PIC32MX130F064B-I/SS (SSOP-28-208mil) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC32MX130F064B-I/SS (SSOP-28-208mil)?

Manufactured by MICROCHIP, the PIC32MX130F064B-I/SS is housed in a SSOP-28-208mil package with 28 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.3V to 3.6V. Key pins include: 1 (MCLR: Multiplexed I/O & Peripheral Pin MCLR (General)), 2 (VREF+: Multiplexed I/O & Peripheral Pin VREF+ (General)), 3 (VREF-: Multiplexed I/O & Peripheral Pin VREF- (General)), 4 (PGED1: Multiplexed I/O & Peripheral Pin PGED1 (General)), 5 (PGEC1: Multiplexed I/O & Peripheral Pin PGEC1 (General)), 6 (CTED13: Multiplexed I/O & Peripheral Pin CTED13 (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC32MX130F064B-I/SS?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC32MX130F064B-I/SS (SSOP-28-208mil) has a nominal body envelope of 5.30 × 10.20 mm, pitch e = 0.65 mm, and 28 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC32MX130F064B-I/SS?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC32MX130F064B-I/SS (MICROCHIP, SSOP-28-208mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 5.30mm × 10.20mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (28/28)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	MCLR	I/O	Multiplexed I/O & Peripheral Pin MCLR (General)
2	VREF+	Analog	Multiplexed I/O & Peripheral Pin VREF+ (General)
3	VREF-	Analog	Multiplexed I/O & Peripheral Pin VREF- (General)
4	PGED1	I/O	Multiplexed I/O & Peripheral Pin PGED1 (General)
5	PGEC1	I/O	Multiplexed I/O & Peripheral Pin PGEC1 (General)
6	CTED13	I/O	Multiplexed I/O & Peripheral Pin CTED13 (General)
7	C2INC	I/O	Multiplexed I/O & Peripheral Pin C2INC (General)
8	VSS	GND	Ground Reference Pin (VSS)
9	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
10	PMA0	I/O	Multiplexed I/O & Peripheral Pin PMA0 (General)
11	RB4	I/O	Multiplexed I/O & Peripheral Pin RB4 (General)
12	CTED9	I/O	Multiplexed I/O & Peripheral Pin CTED9 (General)
13	VDD	Power	Power Supply Input (VDD — 2.3V to 3.6V)
14	RB5	I/O	Multiplexed I/O & Peripheral Pin RB5 (General)
15	PGEC3/RPB6/PMD6/RB6	I/O	Multiplexed I/O & Peripheral Pin PGEC3/RPB6/PMD6/RB6 (General)
16	CTED3	I/O	Multiplexed I/O & Peripheral Pin CTED3 (General)
17	CTED10	I/O	Multiplexed I/O & Peripheral Pin CTED10 (General)
18	CTED4	I/O	Multiplexed I/O & Peripheral Pin CTED4 (General)
19	VSS	GND	Ground Reference Pin (VSS)
20	VCAP	I/O	Multiplexed I/O & Peripheral Pin VCAP (General)
21	PGED2	I/O	Multiplexed I/O & Peripheral Pin PGED2 (General)
22	PGEC2	I/O	Multiplexed I/O & Peripheral Pin PGEC2 (General)
23	AN12/PMD0/RB12	I/O	Multiplexed I/O & Peripheral Pin AN12/PMD0/RB12 (General)
24	CTPLS	I/O	Multiplexed I/O & Peripheral Pin CTPLS (General)
25	CTED5	I/O	Multiplexed I/O & Peripheral Pin CTED5 (General)
26	CTED6	I/O	Multiplexed I/O & Peripheral Pin CTED6 (General)
27	AVSS	GND	Ground Reference Pin (AVSS)
28	AVDD	Power	Power Supply Input (AVDD — 2.3V to 3.6V)

PIN 1 MCLR

I/O

Multiplexed I/O & Peripheral Pin MCLR (General)

Design note: MasterClear(Reset)input Thispinisan . active-low Reset to the device .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 12 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 2. Standard Pinout (Top View)

True package pinout (28 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 4. Package Dimensions (D×E×A)

SSOP-28-208mil · 5.30×10.20mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 5. Recommended Land Pattern

IPC-7351B Footprint (28 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (12 figures · Page 1/1)

Showing 1–12 of 12 uncropped original figures for PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1

