3957 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3964 Bauteilen · Seite 4/248)

Zeige 49–64 von 3964 Bauteilen

SOIC-14 · 14P

MCP795W22-I/SL (SOIC-14) - 3D-Modell (SOIC-14)

MCP795W22-I/SL

MICROCHIP·SOIC-14

READY

14P8.7×3.9×1.75mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-40 · 40P

PIC18C452-I/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC18C452-I/P

MICROCHIP·PDIP-40

READY

40P50.3×13.7×4.20mmP=2.54mm2.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-100(12x12) · 100P

PIC32MX360F256L-80I/PT (TQFP-100(12x12)) - 3D-Modell (TQFP-100(12x12))

PIC32MX360F256L-80I/PT

MICROCHIP·TQFP-100(12x12)

READY

100P12.0×12.0×1.20mmP=0.4mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC18F44K22-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC18F44K22-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC24HJ128GP502-I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC24HJ128GP502-I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.90mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC18F4455-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC18F4455-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-20(4x4) · 21P

ATTINY85V-10MU (QFN-20(4x4)) - 3D-Modell (QFN-20(4x4))

ATTINY85V-10MU

MICROCHIP·QFN-20(4x4)

READY

21P4.0×4.0×0.80mmP=0.5mm1.8V - 2.4V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-18 · 18P

PIC16C56A-04/P (PDIP-18) - 3D-Modell (PDIP-18)

PIC16C56A-04/P

MICROCHIP·PDIP-18

READY

18P22.3×6.3×3.50mmP=2.54mm2.0V to 6.25V

Standard-Elektronik- & Steckverbinderbauteil

QFN-20-EP(4x4) · 21P

ATTINY24-20MU (QFN-20-EP(4x4)) - 3D-Modell (QFN-20-EP(4x4))

ATTINY24-20MU

MICROCHIP·QFN-20-EP(4x4)

READY

21P4.0×4.0×0.80mmP=0.5mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F767-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F767-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm2.7V-3.3V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18LF2480-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18LF2480-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-48(7x7) · 48P

PIC32MM0256GPM048-I/PT (TQFP-48(7x7)) - 3D-Modell (TQFP-48(7x7))

PIC32MM0256GPM048-I/PT

MICROCHIP·TQFP-48(7x7)

READY

48P7.0×7.0×1.20mmP=0.5mm2.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16LF876A-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16LF876A-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-40 · 40P

PIC16F877-04/P (PDIP-40) - 3D-Modell (PDIP-40)

PIC16F877-04/P

MICROCHIP·PDIP-40

READY

40P10.0×10.0×3.85mmP=2.54mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x2) · 9P

SY58604UMG-TR (DFN-8-EP(2x2)) - 3D-Modell (DFN-8-EP(2x2))

SY58604UMG-TR

MICROCHIP·DFN-8-EP(2x2)

READY

9P2.0×2.0×0.80mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-20 · 20P

ATF16LV8C-10XU (TSSOP-20) - 3D-Modell (TSSOP-20)

ATF16LV8C-10XU

MICROCHIP·TSSOP-20

READY

20P6.5×4.4×1.00mmP=0.65mm3.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

Entdecken Bauteile Gehäuse Hersteller Upload