH·LQFP-48(7x7)READY48P7.0×7.0×1.40mmP=0.5mm标准电子与连接器元件
TSSOP-20 · 20P预览PinoutFootprint尺寸3DCH9431TC54973454WCH·TSSOP-20READY20P6.5×4.4×1.00mmP=0.65mm标准电子与连接器元件
WFBGA-84 · 84P预览PinoutFootprint尺寸3DEEC1005-I/SX1-UB1C1020290MICROCHIP·WFBGA-84READY84P7.0×7.0×1.35mmP=0.65mm标准电子与连接器元件
- · 38P预览PinoutFootprint尺寸3DESP32-DevKitCC571180ESPRESSIF·-READY38P27.9×48.2×3.85mm65 V ~ 2.0 V系列 ESP32-DEVKITC (3)Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
- · 38P预览PinoutFootprint尺寸3DESP32-DevKitC-32DC571181ESPRESSIF·-READY38P54.4×27.9×3.85mm65 V ~ 2.0 VWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
- · 49P预览PinoutFootprint尺寸3DESP32-DevKitC-S1C571183ESPRESSIF·-READY49P6.0×6.0×0.85mmP=0.4mm65 V ~ 2.0 VWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
QFN-104(10x10) · 105P预览PinoutFootprint尺寸3DESP32-P4NRW32C22387510ESPRESSIF·QFN-104(10x10)READY105P10.0×10.0×0.90mmP=0.35mmWi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组
SOT-23-6 · 6P预览PinoutFootprint尺寸3DFS8205AC2830320TECH PUBLIC·SOT-23-6READY6P2.9×1.6×1.10mmP=0.95mm标准电子与连接器元件
Through Hole,7.5x4.7mm · 4P预览PinoutFootprint尺寸3DHX-ESE24SH1-WC HBC49010094hanxia·Through Hole,7.5x4.7mmREADY4P7.9×8.6×4.20mm标准电子与连接器元件
QFN-28-EP(4x5) · 29P预览PinoutFootprint尺寸3DLE79271MQCTC2651981MICROCHIP·QFN-28-EP(4x5)READY29P5.0×4.0×0.85mmP=0.5mm标准电子与连接器元件
FPBGA-672 · 672P预览PinoutFootprint尺寸3DLFXP2-40E-5FN672CC1550776Lattice·FPBGA-672READY672P27.0×27.0×1.35mmP=1mm标准电子与连接器元件
VQFN-14(2x3) · 15P预览PinoutFootprint尺寸3DLX7219-02ILQ-TRC1849552MICROCHIP·VQFN-14(2x3)READY15P3.0×2.0×0.90mmP=0.5mm标准电子与连接器元件
FPBGA-144 · 144P预览PinoutFootprint尺寸3DM1A3P600-1FG144IC2615102MICROCHIP·FPBGA-144READY144P13.0×13.0×1.35mmP=1mm2.7 V to 3.6 V标准电子与连接器元件
FPBGA-484 · 484P预览PinoutFootprint尺寸3DM1A3PE1500-1FG484IC2615756MICROCHIP·FPBGA-484READY484P23.0×23.0×1.35mmP=1mm3 V to 3.6 V标准电子与连接器元件
FPBGA-484 · 484P预览PinoutFootprint尺寸3DM1A3PE1500-2FG484C2615772MICROCHIP·FPBGA-484READY484P23.0×23.0×1.35mmP=1mm3 V to 3.6 V标准电子与连接器元件
FBGA-676 · 676P预览PinoutFootprint尺寸3DM1AFS1500-2FG676IC2616248MICROCHIP·FBGA-676READY676P27.0×27.0×1.35mmP=1mm2.97 V to 3.63 V标准电子与连接器元件