MICRF230YQS-TR (QSOP-16-150mil) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of MICRF230YQS-TR (QSOP-16-150mil)?

Manufactured by MICROCHIP, the MICRF230YQS-TR is housed in a QSOP-16-150mil package with 16 pins and a 0.64 mm lead pitch, supporting a VCC supply range of 3.5V to 5.5V. Key pins include: 1 (RO1: Multiplexed I/O & Peripheral Pin RO1 (CAN)), 2 (RFGND: Ground Reference Pin (RFGND)), 3 (ANT: Multiplexed I/O & Peripheral Pin ANT (General)), 4 (RFGND: Ground Reference Pin (RFGND)), 5 (CDEC: Multiplexed I/O & Peripheral Pin CDEC (General)), 6 (SQ: Multiplexed I/O & Peripheral Pin SQ (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for MICRF230YQS-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MICRF230YQS-TR (QSOP-16-150mil) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 0.64 mm, and 16 copper pads.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MICRF230YQS-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MICRF230YQS-TR (MICROCHIP, QSOP-16-150mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 3.90mm × 4.90mm · Pitch: 0.64mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (16/16)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	RO1	I/O	Multiplexed I/O & Peripheral Pin RO1 (CAN)
2	RFGND	GND	Ground Reference Pin (RFGND)
3	ANT	I/O	Multiplexed I/O & Peripheral Pin ANT (General)
4	RFGND	GND	Ground Reference Pin (RFGND)
5	CDEC	I/O	Multiplexed I/O & Peripheral Pin CDEC (General)
6	SQ	I/O	Multiplexed I/O & Peripheral Pin SQ (General)
7	VDD	Power	Power Supply Input (VDD — 3.5V to 5.5V)
8	EN	I	System Enable & Hardware Reset (EN)
9	GND	GND	Ground Reference Pin (GND)
10	DO	I/O	Multiplexed I/O & Peripheral Pin DO (General)
11	SEL1	I/O	Multiplexed I/O & Peripheral Pin SEL1 (CAN)
12	SEL0	I/O	Multiplexed I/O & Peripheral Pin SEL0 (CAN)
13	CTH	I/O	Multiplexed I/O & Peripheral Pin CTH (General)
14	AGC	I/O	Multiplexed I/O & Peripheral Pin AGC (General)
15	RSSI	I/O	Multiplexed I/O & Peripheral Pin RSSI (General)
16	RO2	I/O	Multiplexed I/O & Peripheral Pin RO2 (General)

PIN 1 RO1

I/O

Multiplexed I/O & Peripheral Pin RO1 (CAN)

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IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

MICRF230YQS-TR (QSOP-16-150mil) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

MICRF230YQS-TR (QSOP-16-150mil) - 2. Standard Pinout (Top View)

True package pinout (16 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

MICRF230YQS-TR (QSOP-16-150mil) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

MICRF230YQS-TR (QSOP-16-150mil) - 4. Package Dimensions (D×E×A)

QSOP-16-150mil · 3.90×4.90mm · Pitch 0.64mmExpand ›

5. Recommended Land PatternLAND PATTERN

MICRF230YQS-TR (QSOP-16-150mil) - 5. Recommended Land Pattern

IPC-7351B Footprint (16 Pads)Expand ›

6. Application SchematicSCHEMATIC

MICRF230YQS-TR (QSOP-16-150mil) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)

Showing 1–8 of 8 uncropped original figures for MICRF230

P19 · p19_fig01EXACT PACKAGE

QSOP16 Package (QS)

P1 · p01_fig011734×634px

Typical Application

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P2 · p02_fig01512×499px

16-Pin 4.9mm × 6.0mm QSOP (QS) (Top View)

P2 · p02_fig01P2

Datasheet Page 2 (p02_fig01)

P14 · p14_fig01856×385px

Figure 7. Preamble Length - Too Short

P14 · p14_fig02944×326px

Figure 7. Preamble Length - Too Short

P19 · p19_fig01P19

Datasheet Page 19 (p19_fig01)

Technical Specifications & Part Details (MICRF230YQS-TR)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:MICRF230YQS-TR (QSOP-16-150mil) is a 16-pin standard electronic & interconnect component featuring a 4.90 × 3.90 × 1.10 mm mechanical envelope (lead pitch e = 0.64 mm). Rated for 3.5V to 5.5V supply operation across 40°C to +105°C with integrated CAN interfaces.

