MIC5219-2.5YMM-TR (MSOP-8) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MIC5219-2.5YMM-TR (MSOP-8)?

Manufactured by MICROCHIP, the MIC5219-2.5YMM-TR is housed in a MSOP-8 package with 8 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1V to 12V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (OUT: Regulated Power Output (OUT — 1V to 12V)), 4 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 5 (GND: Ground Reference Pin (GND)), 6 (GND: Ground Reference Pin (GND)).

Q: What are the IPC-7351B PCB Footprint dimensions for MIC5219-2.5YMM-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5219-2.5YMM-TR (MSOP-8) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 8 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5219-2.5YMM-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5219-2.5YMM-TR (MICROCHIP, MSOP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.00mm × 3.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (8/8)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	EN	I	System Enable & Hardware Reset (EN)
2	IN	I/O	Multiplexed I/O & Peripheral Pin IN (General)
3	OUT	Power	Regulated Power Output (OUT — 1V to 12V)
4	BYP	I/O	Multiplexed I/O & Peripheral Pin BYP (General)
5	GND	GND	Ground Reference Pin (GND)
6	GND	GND	Ground Reference Pin (GND)
7	GND	GND	Ground Reference Pin (GND)
8	GND	GND	Ground Reference Pin (GND)

PIN 1 EN

System Enable & Hardware Reset (EN)

Design note: Enable (input): CMOS -compatible control input . Logic-high = enable; logic-low or open = shutdown .

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 20 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MIC5219-2.5YMM-TR (MSOP-8) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MIC5219-2.5YMM-TR (MSOP-8) - 2. Standard Pinout (Top View)

True package pinout (8 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MIC5219-2.5YMM-TR (MSOP-8) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MIC5219-2.5YMM-TR (MSOP-8) - 4. Package Dimensions (D×E×A)

MSOP-8 · 3.00×3.00mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

MIC5219-2.5YMM-TR (MSOP-8) - 5. Recommended Land Pattern

IPC-7351B Footprint (8 Pads)Expand ›

6. Application SchematicSCHEMATIC

MIC5219-2.5YMM-TR (MSOP-8) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (20 figures · Page 1/2)

Showing 1–12 of 20 uncropped original figures for MIC5219

P2 · p02_fig01EXACT PACKAGE

P2 · p02_fig02EXACT PACKAGE

OUT

P16 · p16_fig03EXACT PACKAGE

FIGURE 4-2: MIC5219-x.xYM5 (SOT23-5) on 1-Inch2 Copper Cladding.

P16 · p16_fig04EXACT PACKAGE

FIGURE 4-3: MIC5219-x.xYMM (MSOP-8) on Minimum Recommended Footprint.

P1 · p01_fig01377×200px

500 mA Peak Output LDO Regulator

P2 · p02_fig05346×580px

MIC5219-x.xYM5 | SOT23-5 (M5) Fixed Voltages | (Top View) | IN | OUT BYP | EN | LGxx | 1 3 | 4 5 | 2 GND

P2 · p02_fig06571×581px

MIC5219YM5 SOT23-5 (M5) Adjustable Voltage | (Top View) | Part Identification | IN | OUT ADJ | EN | LGAA | 1 3 | 4 5 | 2 GND

P2 · p02_fig02P2

Datasheet Page 2 (p02_fig02)

P3 · p03_fig011774×1544px

MIC5219

P3 · p03_fig01P3

Datasheet Page 3 (p03_fig01)

P15 · p15_fig011777×1482px

MIC5219-2.5YMM-TR (MSOP-8) — MIC5219 | EQUATION 4-7: | EQUATION 4-8: | PD MAX   455mW VIN VOUT -   IOUT  VIN + IGND  = = | Where: | IOUT = 500 mA | VOUT = 5V | IGND = 20 mA | 455mW VIN 5V -   500mA  VIN + 20mA  = | 2.995W 520mA VIN  = | VIN MAX   | 2.995W

P15 · p15_fig021777×636px

 2018 Microchip Technology Inc. DS20006021A-page 15 | EQUATION 4-9: | PD 50mA  5V 3.3V -   50mA  5V + 650A  = | PD 50mA  88.25mW =

Page 1 / 2 (20 extracted figures)

Technical Specifications & Part Details (MIC5219-2.5YMM-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MIC5219-2.5YMM-TR (MSOP-8) is a 8-pin standard electronic & interconnect component featuring a 3.00 × 3.00 × 1.10 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 1V to 12V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

1V to 12V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C ~ +85°C (Industrial Grade)

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

DC / Broadband Passive

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

3.00 × 3.00 × 1.10 mm (A1=0.08 mm)

Package family: TSSOP (MSOP-8)

Pin Count & Lead PitchN / e

8 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol8 auto-grouped pins

IPC-7351B Land Pattern8 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MSOP-8)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

3.00 × 3.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.65mm

Pad Size (W × L)Level B

0.40 × 1.25 mm

Pins / Total PadsTopology

8P / 8Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit MSOP-8	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5219-2.5YMM-TR (MSOP-8)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5219-2.5YMM-TR (MSOP-8)?

Manufactured by MICROCHIP, the MIC5219-2.5YMM-TR is housed in a MSOP-8 package with 8 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1V to 12V. Key pins include: 1 (EN: System Enable & Hardware Reset (EN)), 2 (IN: Multiplexed I/O & Peripheral Pin IN (General)), 3 (OUT: Regulated Power Output (OUT — 1V to 12V)), 4 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 5 (GND: Ground Reference Pin (GND)), 6 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for MIC5219-2.5YMM-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5219-2.5YMM-TR (MSOP-8) has a nominal body envelope of 3.00 × 3.00 mm, pitch e = 0.65 mm, and 8 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5219-2.5YMM-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5219-2.5YMM-TR (MICROCHIP, MSOP-8) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (8 pins) & MIC5219 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
2	IN	Digital_IO	Signal terminal IN (I/O, 1V to 12V domain). Multiplexed alternate functions: IN. Supported peripheral buses: General.
3	OUT	Power_Out	Regulated power output rail (OUT) operating in the 1V to 12V domain (Max rating: 12.0V).
4	BYP	Digital_IO	Signal terminal BYP (I/O, 1V to 12V domain). Multiplexed alternate functions: BYP. Supported peripheral buses: General.
5	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
6	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
7	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
8	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.

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