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B5819W (SOD-323) — Symbol, Footprint IPC-7351B & 3D STEP Model

B5819W

HL(Haolin Elec)ID: C5187638SOD-323 · 2 Pins · Pitch 2.40mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · B5819W (SOD-323)1C2AGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.210.25.10-5.1-10.2mm
2. 2D FOOTPRINT
12E=1.70mm · Pitch e=2.40mmD=1.30mm-3-2-10123210-1-2mm
3. 3D CAD MODEL
Package Body: 1.70mm × 1.30mm · Pitch: 2.40mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (2/2)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1CI/OMultiplexed I/O & Peripheral Pin C (General)
2AI/OMultiplexed I/O & Peripheral Pin A (General)
PIN 1 C
I/O
Multiplexed I/O & Peripheral Pin C (General)
Design note: Signal terminal C (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: C. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 2 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: B5819W (HL(Haolin Elec) · SOD-323)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
B5819W (SOD-323) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
B5819W (SOD-323) - 2. Standard Pinout (Top View)
True package pinout (2 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
B5819W (SOD-323) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
B5819W (SOD-323) - 4. Package Dimensions (D×E×A)
SOD-323 · 1.70×1.30mm · Pitch 2.40mmExpand ›
5. Recommended Land PatternLAND PATTERN
B5819W (SOD-323) - 5. Recommended Land Pattern
IPC-7351B Footprint (2 Pads)Expand ›
6. Application SchematicSCHEMATIC
B5819W (SOD-323) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (2 figures · Page 1/1)
Showing 1–2 of 2 uncropped original figures for B5819W
P1 · p01_fig01EXACT PACKAGE
B5819W (SOD-323) — ® @HAQLIN = SOD-323 SOD-323 B5817W-5819W scHoTTky BARRIER DIODE FEATURES * For use in low voltage, high frequency inverters Free wheeling, and polarity protection applications. MARKING: B5817WS: SJ B5818WS:SK . B5819WS: SL Maximum Ratings a
® @HAQLIN = SOD-323 SOD-323 B5817W-5819W scHoTTky BARRIER DIODE FEATURES * For use in low voltage, high frequency inverters Free wheeling, and polarity protection applications. MARKING: B5817WS: SJ B5818WS:SK . B5819WS: SL Maximum Ratings a
P2 · p02_fig012546×3600px
B5819W (SOD-323) — PDF Figure p02_fig01 (Page 2 — OTHER_DIAGRAM)
PDF Figure p02_fig01 (Page 2 — OTHER_DIAGRAM)

Technical Specifications & Part Details (B5819W)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:B5819W (SOD-323) is a 2-pin standard electronic & interconnect component featuring a 1.25 × 1.70 × 2.00 mm mechanical envelope (lead pitch e = 2.40 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across -40°C ~ +85°C (Industrial Grade) with integrated Standard I/O / Passive interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V ~ 5.5V (Theo Datasheet)
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
1.25 × 1.70 × 2.00 mm (A1=0.00 mm)
Package family: OTHER (SOD-323)
Pin Count & Lead PitchN / e
2 Pins | Pitch e = 2.40 mm (94.5 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
Standard I/O / Passive
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol2 auto-grouped pins
OK
IPC-7351B Land Pattern2 pads · Pitch 2.40mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOD-323)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
1.70 × 1.30 mm
Height (A) & Pitch (e)IPC-7351B
A=0.95mm · e=2.40mm
Pad Size (W × L)Level B
0.80 × 0.90 mm
Pins / Total PadsTopology
2P / 2Pad (CHIP_2PAD)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOD-323
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — B5819W (SOD-323)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of B5819W (SOD-323)?

Manufactured by HL(Haolin Elec), the B5819W is housed in a SOD-323 package with 2 pins and a 2.40 mm lead pitch. Key pins include: 1 (C: Multiplexed I/O & Peripheral Pin C (General)), 2 (A: Multiplexed I/O & Peripheral Pin A (General)).

What are the IPC-7351B PCB Footprint dimensions for B5819W?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), B5819W (SOD-323) has a nominal body envelope of 1.30 × 1.70 mm, pitch e = 2.40 mm, and 2 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for B5819W?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for B5819W (HL(Haolin Elec), SOD-323) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (2 pins) & B5819W Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1CDigital_IOSignal terminal C (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: C. Supported peripheral buses: General.
2ADigital_IOSignal terminal A (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: A. Supported peripheral buses: General.
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