3879 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3884 Bauteilen · Seite 226/243)

Zeige 3601–3616 von 3884 Bauteilen

SOT-23 · 3P

MCP1700T-3302E/TT(MS) (SOT-23) - 3D-Modell (SOT-23)

MCP1700T-3302E/TT(MS)

MSKSEMI·SOT-23

READY

3P2.9×1.3×1.10mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

ATTINY85-20SU (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

ATTINY85-20SU

MICROCHIP·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm1.8V - 2.4V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-16 · 16P

ULN2003ADR (SOIC-16) - 3D-Modell (SOIC-16)

ULN2003ADR

READY

16P9.9×3.9×1.75mmP=1.27mm6 V to 15 V

Standard-Elektronik- & Steckverbinderbauteil

DFN-8_L2.5-W2.5-P0.50-BL-EP · 9P

C77361 (DFN-8_L2.5-W2.5-P0.50-BL-EP) - 3D-Modell (DFN-8_L2.5-W2.5-P0.50-BL-EP)

C77361

Generic·DFN-8_L2.5-W2.5-P0.50-BL-EP

READY

9P2.5×2.5×1.00mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

FS8205A (SOT-23-6) - 3D-Modell (SOT-23-6)

FS8205A

TECH PUBLIC·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-6 · 6P

DW01A (SOT-23-6) - 3D-Modell (SOT-23-6)

DW01A

PJSEMI·SOT-23-6

READY

6P2.9×1.6×1.10mmP=0.95mm

Standard-Elektronik- & Steckverbinderbauteil

TO-92-3 · 3P

HT7333-A (TO-92-3) - 3D-Modell (TO-92-3)

HT7333-A

HOLTEK·TO-92-3

READY

3P4.9×3.7×4.60mmP=1.27mm4.5 V to 40 V

Standard-Elektronik- & Steckverbinderbauteil

TO-263-5 · 6P

XL4015E1 (TO-263-5) - 3D-Modell (TO-263-5)

XL4015E1

XLSEMI·TO-263-5

READY

6P10.1×9.0×4.50mmP=1.7mm8V to 36V

Standard-Elektronik- & Steckverbinderbauteil

SOP-16-300mil · 16P

PCF8574T (SOP-16-300mil) - 3D-Modell (SOP-16-300mil)

PCF8574T

HGSEMI·SOP-16-300mil

READY

16P10.3×7.5×2.10mmP=1.27mm2.5 to 6 V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL · 8P

C23069945 (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL) - 3D-Modell (SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL)

C23069945

Generic·SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

DIP-8 · 8P

DS1307ZN-778/HG (DIP-8) - 3D-Modell (DIP-8)

DS1307ZN-778/HG

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TSSOP-20 · 20P

STM32G030F6P6TR (TSSOP-20) - 3D-Modell (TSSOP-20)

STM32G030F6P6TR

READY

20P6.5×4.4×1.20mmP=0.65mm2.0 V to 3.6 V

Eingebetteter Mikrocontroller (MCU)

LQFP-48(7x7) · 48P

GD32F103C8T6 (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

GD32F103C8T6

GigaDevice Semicon Beijing·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-208mil · 8P

W25Q64JVSSIQ (SOIC-8-208mil) - 3D-Modell (SOIC-8-208mil)

W25Q64JVSSIQ

Winbond·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(5x5) · 29P

CP2102N-A02-GQFN28R (QFN-28-EP(5x5)) - 3D-Modell (QFN-28-EP(5x5))

CP2102N-A02-GQFN28R

SILICON LABS·QFN-28-EP(5x5)

READY

29P5.0×5.0×0.75mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LQFP-100(14x14) · 100P

STM32F103VET6 (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

STM32F103VET6

ST·LQFP-100(14x14)

READY

100P13.9×13.9×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

Entdecken Bauteile Gehäuse Hersteller Upload