Operating Supply VoltageV_CC / V_DD

3.5V to 5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +105°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

400MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

4.90 × 3.90 × 1.10 mm (A1=0.10 mm)

Package family: TSSOP (QSOP-16-150mil)

Pin Count & Lead PitchN / e

16 Pins | Pitch e = 0.64 mm (25.0 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

CAN

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol16 auto-grouped pins

IPC-7351B Land Pattern16 pads · Pitch 0.64mm

IPC-7525 60% Solder PasteReflow 1:1 Standard

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QSOP-16-150mil)

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

4.90 × 3.90 mm

Height (A) & Pitch (e)IPC-7351B

A=1.10mm · e=0.64mm

Pad Size (W × L)Level B

0.38 × 1.50 mm

Pins / Total PadsTopology

16P / 16Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit QSOP-16-150mil	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — MICRF230YQS-TR (QSOP-16-150mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of MICRF230YQS-TR (QSOP-16-150mil)?

Manufactured by MICROCHIP, the MICRF230YQS-TR is housed in a QSOP-16-150mil package with 16 pins and a 0.64 mm lead pitch, supporting a VCC supply range of 3.5V to 5.5V. Key pins include: 1 (RO1: Multiplexed I/O & Peripheral Pin RO1 (CAN)), 2 (RFGND: Ground Reference Pin (RFGND)), 3 (ANT: Multiplexed I/O & Peripheral Pin ANT (General)), 4 (RFGND: Ground Reference Pin (RFGND)), 5 (CDEC: Multiplexed I/O & Peripheral Pin CDEC (General)), 6 (SQ: Multiplexed I/O & Peripheral Pin SQ (General)).

What are the IPC-7351B PCB Footprint dimensions for MICRF230YQS-TR?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), MICRF230YQS-TR (QSOP-16-150mil) has a nominal body envelope of 3.90 × 4.90 mm, pitch e = 0.64 mm, and 16 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for MICRF230YQS-TR?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for MICRF230YQS-TR (MICROCHIP, QSOP-16-150mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (16 pins) & MICRF230 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	RO1	Digital_IO	Signal terminal RO1 (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: RO1. Supported peripheral buses: CAN.
2	RFGND	GND	0V electrical ground return terminal (RFGND) for internal core logic, I/O drivers, and analog sub-blocks.
3	ANT	RF_50Ohm	Signal terminal ANT (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: ANT. Supported peripheral buses: General.
4	RFGND	GND	0V electrical ground return terminal (RFGND) for internal core logic, I/O drivers, and analog sub-blocks.
5	CDEC	Digital_IO	Signal terminal CDEC (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: CDEC. Supported peripheral buses: General.
6	SQ	Digital_IO	Signal terminal SQ (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: SQ. Supported peripheral buses: General.
7	VDD	Power_In	Primary positive power supply input (VDD) operating in the 3.5V to 5.5V domain (Max rating: 5.5V).
8	EN	Digital_IO	Chip enable and power-on reset control input (EN): High enables the SoC; Low powers down the chip into reset.
9	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
10	DO	Digital_IO	Signal terminal DO (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: DO. Supported peripheral buses: General.
11	SEL1	Digital_IO	Signal terminal SEL1 (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: SEL1. Supported peripheral buses: CAN.
12	SEL0	Digital_IO	Signal terminal SEL0 (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: SEL0. Supported peripheral buses: CAN.
13	CTH	Digital_IO	Signal terminal CTH (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: CTH. Supported peripheral buses: General.
14	AGC	Digital_IO	Signal terminal AGC (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: AGC. Supported peripheral buses: General.
15	RSSI	Digital_IO	Signal terminal RSSI (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: RSSI. Supported peripheral buses: General.
16	RO2	Digital_IO	Signal terminal RO2 (I/O, 3.5V to 5.5V domain). Multiplexed alternate functions: RO2. Supported peripheral buses: General.

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