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MIC5330-OGYML (MLF-8(2x2)) — Symbol, Footprint IPC-7351B & 3D STEP Model

MIC5330-OGYML

MICROCHIPID: C5768874MLF-8(2x2) · 9 Pins · Pitch 0.50mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · MIC5330-OGYML (MLF-8(2x2))1VIN2GND3BYP4EN25EN19EP8VOUT17VOUT26NCGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.812.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
123456789E=2.00mm · Pitch e=0.50mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (9/9)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1VINPowerPower Supply Input (VIN — 2.3V to 5.5V)
2GNDGNDGround Reference Pin (GND)
3BYPI/OMultiplexed I/O & Peripheral Pin BYP (General)
4EN2I/OMultiplexed I/O & Peripheral Pin EN2 (General)
5EN1I/OMultiplexed I/O & Peripheral Pin EN1 (General)
6NCI/OMultiplexed I/O & Peripheral Pin NC (General)
7VOUT2PowerPower Supply Input (VOUT2 — 2.3V to 5.5V)
8VOUT1PowerPower Supply Input (VOUT1 — 2.3V to 5.5V)
9EPGNDExposed Thermal & Ground Pad (EP)
PIN 1 VIN
Power
Power Supply Input (VIN — 2.3V to 5.5V)
Design note: SupplyInput .
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: MIC5330-OGYML (MICROCHIP · MLF-8(2x2))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
MIC5330-OGYML (MLF-8(2x2)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
MIC5330-OGYML (MLF-8(2x2)) - 2. Standard Pinout (Top View)
True package pinout (9 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
MIC5330-OGYML (MLF-8(2x2)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
MIC5330-OGYML (MLF-8(2x2)) - 4. Package Dimensions (D×E×A)
MLF-8(2x2) · 2.00×2.00mm · Pitch 0.50mmExpand ›
5. Recommended Land PatternLAND PATTERN
MIC5330-OGYML (MLF-8(2x2)) - 5. Recommended Land Pattern
IPC-7351B Footprint (9 Pads)Expand ›
6. Application SchematicSCHEMATIC
MIC5330-OGYML (MLF-8(2x2)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)
Showing 1–9 of 9 uncropped original figures for MIC5330
P4 · p04_fig01EXACT PACKAGE
MIC5330-OGYML (MLF-8(2x2)) — Pin Name
Pin Name
P10 · p10_fig01EXACT PACKAGE
MIC5330-OGYML (MLF-8(2x2)) — Package Information
Package Information
P1 · p01_fig01906×560px
MIC5330-OGYML (MLF-8(2x2)) — ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.
ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.
P1 · p01_fig01P1
MIC5330-OGYML (MLF-8(2x2)) — Datasheet Page 1 (p01_fig01)
Datasheet Page 1 (p01_fig01)
P2 · p02_fig011320×1195px
MIC5330-OGYML (MLF-8(2x2)) — Block Diagram
Block Diagram
P4 · p04_fig01P4
MIC5330-OGYML (MLF-8(2x2)) — Datasheet Page 4 (p04_fig01)
Datasheet Page 4 (p04_fig01)
P7 · p07_fig01703×555px
MIC5330-OGYML (MLF-8(2x2)) — Time (10µs/div)
Time (10µs/div)
P7 · p07_fig02701×551px
MIC5330-OGYML (MLF-8(2x2)) — Time (20µs/div)
Time (20µs/div)
P7 · p07_fig03691×547px
MIC5330-OGYML (MLF-8(2x2)) — Time (40µs/div)
Time (40µs/div)

Technical Specifications & Part Details (MIC5330-OGYML)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:MIC5330-OGYML (MLF-8(2x2)) is a 8-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.75 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 2.3V to 5.5V supply operation across 40°C to +125°C with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
2.3V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
75µA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.75 mm (A1=0.02 mm)
Package family: OTHER (MLF-8(2x2))
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 0.50 mm (19.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol9 auto-grouped pins
OK
IPC-7351B Land Pattern9 pads · Pitch 0.50mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (MLF-8(2x2))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.75mm · e=0.50mm
Pad Size (W × L)Level B
0.25 × 0.60 mm
Pins / Total PadsTopology
9P / 9Pad (CUSTOM_ARRAY)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
MLF-8(2x2)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MIC5330-OGYML (MLF-8(2x2))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MIC5330-OGYML (MLF-8(2x2))?

Manufactured by MICROCHIP, the MIC5330-OGYML is housed in a MLF-8(2x2) package with 9 pins and a 0.50 mm lead pitch, supporting a VCC supply range of 2.3V to 5.5V. Key pins include: 1 (VIN: Power Supply Input (VIN — 2.3V to 5.5V)), 2 (GND: Ground Reference Pin (GND)), 3 (BYP: Multiplexed I/O & Peripheral Pin BYP (General)), 4 (EN2: Multiplexed I/O & Peripheral Pin EN2 (General)), 5 (EN1: Multiplexed I/O & Peripheral Pin EN1 (General)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for MIC5330-OGYML?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MIC5330-OGYML (MLF-8(2x2)) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.50 mm, and 9 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MIC5330-OGYML?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MIC5330-OGYML (MICROCHIP, MLF-8(2x2)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (9 pins) & MIC5330 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1VINPower_InPrimary positive power supply input (VIN) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
2GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
3BYPDigital_IOSignal terminal BYP (I/O, 2.3V to 5.5V domain). Multiplexed alternate functions: BYP. Supported peripheral buses: General.
4EN2Digital_IOSignal terminal EN2 (I/O, 2.3V to 5.5V domain). Multiplexed alternate functions: EN2. Supported peripheral buses: General.
5EN1Digital_IOSignal terminal EN1 (I/O, 2.3V to 5.5V domain). Multiplexed alternate functions: EN1. Supported peripheral buses: General.
6NCNCSignal terminal NC (I/O, 2.3V to 5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7VOUT2Power_InPrimary positive power supply input (VOUT2) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
8VOUT1Power_InPrimary positive power supply input (VOUT1) operating in the 2.3V to 5.5V domain (Max rating: 5.5V).
9EPGNDBottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.
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