TC1303C-ZS0EUNTR (MSOP-10) — Symbol, Footprint IPC-7351B & 3D STEP Model

TC1303C-ZS0EUNTR

MICROCHIPMSOP-10 · 10 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · TC1303C-ZS0EUNTR (MSOP-10)1—2V IN23V OUT24PG5A GND10P GND9L X8V IN17—6V /V FB OUT1Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
12345678910E=3.00mm · Pitch e=0.50mmD=3.00mm-5-4-3-2-10123453210-1-2-3mm
3. 3D CAD MODEL
Package Body: 3.00mm × 3.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (10/10)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1—I/OMultiplexed I/O & Peripheral Pin — (General)
2V IN2I/OMultiplexed I/O & Peripheral Pin V IN2 (General)
3V OUT2I/OMultiplexed I/O & Peripheral Pin V OUT2 (General)
4PGI/OMultiplexed I/O & Peripheral Pin PG (General)
5A GNDGNDGround Reference Pin (A GND)
6V /V FB OUT1I/OMultiplexed I/O & Peripheral Pin V /V FB OUT1 (General)
7—I/OMultiplexed I/O & Peripheral Pin — (General)
8V IN1I/OMultiplexed I/O & Peripheral Pin V IN1 (General)
9L XI/OMultiplexed I/O & Peripheral Pin L X (General)
10P GNDGNDGround Reference Pin (P GND)
PIN 1 —
I/O
Multiplexed I/O & Peripheral Pin — (General)
Design note: ActiveLowShutdownInputbothBuckRegulatorOutputandLDOOutput . Initiatessequencingupanddown
IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 14 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
1. Realistic 3D PackageREPRESENTATIVE
TC1303C-ZS0EUNTR (MSOP-10) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
TC1303C-ZS0EUNTR (MSOP-10) - 2. Standard Pinout (Top View)
True package pinout (10 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
TC1303C-ZS0EUNTR (MSOP-10) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
TC1303C-ZS0EUNTR (MSOP-10) - 4. Package Dimensions (D×E×A)
MSOP-10 · 3.00×3.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
TC1303C-ZS0EUNTR (MSOP-10) - 5. Recommended Land Pattern
IPC-7351B Footprint (10 Pads)Expand ›
6. Application SchematicSCHEMATIC
TC1303C-ZS0EUNTR (MSOP-10) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (14 figures · Page 1/2)
Showing 1–12 of 14 uncropped original figures for TC1304 / TC1303
P27 · p27_fig01EXACT PACKAGE
TC1303C-ZS0EUNTR (MSOP-10) — FIGURE 5-1: Component Placement, Fixed 10-Pin MSOP.
FIGURE 5-1: Component Placement, Fixed 10-Pin MSOP.
P27 · p27_fig02EXACT PACKAGE
TC1303C-ZS0EUNTR (MSOP-10) — FIGURE 5-2: Component Placement, Fixed 10-Pin DFN.
FIGURE 5-2: Component Placement, Fixed 10-Pin DFN.
P2 · p02_fig011157×602px
TC1303C-ZS0EUNTR (MSOP-10) — TC1303A/TC1303B/TC1303C/TC1304
TC1303A/TC1303B/TC1303C/TC1304
P2 · p02_fig021160×493px
TC1303C-ZS0EUNTR (MSOP-10) — TC1304
TC1304
P2 · p02_fig031459×497px
TC1303C-ZS0EUNTR (MSOP-10) — 10-Lead DFN 10-Lead MSOP | 1 | 2 | 6 | 8 | 7 | 9 | 10 | 5 | 4 | 3 | SHDN | VIN2 VOUT2 | AGND | PGND | LX VIN1 | VFB1/VOUT1 | PG AGND | TC1304 | VFB1/VOUT1 | VOUT2 | VIN2 | PG | LX VIN1 | 1 | 2 | 3 4 | 10 | 9 | 8 7 AGND | PGND SHDN | EP | 11
10-Lead DFN 10-Lead MSOP | 1 | 2 | 6 | 8 | 7 | 9 | 10 | 5 | 4 | 3 | SHDN | VIN2 VOUT2 | AGND | PGND | LX VIN1 | VFB1/VOUT1 | PG AGND | TC1304 | VFB1/VOUT1 | VOUT2 | VIN2 | PG | LX VIN1 | 1 | 2 | 3 4 | 10 | 9 | 8 7 AGND | PGND SHDN | EP | 11
P5 · p05_fig011530×636px
TC1303C-ZS0EUNTR (MSOP-10) — Typical Application Circuits
Typical Application Circuits
P5 · p05_fig021663×702px
TC1303C-ZS0EUNTR (MSOP-10) — TC1304
TC1304
P5 · p05_fig031463×679px
TC1303C-ZS0EUNTR (MSOP-10) — © 2008 Microchip Technology Inc. DS21949C-page 5
© 2008 Microchip Technology Inc. DS21949C-page 5
P5 · p05_fig01P5
TC1303C-ZS0EUNTR (MSOP-10) — Datasheet Page 5 (p05_fig01)
Datasheet Page 5 (p05_fig01)
P26 · p26_fig011778×1906px
TC1303C-ZS0EUNTR (MSOP-10) — 5.5 Inductor Selection
5.5 Inductor Selection
P27 · p27_fig01P27
TC1303C-ZS0EUNTR (MSOP-10) — Datasheet Page 27 (p27_fig01)
Datasheet Page 27 (p27_fig01)
P29 · p29_fig011779×1498px
TC1303C-ZS0EUNTR (MSOP-10) — TC1303A/TC1303B/TC1303C/TC1304
TC1303A/TC1303B/TC1303C/TC1304
Page 1 / 2 (14 extracted figures)

