CH271J (QFN-13F(2x2)) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH271J

WCHID: C54173288QFN-13F(2x2) · 13 Pins · Pitch 0.40mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH271J (QFN-13F(2x2))1AI2AO3PWM14PWM25PWME6GND7SW213CSO12GND11SW110VDD9VDD8VDDGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.215.210.25.10-5.1-10.2-15.2mm
2. 2D FOOTPRINT
12345678910111213E=2.00mm · Pitch e=0.40mmD=2.00mm-3-2-101233210-1-2-3mm
3. 3D CAD MODEL
Package Body: 2.00mm × 2.00mm · Pitch: 0.40mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (13/13)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1AII/OMultiplexed I/O & Peripheral Pin AI (General)
2AOI/OMultiplexed I/O & Peripheral Pin AO (General)
3PWM1I/OMultiplexed I/O & Peripheral Pin PWM1 (PWM)
4PWM2I/OMultiplexed I/O & Peripheral Pin PWM2 (PWM)
5PWMEI/OMultiplexed I/O & Peripheral Pin PWME (PWM)
6GNDGNDGround Reference Pin (GND)
7SW2I/OMultiplexed I/O & Peripheral Pin SW2 (PWM)
8VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
9VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
10VDDPowerPower Supply Input (VDD — 3.3V / 5.0V Standard Logic)
11SW1I/OMultiplexed I/O & Peripheral Pin SW1 (PWM)
12GNDGNDGround Reference Pin (GND)
13CSOI/OMultiplexed I/O & Peripheral Pin CSO (General)
PIN 1 AI
I/O
Multiplexed I/O & Peripheral Pin AI (General)
Design note: 信号放大模块的输入 内部已提供直流偏置 , , 外部须隔直输入 将AI短接VDD可关闭此模块 。
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH271J (WCH · QFN-13F(2x2))
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH271J (QFN-13F(2x2)) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH271J (QFN-13F(2x2)) - 2. Standard Pinout (Top View)
True package pinout (13 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH271J (QFN-13F(2x2)) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH271J (QFN-13F(2x2)) - 4. Package Dimensions (D×E×A)
QFN-13F(2x2) · 2.00×2.00mm · Pitch 0.40mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH271J (QFN-13F(2x2)) - 5. Recommended Land Pattern
IPC-7351B Footprint (13 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH271J (QFN-13F(2x2)) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)
Showing 1–9 of 9 uncropped original figures for CH271
P1 · p01_fig011436×1677px
CH271J (QFN-13F(2x2)) — 2、特点
2、特点
P2 · p02_fig011790×1217px
CH271J (QFN-13F(2x2)) — PWM2 4 | GND 12 | VDD 8 VDD 9 | CSO 13 GND 6 | AI 1 | SW1 11 SW2 7 | PWM1 3 | PWME 5 | AO 2 VDD 10 | CH271J | PWM2 3 GND 2 VDD 5 SW1 6 | SW2 4 PWM1 1 | CH271K | PWM1 7 VDD 2 CSO 8 | GND 4 SW2 3 SW1 1 | PWM2 6 PWME 5 | CH271E | 3、引脚排列 | 封装形式
PWM2 4 | GND 12 | VDD 8 VDD 9 | CSO 13 GND 6 | AI 1 | SW1 11 SW2 7 | PWM1 3 | PWME 5 | AO 2 VDD 10 | CH271J | PWM2 3 GND 2 VDD 5 SW1 6 | SW2 4 PWM1 1 | CH271K | PWM1 7 VDD 2 CSO 8 | GND 4 SW2 3 SW1 1 | PWM2 6 PWME 5 | CH271E | 3、引脚排列 | 封装形式
P2 · p02_fig01P2
CH271J (QFN-13F(2x2)) — Datasheet Page 2 (p02_fig01)
Datasheet Page 2 (p02_fig01)
P7 · p07_fig011913×1382px
CH271J (QFN-13F(2x2)) — 版本:1.2 7
版本:1.2 7
P7 · p07_fig01P7
CH271J (QFN-13F(2x2)) — Datasheet Page 7 (p07_fig01)
Datasheet Page 7 (p07_fig01)
P8 · p08_fig011398×401px
CH271J (QFN-13F(2x2)) — 8、封装信息
8、封装信息
P8 · p08_fig021510×1076px
CH271J (QFN-13F(2x2)) — 271J .xyz
271J .xyz
P9 · p09_fig011125×1298px
CH271J (QFN-13F(2x2)) — 8.3. SOP8
8.3. SOP8
P9 · p09_fig021119×949px
CH271J (QFN-13F(2x2)) — 8.3. SOP8
8.3. SOP8

Technical Specifications & Part Details (CH271J)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH271J (QFN-13F(2x2)) is a 13-pin standard electronic & interconnect component featuring a 2.00 × 2.00 × 0.90 mm mechanical envelope (lead pitch e = 0.40 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated PWM interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
2.00 × 2.00 × 0.90 mm (A1=0.03 mm)
Package family: QFN (QFN-13F(2x2))
Pin Count & Lead PitchN / e
13 Pins | Pitch e = 0.40 mm (15.7 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
PWM
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol13 auto-grouped pins
OK
IPC-7351B Land Pattern13 pads · Pitch 0.40mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-13F(2x2))

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
2.00 × 2.00 mm
Height (A) & Pitch (e)IPC-7351B
A=0.90mm · e=0.40mm
Pad Size (W × L)Level B
0.22 × 0.51 mm
Pins / Total PadsTopology
13P / 13Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
QFN-13F(2x2)
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH271J (QFN-13F(2x2))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH271J (QFN-13F(2x2))?

Manufactured by WCH, the CH271J is housed in a QFN-13F(2x2) package with 13 pins and a 0.40 mm lead pitch. Key pins include: 1 (AI: Multiplexed I/O & Peripheral Pin AI (General)), 2 (AO: Multiplexed I/O & Peripheral Pin AO (General)), 3 (PWM1: Multiplexed I/O & Peripheral Pin PWM1 (PWM)), 4 (PWM2: Multiplexed I/O & Peripheral Pin PWM2 (PWM)), 5 (PWME: Multiplexed I/O & Peripheral Pin PWME (PWM)), 6 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for CH271J?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH271J (QFN-13F(2x2)) has a nominal body envelope of 2.00 × 2.00 mm, pitch e = 0.40 mm, and 13 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH271J?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH271J (WCH, QFN-13F(2x2)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (13 pins) & CH271 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1AIDigital_IOSignal terminal AI (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: AI. Supported peripheral buses: General.
2AODigital_IOSignal terminal AO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: AO. Supported peripheral buses: General.
3PWM1Digital_IOSignal terminal PWM1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWM1. Supported peripheral buses: PWM.
4PWM2Digital_IOSignal terminal PWM2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWM2. Supported peripheral buses: PWM.
5PWMEDigital_IOSignal terminal PWME (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: PWME. Supported peripheral buses: PWM.
6GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
7SW2Digital_IOSignal terminal SW2 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SW2. Supported peripheral buses: PWM.
8VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
9VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
10VDDPower_InPrimary positive power supply input (VDD) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
11SW1Digital_IOSignal terminal SW1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SW1. Supported peripheral buses: PWM.
12GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
13CSODigital_IOSignal terminal CSO (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: CSO. Supported peripheral buses: General.