CH9340K (ESSOP-10-150mil-1mm) — Symbol, Footprint IPC-7351B & 3D STEP Model

CH9340K

WCHID: C503470ESSOP-10-150mil-1mm · 11 Pins · Pitch 1.00mmIPC TOLERANCE VARIATION5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · CH9340K (ESSOP-10-150mil-1mm)1UD+2UD -3GND4H F#_5DTR#6RTS#11LOP#10V39RXD8TXD7VCCGrid Pitch = 2.54mm (IEEE-315)-15.2-10.2-5.105.110.215.212.77.62.5-2.5-7.6-12.7mm
2. 2D FOOTPRINT
1234567891011E=3.90mm · Pitch e=1.00mmD=4.90mm-5-4-3-2-101234543210-1-2-3-4mm
3. 3D CAD MODEL
Package Body: 3.90mm × 4.90mm · Pitch: 1.00mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (11/11)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1UD+I/OMultiplexed I/O & Peripheral Pin UD+ (USB)
2UD -I/OMultiplexed I/O & Peripheral Pin UD - (USB)
3GNDGNDGround Reference Pin (GND)
4H F#_I/OMultiplexed I/O & Peripheral Pin H F#_ (General)
5DTR#I/OMultiplexed I/O & Peripheral Pin DTR# (UART)
6RTS#I/OMultiplexed I/O & Peripheral Pin RTS# (UART)
7VCCPowerPower Supply Input (VCC — 3.3V to 5V)
8TXDI/OMultiplexed I/O & Peripheral Pin TXD (UART)
9RXDI/OMultiplexed I/O & Peripheral Pin RXD (UART)
10V3PowerRegulated Power Output (V3 — 3.3V to 5V)
11LOP#I/OMultiplexed I/O & Peripheral Pin LOP# (General)
PIN 1 UD+
I/O
Multiplexed I/O & Peripheral Pin UD+ (USB)
Design note: 直接连到USB总线的D+数据线
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 5 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: CH9340K (WCH · ESSOP-10-150mil-1mm)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
CH9340K (ESSOP-10-150mil-1mm) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
CH9340K (ESSOP-10-150mil-1mm) - 2. Standard Pinout (Top View)
True package pinout (11 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
CH9340K (ESSOP-10-150mil-1mm) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
CH9340K (ESSOP-10-150mil-1mm) - 4. Package Dimensions (D×E×A)
ESSOP-10-150mil-1mm · 3.90×4.90mm · Pitch 1.00mmExpand ›
5. Recommended Land PatternLAND PATTERN
CH9340K (ESSOP-10-150mil-1mm) - 5. Recommended Land Pattern
IPC-7351B Footprint (11 Pads)Expand ›
6. Application SchematicSCHEMATIC
CH9340K (ESSOP-10-150mil-1mm) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (5 figures · Page 1/1)
Showing 1–5 of 5 uncropped original figures for CH9340
P1 · p01_fig011648×415px
CH9340K (ESSOP-10-150mil-1mm) — 2、特点
2、特点
P1 · p01_fig02877×363px
CH9340K (ESSOP-10-150mil-1mm) — 封装形式 塑体宽度 引脚间距 封装说明 订货型号
封装形式 塑体宽度 引脚间距 封装说明 订货型号
P1 · p01_fig02P1
CH9340K (ESSOP-10-150mil-1mm) — Datasheet Page 1 (p01_fig02)
Datasheet Page 1 (p01_fig02)
P4 · p04_fig01895×471px
CH9340K (ESSOP-10-150mil-1mm) — 上图是由CH9340 实现的USB 转TTL 串口。CH9340 提供了常用的串口信号及MODEM 信号,另加电 平转换电路可以将TTL 串口转换为RS232 串口。
上图是由CH9340 实现的USB 转TTL 串口。CH9340 提供了常用的串口信号及MODEM 信号,另加电 平转换电路可以将TTL 串口转换为RS232 串口。
P4 · p04_fig01P4
CH9340K (ESSOP-10-150mil-1mm) — Datasheet Page 4 (p04_fig01)
Datasheet Page 4 (p04_fig01)

