Mechanical Dimensions & Land Pattern (DFN-8-EP(2x3))
Extracted from Datasheet & IPC-7351B NormalizedRecommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit DFN-8-EP(2x3) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — PIC12F1501-E/MC (DFN-8-EP(2x3))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of PIC12F1501-E/MC (DFN-8-EP(2x3))?
Manufactured by MICROCHIP, the PIC12F1501-E/MC is housed in a DFN-8-EP(2x3) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 1.8V to 3.6V. Key pins include: 1 (VDD: Power Supply Input (VDD — 1.8V to 3.6V)), 2 (RA5: Multiplexed I/O & Peripheral Pin RA5 (General)), 3 (RA4: Multiplexed I/O & Peripheral Pin RA4 (General)), 4 (MCLR#/VPP/RA3: Multiplexed I/O & Peripheral Pin MCLR#/VPP/RA3 (General)), 5 (RA2: Multiplexed I/O & Peripheral Pin RA2 (General)), 6 (RA1/ICSPCLK: Multiplexed I/O & Peripheral Pin RA1/ICSPCLK (General)).
What are the IPC-7351B PCB Footprint dimensions for PIC12F1501-E/MC?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC12F1501-E/MC (DFN-8-EP(2x3)) has a nominal body envelope of 2.00 × 3.00 mm, pitch e = 0.50 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 1.75 × 1.55 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC12F1501-E/MC?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC12F1501-E/MC (MICROCHIP, DFN-8-EP(2x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (9 pins) & PIC12F1501 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | VDD | Power_In | Primary positive power supply input (VDD) operating in the 1.8V to 3.6V domain (Max rating: 3.6V). |
| 2 | RA5 | Digital_IO | Signal terminal RA5 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA5. Supported peripheral buses: General. |
| 3 | RA4 | Digital_IO | Signal terminal RA4 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General. |
| 4 | MCLR#/VPP/RA3 | Digital_IO | Signal terminal MCLR#/VPP/RA3 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: MCLR#/VPP/RA3. Supported peripheral buses: General. |
| 5 | RA2 | Digital_IO | Signal terminal RA2 (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General. |
| 6 | RA1/ICSPCLK | Digital_IO | Signal terminal RA1/ICSPCLK (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA1/ICSPCLK. Supported peripheral buses: General. |
| 7 | RA0/ICSPDAT | Digital_IO | Signal terminal RA0/ICSPDAT (I/O, 1.8V to 3.6V domain). Multiplexed alternate functions: RA0/ICSPDAT. Supported peripheral buses: General. |
| 8 | VSS | GND | 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks. |
| 9 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |