4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4124 Bauteilen · Seite 2/258)

Zeige 17–32 von 4124 Bauteilen

SOIC-28-300mil · 28P

PIC18F2458T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18F2458T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC18F45K40T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC18F45K40T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC18F14K50T-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC18F14K50T-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.50mmP=1.27mm1.8V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

MCP6292-H/MS (MSOP-8) - 3D-Modell (MSOP-8)

MCP6292-H/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm2.4V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-100-EP(12x12) · 101P

USB7051T-I/KDX (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB7051T-I/KDX

MICROCHIP·VQFN-100-EP(12x12)

READY

101P12.0×12.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

MIC5219-2.5YMM-TR (MSOP-8) - 3D-Modell (MSOP-8)

MIC5219-2.5YMM-TR

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm1V to 12V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC18LF27K40T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC18LF27K40T-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.90mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F18855T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F18855T-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.90mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8-EP · 9P

MIC4129YME-TR (SOIC-8-EP) - 3D-Modell (SOIC-8-EP)

MIC4129YME-TR

MICROCHIP·SOIC-8-EP

READY

9P4.9×3.9×1.70mmP=1.27mm4.5V to 20V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC18LF2320T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC18LF2320T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.0V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8-EP · 9P

MIC5282-3.3YMM-TR (MSOP-8-EP) - 3D-Modell (MSOP-8-EP)

MIC5282-3.3YMM-TR

MICROCHIP·MSOP-8-EP

READY

9P4.9×3.9×1.10mmP=1.27mm6V to 120V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

PIC16F15376T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

PIC16F15376T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×1.00mmP=0.5mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-20-208mil · 20P

PIC16LF18446T-I/SS (SSOP-20-208mil) - 3D-Modell (SSOP-20-208mil)

PIC16LF18446T-I/SS

MICROCHIP·SSOP-20-208mil

READY

20P7.2×5.3×1.85mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

24LC04BH-I/P (PDIP-8) - 3D-Modell (PDIP-8)

24LC04BH-I/P

MICROCHIP·PDIP-8

READY

8P3.0×2.0×3.85mmP=2.54mm1.7V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-8 · 8P

93C46C-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

93C46C-E/SN

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TDFN-8-EP(2x3) · 9P

24FC64T-I/MNY (TDFN-8-EP(2x3)) - 3D-Modell (TDFN-8-EP(2x3))

24FC64T-I/MNY

MICROCHIP·TDFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

Entdecken Bauteile Gehäuse Hersteller Upload