Technical Specifications & Part Details (CH9340K)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:CH9340K (ESSOP-10-150mil-1mm) is a 10-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.10 mm mechanical envelope (lead pitch e = 1.00 mm). Rated for 3.3V to 5V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated USB, UART interfaces.
Operating Supply VoltageV_CC / V_DD
3.3V to 5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C ~ +85°C (Industrial Grade)
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
DC / Broadband Passive
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
4.90 × 3.90 × 1.10 mm (A1=0.05 mm)
Package family: TSSOP (ESSOP-10-150mil-1mm)
Pin Count & Lead PitchN / e
10 Pins | Pitch e = 1.00 mm (39.4 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
USB, UART
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol11 auto-grouped pins
OK
IPC-7351B Land Pattern11 pads · Pitch 1.00mm
OK
IPC-7525 60% Solder PasteEPAD 2.30×3.00mm windowed grid
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (ESSOP-10-150mil-1mm)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
4.90 × 3.90 mm
Height (A) & Pitch (e)IPC-7351B
A=1.10mm · e=1.00mm
Pad Size (W × L)Level B
0.45 × 1.50 mm
Pins / Total PadsTopology
11P / 11Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
ESSOP-10-150mil-1mm
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — CH9340K (ESSOP-10-150mil-1mm)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of CH9340K (ESSOP-10-150mil-1mm)?

Manufactured by WCH, the CH9340K is housed in a ESSOP-10-150mil-1mm package with 11 pins and a 1.00 mm lead pitch, supporting a VCC supply range of 3.3V to 5V. Key pins include: 1 (UD+: Multiplexed I/O & Peripheral Pin UD+ (USB)), 2 (UD -: Multiplexed I/O & Peripheral Pin UD - (USB)), 3 (GND: Ground Reference Pin (GND)), 4 (H F#_: Multiplexed I/O & Peripheral Pin H F#_ (General)), 5 (DTR#: Multiplexed I/O & Peripheral Pin DTR# (UART)), 6 (RTS#: Multiplexed I/O & Peripheral Pin RTS# (UART)).

What are the IPC-7351B PCB Footprint dimensions for CH9340K?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), CH9340K (ESSOP-10-150mil-1mm) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 1.00 mm, and 11 copper pads plus a central exposed thermal pad (EPAD) of 2.30 × 3.00 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for CH9340K?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for CH9340K (WCH, ESSOP-10-150mil-1mm) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (11 pins) & CH9340 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1UD+Digital_IOSignal terminal UD+ (I/O, 3.3V to 5V domain). Multiplexed alternate functions: UD+. Supported peripheral buses: USB.
2UD -Digital_IOSignal terminal UD - (I/O, 3.3V to 5V domain). Multiplexed alternate functions: UD -. Supported peripheral buses: USB.
3GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
4H F#_Digital_IOSignal terminal H F#_ (I/O, 3.3V to 5V domain). Multiplexed alternate functions: H F#_. Supported peripheral buses: General.
5DTR#Digital_IOSignal terminal DTR# (I/O, 3.3V to 5V domain). Multiplexed alternate functions: DTR#. Supported peripheral buses: UART.
6RTS#Digital_IOSignal terminal RTS# (I/O, 3.3V to 5V domain). Multiplexed alternate functions: RTS#. Supported peripheral buses: UART.
7VCCPower_InPrimary positive power supply input (VCC) operating in the 3.3V to 5V domain (Max rating: 5.0V).
8TXDDigital_IOSignal terminal TXD (I/O, 3.3V to 5V domain). Multiplexed alternate functions: TXD. Supported peripheral buses: UART.
9RXDDigital_IOSignal terminal RXD (I/O, 3.3V to 5V domain). Multiplexed alternate functions: RXD. Supported peripheral buses: UART.
10V3Power_OutRegulated power output rail (V3) operating in the 3.3V to 5V domain (Max rating: 5.0V).
11LOP#Digital_IOSignal terminal LOP# (I/O, 3.3V to 5V domain). Multiplexed alternate functions: LOP#. Supported peripheral buses: General.