SY89230UMG (QFN-16(3x3)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of SY89230UMG (QFN-16(3x3))?

Manufactured by MICROCHIP, the SY89230UMG is housed in a QFN-16(3x3) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (VT: Multiplexed I/O & Peripheral Pin VT (General)), 3 (VREF AC -: Multiplexed I/O & Peripheral Pin VREF AC - (General)), 4 (IN#: Multiplexed I/O & Peripheral Pin IN# (General)), 5 (EN: System Enable & Hardware Reset (EN)), 6 (/MR: Multiplexed I/O & Peripheral Pin /MR (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for SY89230UMG?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY89230UMG (QFN-16(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 1.50 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY89230UMG?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY89230UMG (MICROCHIP, QFN-16(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (17/17)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	IN	I/O	Multiplexed I/O & Peripheral Pin IN (General)
2	VT	I/O	Multiplexed I/O & Peripheral Pin VT (General)
3	VREF AC -	Analog	Multiplexed I/O & Peripheral Pin VREF AC - (General)
4	IN#	I/O	Multiplexed I/O & Peripheral Pin IN# (General)
5	EN	I	System Enable & Hardware Reset (EN)
6	/MR	I/O	Multiplexed I/O & Peripheral Pin /MR (General)
7	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
8	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
9	Q /Q ,	I/O	Multiplexed I/O & Peripheral Pin Q /Q , (General)
10	GND	GND	Ground Reference Pin (GND)
11	GND	GND	Ground Reference Pin (GND)
12	Q /Q ,	I/O	Multiplexed I/O & Peripheral Pin Q /Q , (General)
13	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
14	GND	GND	Ground Reference Pin (GND)
15	GND	GND	Ground Reference Pin (GND)
16	DIV_SEL	I/O	Multiplexed I/O & Peripheral Pin DIV_SEL (General)
17	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 IN

I/O

Multiplexed I/O & Peripheral Pin IN (General)

Design note: Signal terminal IN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 5 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

SY89230UMG (QFN-16(3x3)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

SY89230UMG (QFN-16(3x3)) - 2. Standard Pinout (Top View)

True package pinout (17 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

SY89230UMG (QFN-16(3x3)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

SY89230UMG (QFN-16(3x3)) - 4. Package Dimensions (D×E×A)

QFN-16(3x3) · 3.00×3.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

SY89230UMG (QFN-16(3x3)) - 5. Recommended Land Pattern

IPC-7351B Footprint (17 Pads)Expand ›

6. Application SchematicSCHEMATIC

SY89230UMG (QFN-16(3x3)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (5 figures · Page 1/1)

Showing 1–5 of 5 uncropped original figures for SY89230

P2 · p02_fig01EXACT PACKAGE

16-Pin QFN

P15 · p15_fig01EXACT PACKAGE

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

P1 · p01_fig01700×137px

General Description

P1 · p01_fig02838×487px

Block Diagram

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

Technical Specifications & Part Details (SY89230UMG)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:SY89230UMG (QFN-16(3x3)) is a 16-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 0.85 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across 40°C to +85°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

1.8V ~ 5.5V (Theo Datasheet)

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

3.2GHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 0.85 mm (A1=0.03 mm)

Package family: QFN (QFN-16(3x3))

Pin Count & Lead PitchN / e

16 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol17 auto-grouped pins

IPC-7351B Land Pattern17 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 1.50×1.50mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-16(3x3))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=0.85mm · e=0.50mm

Pad Size (W × L)Level B

0.28 × 0.80 mm

Pins / Total PadsTopology

17P / 17Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit QFN-16(3x3)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — SY89230UMG (QFN-16(3x3))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of SY89230UMG (QFN-16(3x3))?

Manufactured by MICROCHIP, the SY89230UMG is housed in a QFN-16(3x3) package with 17 pins and a 0.50 mm lead pitch. Key pins include: 1 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 2 (VT: Multiplexed I/O & Peripheral Pin VT (General)), 3 (VREF AC -: Multiplexed I/O & Peripheral Pin VREF AC - (General)), 4 (IN#: Multiplexed I/O & Peripheral Pin IN# (General)), 5 (EN: System Enable & Hardware Reset (EN)), 6 (/MR: Multiplexed I/O & Peripheral Pin /MR (General)).

What are the IPC-7351B PCB Footprint dimensions for SY89230UMG?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY89230UMG (QFN-16(3x3)) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 17 copper pads plus a central exposed thermal pad (EPAD) of 1.50 × 1.50 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY89230UMG?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY89230UMG (MICROCHIP, QFN-16(3x3)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (17 pins) & SY89230 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	IN	Digital_IO	Signal terminal IN (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
2	VT	Digital_IO	Signal terminal VT (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VT. Supported peripheral buses: General.
3	VREF AC -	Analog	Signal terminal VREF AC - (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF AC -. Supported peripheral buses: General.
4	IN#	Digital_IO	Signal terminal IN# (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: IN#. Supported peripheral buses: General.
5	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
6	/MR	Digital_IO	Signal terminal /MR (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: /MR. Supported peripheral buses: General.
7	NC	NC	Signal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
8	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
9	Q /Q ,	Digital_IO	Signal terminal Q /Q , (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: Q /Q ,. Supported peripheral buses: General.
10	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
11	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
12	Q /Q ,	Digital_IO	Signal terminal Q /Q , (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: Q /Q ,. Supported peripheral buses: General.
13	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
14	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
15	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
16	DIV_SEL	Digital_IO	Signal terminal DIV_SEL (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: DIV_SEL. Supported peripheral buses: General.
17	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

4D Studio: SY89230UMG Permalink: /part/C631874 MICROCHIP QFN-16(3x3)All Packages All Manufacturers