SY89853UMG (QFN-32-EP(5x5)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of SY89853UMG (QFN-32-EP(5x5))?

Manufactured by MICROCHIP, the SY89853UMG is housed in a QFN-32-EP(5x5) package with 33 pins and a 0.50 mm lead pitch. Key pins include: 1 (INB0: Multiplexed I/O & Peripheral Pin INB0 (General)), 2 (VTB0: Multiplexed I/O & Peripheral Pin VTB0 (General)), 3 (VREF-ACB0: Multiplexed I/O & Peripheral Pin VREF-ACB0 (General)), 4 (#INB0: Multiplexed I/O & Peripheral Pin #INB0 (General)), 5 (INB1: Multiplexed I/O & Peripheral Pin INB1 (General)), 6 (VTB1: Multiplexed I/O & Peripheral Pin VTB1 (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for SY89853UMG?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY89853UMG (QFN-32-EP(5x5)) has a nominal body envelope of 5.00 × 5.00 mm, pitch e = 0.50 mm, and 33 copper pads plus a central exposed thermal pad (EPAD) of 3.50 × 3.50 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY89853UMG?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY89853UMG (MICROCHIP, QFN-32-EP(5x5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 5.00mm × 5.00mm · Pitch: 0.50mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (33/33)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	INB0	I/O	Multiplexed I/O & Peripheral Pin INB0 (General)
2	VTB0	I/O	Multiplexed I/O & Peripheral Pin VTB0 (General)
3	VREF-ACB0	Analog	Multiplexed I/O & Peripheral Pin VREF-ACB0 (General)
4	#INB0	I/O	Multiplexed I/O & Peripheral Pin #INB0 (General)
5	INB1	I/O	Multiplexed I/O & Peripheral Pin INB1 (General)
6	VTB1	I/O	Multiplexed I/O & Peripheral Pin VTB1 (General)
7	VREF-ACB1	Analog	Multiplexed I/O & Peripheral Pin VREF-ACB1 (General)
8	#INB1	I/O	Multiplexed I/O & Peripheral Pin #INB1 (General)
9	GND	GND	Ground Reference Pin (GND)
10	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
11	#QB	I/O	Multiplexed I/O & Peripheral Pin #QB (General)
12	QB	I/O	Multiplexed I/O & Peripheral Pin QB (General)
13	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
14	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
15	SELB	I/O	Multiplexed I/O & Peripheral Pin SELB (General)
16	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
17	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
18	SELA	I/O	Multiplexed I/O & Peripheral Pin SELA (General)
19	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
20	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
21	#QA	I/O	Multiplexed I/O & Peripheral Pin #QA (General)
22	QA	I/O	Multiplexed I/O & Peripheral Pin QA (General)
23	VCC	Power	Power Supply Input (VCC — 3.3V / 5.0V Standard Logic)
24	GND	GND	Ground Reference Pin (GND)
25	INA0	I/O	Multiplexed I/O & Peripheral Pin INA0 (General)
26	VTA0	I/O	Multiplexed I/O & Peripheral Pin VTA0 (General)
27	VREF-ACA0	Analog	Multiplexed I/O & Peripheral Pin VREF-ACA0 (General)
28	#INA0	I/O	Multiplexed I/O & Peripheral Pin #INA0 (General)
29	INA1	I/O	Multiplexed I/O & Peripheral Pin INA1 (General)
30	VTA1	I/O	Multiplexed I/O & Peripheral Pin VTA1 (General)
31	VREF-ACA1	Analog	Multiplexed I/O & Peripheral Pin VREF-ACA1 (General)
32	#INA1	I/O	Multiplexed I/O & Peripheral Pin #INA1 (General)
33	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 INB0

I/O

Multiplexed I/O & Peripheral Pin INB0 (General)

Design note: Signal terminal INB0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: INB0. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 9 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

SY89853UMG (QFN-32-EP(5x5)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

SY89853UMG (QFN-32-EP(5x5)) - 2. Standard Pinout (Top View)

True package pinout (33 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

SY89853UMG (QFN-32-EP(5x5)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

SY89853UMG (QFN-32-EP(5x5)) - 4. Package Dimensions (D×E×A)

QFN-32-EP(5x5) · 5.00×5.00mm · Pitch 0.50mmExpand ›

5. Recommended Land PatternLAND PATTERN

SY89853UMG (QFN-32-EP(5x5)) - 5. Recommended Land Pattern

IPC-7351B Footprint (33 Pads)Expand ›

6. Application SchematicSCHEMATIC

SY89853UMG (QFN-32-EP(5x5)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (9 figures · Page 1/1)

Showing 1–9 of 9 uncropped original figures for SY89853

P1 · p01_fig01719×147px

General Description

P2 · p02_fig01763×523px

Functional Block Diagram

P2 · p02_fig02763×523px

INBO 500 ose 500 dc ¢ /INBO QB VREF-ACBO <¢—— [|S 10 INB1 500 wit TS) 500 d od ANB VREF-ACB1 <#— SELB (CMOS/TTL)

P3 · p03_fig01591×579px

32-Pin QFN

P3 · p03_fig01P3

Datasheet Page 3 (p03_fig01)

P12 · p12_fig011872×1002px

Package Information

P12 · p12_fig02798×658px

PCB Thermal Consideration for 32-Pin QFN Package (Always solder, or equivalent, the exposed pad to the PCB)

P12 · p12_fig01P12

Datasheet Page 12 (p12_fig01)

P12 · p12_fig02P12

Datasheet Page 12 (p12_fig02)

Technical Specifications & Part Details (SY89853UMG)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:SY89853UMG (QFN-32-EP(5x5)) is a 32-pin standard electronic & interconnect component featuring a 5.00 × 5.00 × 1.00 mm mechanical envelope (lead pitch e = 0.50 mm). Rated for 1.8V ~ 5.5V (Theo Datasheet) supply operation across 40°C to +85°C with integrated Standard I/O / Passive interfaces.

