Elektronischer Bauteilkatalog — Schaltplansymbole, IPC-7351B Footprints & 3D STEP/GLB (Gehäuse PLCC · Hersteller MICROCHIP(美国微芯))

PBGA-324(23x23) · 324P

ZL50116GAG2

C1549019

MICROCHIP(美国微芯)·PBGA-324(23x23)

READY

324P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6102HI1A-000.0000T

C2650841

MICROCHIP(美国微芯)·SMD1612-4P

READY

4P1.6×1.2×2.00mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

TO-204AA(TO-3) · 8P

2N6384

C5487740

MICROCHIP(美国微芯)·TO-204AA(TO-3)

READY

8P

2N6384

TO-264 · 8P

APT70GR120L

C17422812

MICROCHIP(美国微芯)·TO-264

READY

8P

APT70GR120L

PLCC-20(9x9) · 8P

AT17LV512A-10JC

C17384612

MICROCHIP(美国微芯)·PLCC-20(9x9)

READY

8P

AT17LV512A-10JC

MAP-8(3x4.9) · 8P

AT25010AY1-10YI-1.8

C19574203

MICROCHIP(美国微芯)·MAP-8(3x4.9)

READY

8P

SPI兼容、多电压工作的EEPROM

TSOP-32 · 8P

AT27C020-90TI

C19378623

MICROCHIP(美国微芯)·TSOP-32

READY

8P

低功耗高性能一次性可编程只读存储器

VSOP-40 · 8P

AT27C4096-12VC

C19332244

MICROCHIP(美国微芯)·VSOP-40

READY

8P

低功耗高性能OTP EPROM

PLCC-44(16.6x16.6) · 8P

AT27C4096-70JI

C19365074

MICROCHIP(美国微芯)·PLCC-44(16.6x16.6)

READY

8P

AT27C4096-70JI

SOIC-8-150mil · 8P

ATA663254-GAQW-VAO

C5225729

MICROCHIP(美国微芯)·SOIC-8-150mil

READY

8P

LIN系统基础芯片，包括LIN收发器和电压调节器

SSOP-20 · 8P

ATTINY826-XUR

C3235604

MICROCHIP(美国微芯)·SSOP-20

READY

8P

tinyAVR 2 系列微控制器，采用 AVR CPU，最高运行频率 20MHz，具备 4/8KB Flash、512B/1KB SRAM 和 128B EEPROM

- · 8P

FDC9216BP

C20579389

MICROCHIP(美国微芯)·-

READY

8P

软盘数据分离器

TO-204AA(TO-3) · 8P

JAN2N6383

C7290741

MICROCHIP(美国微芯)·TO-204AA(TO-3)

READY

8P

JAN2N6383

TQFP-48(7x7) · 8P

MAX3674ECM2T

C2664710

MICROCHIP(美国微芯)·TQFP-48(7x7)

READY

8P

MAX3674ECM2T

SOT-23-6 · 8P

MIC281-1YM6

C17438178

MICROCHIP(美国微芯)·SOT-23-6

READY

8P

低成本远程温度传感器

QFN-24(4x4) · 8P

SM802124UMG-TR

C2662613

MICROCHIP(美国微芯)·QFN-24(4x4)

READY

8P

SM802124UMG TR

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