P1 · p01_fig01377×200px

PIC32MX130F064B-I/SS (SSOP-28-208mil) — 32-bit Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

32-bit Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

P19 · p19_fig011548×1545px

FIGURE 1-1: BLOCK DIAGRAM

P31 · p31_fig011730×1260px

FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

P31 · p31_fig021549×666px

FIGURE 2-6: AUDIO PLAYBACK APPLICATION

P31 · p31_fig01P31

Datasheet Page 31 (p31_fig01)

P32 · p32_fig011446×720px

FIGURE 2-7: REMOTE CIRCUIT WITH AN INDEPENDENT POWER SOURCE

P33 · p33_fig011684×740px

FIGURE 2-8: DIGITAL AND ANALOG SIGNAL ISOLATION

P131 · p131_fig01867×929px

FIGURE 11-2: REMAPPABLE INPUT EXAMPLE FOR U1RX

P191 · p191_fig011587×671px

Figure 20-1 illustrates the PMP module block diagram.

P191 · p191_fig021195×1043px

FIGURE 20-1: PMP MODULE PINOUT AND CONNECTIONS TO EXTERNAL DEVICES

P191 · p191_fig02P191

Datasheet Page 191 (p191_fig02)

P313 · p313_fig011778×2571px

PIC32MX1XX/2XX 28/36/44-PIN FAMILY

Technical Specifications & Part Details (PIC32MX130F064B-I/SS)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC32MX130F064B-I/SS (SSOP-28-208mil) is a 28-pin standard electronic & interconnect component featuring a 10.20 × 5.30 × 2.00 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 2.3V to 3.6V supply operation across -40°C to +85°C with integrated USB, UART, SPI, I2C, I2S, ADC, JTAG / SWD, IrDA interfaces.

Operating Supply VoltageV_CC / V_DD

2.3V to 3.6V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

40 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

10.20 × 5.30 × 2.00 mm (A1=0.15 mm)

Package family: TSSOP (SSOP-28-208mil)

Pin Count & Lead PitchN / e

28 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

USB, UART, SPI, I2C, I2S, ADC, JTAG / SWD, IrDA

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol28 auto-grouped pins

IPC-7351B Land Pattern28 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

IPC-7351B

Family Variants & Same Datasheet Chips — PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (5)

Select package variant or sibling MPN sharing this datasheet

SOIC-28-300mil · 28P

PIC32MX150F128B-I/SO

MICROCHIP·SOIC-28-300mil

IPC-7351B

28P17.9×7.5×2.70mmP=1.27mm

PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (SOIC-28-300mil)

SSOP-28-208mil · 28P

PIC32MX130F064B-I/SS

MICROCHIP·SSOP-28-208mil

IPC-7351B

28P10.2×5.3×2.00mmP=0.65mm

PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (SSOP-28-208mil)

QFN-28-EP(6x6) · 29P

PIC32MX170F256B-I/ML

MICROCHIP·QFN-28-EP(6x6)

IPC-7351B

29P6.0×6.0×1.00mmP=0.65mm

PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (QFN-28-EP(6x6))

TQFP-44(10x10) · 44P

PIC32MX150F128D-I/PT

MICROCHIP·TQFP-44(10x10)

IPC-7351B

44P10.0×10.0×1.20mmP=0.8mm

PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (TQFP-44(10x10))

QFN-44-EP(8x8) · 45P

PIC32MX250F128D-50I/ML

MICROCHIP·QFN-44-EP(8x8)

IPC-7351B

45P8.0×8.0×0.90mmP=0.65mm

PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 (QFN-44-EP(8x8))

Mechanical Dimensions & Land Pattern (SSOP-28-208mil)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

10.20 × 5.30 mm

Height (A) & Pitch (e)IPC-7351B

A=2.00mm · e=0.65mm

Pad Size (W × L)Level B

0.42 × 1.60 mm

Pins / Total PadsTopology

28P / 28Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit SSOP-28-208mil	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC32MX130F064B-I/SS (SSOP-28-208mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC32MX130F064B-I/SS (SSOP-28-208mil)?