Technical Specifications & Part Details (TC1303C-ZS0EUNTR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:TC1303C-ZS0EUNTR (MSOP-10) is a 10-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.10 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 8V to 4.5V supply operation across -40°C to +125°C with integrated USB, PWM interfaces.
Operating Supply VoltageV_CC / V_DD
8V to 4.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
2.0 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
65 µA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
3.00 × 3.00 × 1.10 mm (A1=0.08 mm)
Package family: TSSOP (MSOP-10)
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB, PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol10 auto-grouped pins
OK
IPC-7351B Land Pattern10 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MSOP-10)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
3.00 × 3.00 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=0.50mm
Pad Size (W × L)Level B
0.30 × 1.25 mm
Pins / Total PadsTopology
10P / 10Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
MSOP-10
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — TC1303C-ZS0EUNTR (MSOP-10)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of TC1303C-ZS0EUNTR (MSOP-10)?

Manufactured by MICROCHIP, the TC1303C-ZS0EUNTR is housed in a MSOP-10 package with 10 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 8V to 4.5V. Key pins include: 1 (—: Multiplexed I/O & Peripheral Pin — (General)), 2 (V IN2: Multiplexed I/O & Peripheral Pin V IN2 (General)), 3 (V OUT2: Multiplexed I/O & Peripheral Pin V OUT2 (General)), 4 (PG: Multiplexed I/O & Peripheral Pin PG (General)), 5 (A GND: Ground Reference Pin (A GND)), 6 (V /V FB OUT1: Multiplexed I/O & Peripheral Pin V /V FB OUT1 (General)).

What are the IPC-7351B PCB Footprint dimensions for TC1303C-ZS0EUNTR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), TC1303C-ZS0EUNTR (MSOP-10) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.50 mm, and 10 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for TC1303C-ZS0EUNTR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for TC1303C-ZS0EUNTR (MICROCHIP, MSOP-10) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (10 pins) & TC1304 / TC1303 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1—Digital_IOSignal terminal — (I/O, 8V to 4.5V domain). Multiplexed alternate functions: —. Supported peripheral buses: General.
2V IN2Digital_IOSignal terminal V IN2 (I/O, 8V to 4.5V domain). Multiplexed alternate functions: V IN2. Supported peripheral buses: General.
3V OUT2Digital_IOSignal terminal V OUT2 (I/O, 8V to 4.5V domain). Multiplexed alternate functions: V OUT2. Supported peripheral buses: General.
4PGDigital_IOSignal terminal PG (I/O, 8V to 4.5V domain). Multiplexed alternate functions: PG. Supported peripheral buses: General.
5A GNDGND0V electrical ground return terminal (A GND) for internal core logic, I/O drivers, and analog sub-blocks.
6V /V FB OUT1Digital_IOSignal terminal V /V FB OUT1 (I/O, 8V to 4.5V domain). Multiplexed alternate functions: V /V FB OUT1. Supported peripheral buses: General.
7—Digital_IOSignal terminal — (I/O, 8V to 4.5V domain). Multiplexed alternate functions: —. Supported peripheral buses: General.
8V IN1Digital_IOSignal terminal V IN1 (I/O, 8V to 4.5V domain). Multiplexed alternate functions: V IN1. Supported peripheral buses: General.
9L XDigital_IOSignal terminal L X (I/O, 8V to 4.5V domain). Multiplexed alternate functions: L X. Supported peripheral buses: General.
10P GNDGND0V electrical ground return terminal (P GND) for internal core logic, I/O drivers, and analog sub-blocks.