Operating Supply VoltageV_CC / V_DD

1.8V ~ 5.5V (Theo Datasheet)

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

40°C to +85°C

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

2.5GHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

5.00 × 5.00 × 1.00 mm (A1=0.03 mm)

Package family: QFN (QFN-32-EP(5x5))

Pin Count & Lead PitchN / e

32 Pins | Pitch e = 0.50 mm (19.7 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

Standard I/O / Passive

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol33 auto-grouped pins

IPC-7351B Land Pattern33 pads · Pitch 0.50mm

IPC-7525 60% Solder PasteEPAD 3.50×3.50mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-32-EP(5x5))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

5.00 × 5.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.00mm · e=0.50mm

Pad Size (W × L)Level B

0.28 × 0.80 mm

Pins / Total PadsTopology

33P / 33Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit QFN-32-EP(5x5)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — SY89853UMG (QFN-32-EP(5x5))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of SY89853UMG (QFN-32-EP(5x5))?

Manufactured by MICROCHIP, the SY89853UMG is housed in a QFN-32-EP(5x5) package with 33 pins and a 0.50 mm lead pitch. Key pins include: 1 (INB0: Multiplexed I/O & Peripheral Pin INB0 (General)), 2 (VTB0: Multiplexed I/O & Peripheral Pin VTB0 (General)), 3 (VREF-ACB0: Multiplexed I/O & Peripheral Pin VREF-ACB0 (General)), 4 (#INB0: Multiplexed I/O & Peripheral Pin #INB0 (General)), 5 (INB1: Multiplexed I/O & Peripheral Pin INB1 (General)), 6 (VTB1: Multiplexed I/O & Peripheral Pin VTB1 (General)).

What are the IPC-7351B PCB Footprint dimensions for SY89853UMG?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), SY89853UMG (QFN-32-EP(5x5)) has a nominal body envelope of 5.00 × 5.00 mm, pitch e = 0.50 mm, and 33 copper pads plus a central exposed thermal pad (EPAD) of 3.50 × 3.50 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for SY89853UMG?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for SY89853UMG (MICROCHIP, QFN-32-EP(5x5)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (33 pins) & SY89853 Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	INB0	Digital_IO	Signal terminal INB0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: INB0. Supported peripheral buses: General.
2	VTB0	Digital_IO	Signal terminal VTB0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VTB0. Supported peripheral buses: General.
3	VREF-ACB0	Analog	Signal terminal VREF-ACB0 (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF-ACB0. Supported peripheral buses: General.
4	#INB0	Digital_IO	Signal terminal #INB0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #INB0. Supported peripheral buses: General.
5	INB1	Digital_IO	Signal terminal INB1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: INB1. Supported peripheral buses: General.
6	VTB1	Digital_IO	Signal terminal VTB1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VTB1. Supported peripheral buses: General.
7	VREF-ACB1	Analog	Signal terminal VREF-ACB1 (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF-ACB1. Supported peripheral buses: General.
8	#INB1	Digital_IO	Signal terminal #INB1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #INB1. Supported peripheral buses: General.
9	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
10	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
11	#QB	Digital_IO	Signal terminal #QB (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #QB. Supported peripheral buses: General.
12	QB	Digital_IO	Signal terminal QB (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: QB. Supported peripheral buses: General.
13	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
14	NC	NC	Signal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
15	SELB	Digital_IO	Signal terminal SELB (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SELB. Supported peripheral buses: General.
16	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
17	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
18	SELA	Digital_IO	Signal terminal SELA (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: SELA. Supported peripheral buses: General.
19	NC	NC	Signal terminal NC (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
20	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
21	#QA	Digital_IO	Signal terminal #QA (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #QA. Supported peripheral buses: General.
22	QA	Digital_IO	Signal terminal QA (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: QA. Supported peripheral buses: General.
23	VCC	Power_In	Primary positive power supply input (VCC) operating in the 3.3V / 5.0V Standard Logic domain (Max rating: 5.5V).
24	GND	GND	0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
25	INA0	Digital_IO	Signal terminal INA0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: INA0. Supported peripheral buses: General.
26	VTA0	Digital_IO	Signal terminal VTA0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VTA0. Supported peripheral buses: General.
27	VREF-ACA0	Analog	Signal terminal VREF-ACA0 (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF-ACA0. Supported peripheral buses: General.
28	#INA0	Digital_IO	Signal terminal #INA0 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #INA0. Supported peripheral buses: General.
29	INA1	Digital_IO	Signal terminal INA1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: INA1. Supported peripheral buses: General.
30	VTA1	Digital_IO	Signal terminal VTA1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VTA1. Supported peripheral buses: General.
31	VREF-ACA1	Analog	Signal terminal VREF-ACA1 (Analog, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: VREF-ACA1. Supported peripheral buses: General.
32	#INA1	Digital_IO	Signal terminal #INA1 (I/O, 3.3V / 5.0V Standard Logic domain). Multiplexed alternate functions: #INA1. Supported peripheral buses: General.
33	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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