Manufactured by MICROCHIP, the PIC32MX130F064B-I/SS is housed in a SSOP-28-208mil package with 28 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 2.3V to 3.6V. Key pins include: 1 (MCLR: Multiplexed I/O & Peripheral Pin MCLR (General)), 2 (VREF+: Multiplexed I/O & Peripheral Pin VREF+ (General)), 3 (VREF-: Multiplexed I/O & Peripheral Pin VREF- (General)), 4 (PGED1: Multiplexed I/O & Peripheral Pin PGED1 (General)), 5 (PGEC1: Multiplexed I/O & Peripheral Pin PGEC1 (General)), 6 (CTED13: Multiplexed I/O & Peripheral Pin CTED13 (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC32MX130F064B-I/SS?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC32MX130F064B-I/SS (SSOP-28-208mil) has a nominal body envelope of 5.30 × 10.20 mm, pitch e = 0.65 mm, and 28 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC32MX130F064B-I/SS?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC32MX130F064B-I/SS (MICROCHIP, SSOP-28-208mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (28 pins) & PIC32MX130F0 / PIC32MX150F1 / PIC32MX250F1 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	MCLR	Digital_IO	Signal terminal MCLR (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: MCLR. Supported peripheral buses: General.
2	VREF+	Analog	Signal terminal VREF+ (Analog, 2.3V to 3.6V domain). Multiplexed alternate functions: VREF+. Supported peripheral buses: General.
3	VREF-	Analog	Signal terminal VREF- (Analog, 2.3V to 3.6V domain). Multiplexed alternate functions: VREF-. Supported peripheral buses: General.
4	PGED1	Digital_IO	Signal terminal PGED1 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PGED1. Supported peripheral buses: General.
5	PGEC1	Digital_IO	Signal terminal PGEC1 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PGEC1. Supported peripheral buses: General.
6	CTED13	Digital_IO	Signal terminal CTED13 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED13. Supported peripheral buses: General.
7	C2INC	Digital_IO	Signal terminal C2INC (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: C2INC. Supported peripheral buses: General.
8	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
9	RA2	Digital_IO	Signal terminal RA2 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
10	PMA0	Digital_IO	Signal terminal PMA0 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PMA0. Supported peripheral buses: General.
11	RB4	Digital_IO	Signal terminal RB4 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
12	CTED9	Digital_IO	Signal terminal CTED9 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED9. Supported peripheral buses: General.
13	VDD	Power_In	Primary positive power supply input (VDD) operating in the 2.3V to 3.6V domain (Max rating: 3.6V).
14	RB5	Digital_IO	Signal terminal RB5 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
15	PGEC3/RPB6/PMD6/RB6	Digital_IO	Signal terminal PGEC3/RPB6/PMD6/RB6 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PGEC3/RPB6/PMD6/RB6. Supported peripheral buses: General.
16	CTED3	Digital_IO	Signal terminal CTED3 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED3. Supported peripheral buses: General.
17	CTED10	Digital_IO	Signal terminal CTED10 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED10. Supported peripheral buses: General.
18	CTED4	Digital_IO	Signal terminal CTED4 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED4. Supported peripheral buses: General.
19	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
20	VCAP	Digital_IO	Signal terminal VCAP (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: VCAP. Supported peripheral buses: General.
21	PGED2	Digital_IO	Signal terminal PGED2 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PGED2. Supported peripheral buses: General.
22	PGEC2	Digital_IO	Signal terminal PGEC2 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: PGEC2. Supported peripheral buses: General.
23	AN12/PMD0/RB12	Digital_IO	Signal terminal AN12/PMD0/RB12 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: AN12/PMD0/RB12. Supported peripheral buses: General.
24	CTPLS	Digital_IO	Signal terminal CTPLS (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTPLS. Supported peripheral buses: General.
25	CTED5	Digital_IO	Signal terminal CTED5 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED5. Supported peripheral buses: General.
26	CTED6	Digital_IO	Signal terminal CTED6 (I/O, 2.3V to 3.6V domain). Multiplexed alternate functions: CTED6. Supported peripheral buses: General.
27	AVSS	GND	0V electrical ground return terminal (AVSS) for internal core logic, I/O drivers, and analog sub-blocks.
28	AVDD	Power_In	Primary positive power supply input (AVDD) operating in the 2.3V to 3.6V domain (Max rating: 3.6V).

4D Studio: PIC32MX130F064B-I/SS Permalink: /part/C184850 MICROCHIP SSOP-28-208mil All Packages All Manufacturers