3923 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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LQFP-48(7x7) · 48P

CH9350L (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

CH9350L

WCH·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

LQFP-128(14x14) · 128P

CH563L (LQFP-128(14x14)) - 3D-Modell (LQFP-128(14x14))

CH563L

WCH·LQFP-128(14x14)

READY

128P14.0×14.0×1.60mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

CH559T (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

CH559T

WCH·SSOP-20-208mil

READY

20P7.2×5.3×2.00mmP=0.65mm5V to 3.3V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

CH452A (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

CH452A

WCH·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm3V~5V

Standard-Elektronik- & Steckverbinderbauteil

LQFP-48(7x7) · 48P

CH9344L (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

CH9344L

WCH·LQFP-48(7x7)

READY

48P7.0×7.0×1.40mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SOP-28-300mil · 28P

CH453S (SOP-28-300mil) - 3D-Modell (SOP-28-300mil)

CH453S

WCH·SOP-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOP-16 · 16P

CH552G (SOP-16) - 3D-Modell (SOP-16)

CH552G

READY

16P9.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

CH558T (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

CH558T

WCH·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

QFN-16(3x3) · 17P

CH282P (QFN-16(3x3)) - 3D-Modell (QFN-16(3x3))

CH282P

WCH(南京沁恒)·QFN-16(3x3)

READY

17P3.0×3.0×0.85mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

CH372 (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

CH372

WCH·SSOP-20-208mil

READY

20P7.2×5.3×2.00mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20 · 20P

CH372B (SSOP-20) - 3D-Modell (SSOP-20)

CH372B

READY

20P7.2×5.3×1.85mmP=0.65mm3.3V to 5V

Standard-Elektronik- & Steckverbinderbauteil

SOP-28-300mil · 28P

CH340S (SOP-28-300mil) - 3D-Modell (SOP-28-300mil)

CH340S

WCH·SOP-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm3.3V to 5V

Schnittstellen-Bridge & Takt-/Timer-IC

- · 100P

CH32V307VCT6+CH32V307V-EVT-R1 (-) - 3D-Modell (-)

CH32V307VCT6+CH32V307V-EVT-R1

READY

100P14.0×14.0×1.40mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

Through Hole,Right Angle,P=2mm · 10P

HX PM2.0-2x5P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x5P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

10P10.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole · 3P

H3-B1-1D00S (Through Hole) - 3D-Modell (Through Hole)

H3-B1-1D00S

Kinghor·Through Hole

READY

3P18.5×8.1×9.50mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

Through Hole,Right Angle,P=2mm · 14P

HX PM2.0-2x7P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-2x7P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

14P14.4×6.4×6.35mmP=2mm

Standard-Elektronik- & Steckverbinderbauteil

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