PIC16F1827T-I/ML (QFN-28-EP(6x6)) — Schematic Symbol, IPC-7351B Footprint & 3D STEP Model

Q: What is the Pinout and operating voltage specification of PIC16F1827T-I/ML (QFN-28-EP(6x6))?

Manufactured by MICROCHIP, the PIC16F1827T-I/ML is housed in a QFN-28-EP(6x6) package with 29 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1.8V-5.5V. Key pins include: 1 (RA5/MCLR#/VPP: Multiplexed I/O & Peripheral Pin RA5/MCLR#/VPP (General)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (VSS: Ground Reference Pin (VSS)), 4 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

Q: What are the IPC-7351B PCB Footprint dimensions for PIC16F1827T-I/ML?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16F1827T-I/ML (QFN-28-EP(6x6)) has a nominal body envelope of 6.00 × 6.00 mm, pitch e = 0.65 mm, and 29 copper pads plus a central exposed thermal pad (EPAD) of 4.20 × 4.20 mm with a 60% IPC-7525 windowed solder paste grid.

Q: Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16F1827T-I/ML?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16F1827T-I/ML (MICROCHIP, QFN-28-EP(6x6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

1. SYMBOL

2. 2D FOOTPRINT

3. 3D CAD MODEL

Package Body: 6.00mm × 6.00mm · Pitch: 0.65mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (29/29)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D

Pin	Symbol	Type	Function (EN)
1	RA5/MCLR#/VPP	I/O	Multiplexed I/O & Peripheral Pin RA5/MCLR#/VPP (General)
2	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
3	VSS	GND	Ground Reference Pin (VSS)
4	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
5	VSS	GND	Ground Reference Pin (VSS)
6	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
7	RB0	I/O	Multiplexed I/O & Peripheral Pin RB0 (General)
8	RB1	I/O	Multiplexed I/O & Peripheral Pin RB1 (General)
9	RB2	I/O	Multiplexed I/O & Peripheral Pin RB2 (General)
10	RB3	I/O	Multiplexed I/O & Peripheral Pin RB3 (General)
11	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
12	RB4	I/O	Multiplexed I/O & Peripheral Pin RB4 (General)
13	RB5	I/O	Multiplexed I/O & Peripheral Pin RB5 (General)
14	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
15	RB6	I/O	Multiplexed I/O & Peripheral Pin RB6 (General)
16	RB7	I/O	Multiplexed I/O & Peripheral Pin RB7 (General)
17	VDD	Power	Power Supply Input (VDD — 1.8V-5.5V)
18	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
19	VDD	Power	Power Supply Input (VDD — 1.8V-5.5V)
20	RA6	I/O	Multiplexed I/O & Peripheral Pin RA6 (General)
21	RA7	I/O	Multiplexed I/O & Peripheral Pin RA7 (General)
22	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
23	RA0	I/O	Multiplexed I/O & Peripheral Pin RA0 (General)
24	RA1	I/O	Multiplexed I/O & Peripheral Pin RA1 (General)
25	NC	I/O	Multiplexed I/O & Peripheral Pin NC (General)
26	RA2	I/O	Multiplexed I/O & Peripheral Pin RA2 (General)
27	RA3	I/O	Multiplexed I/O & Peripheral Pin RA3 (General)
28	RA4	I/O	Multiplexed I/O & Peripheral Pin RA4 (General)
29	EP	GND	Exposed Thermal & Ground Pad (EP)

PIN 1 RA5/MCLR#/VPP

I/O

Multiplexed I/O & Peripheral Pin RA5/MCLR#/VPP (General)

Design note: Signal terminal RA5/MCLR#/VPP (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA5/MCLR#/VPP. Supported peripheral buses: General.

IPC-7351B Solder Density & Span C/G/Z Tuner

Extracted Drawings Gallery (6 Standard Drawings + 13 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen

1. Realistic 3D PackageREPRESENTATIVE

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 1. Realistic 3D Package

Detailed solid 3D bodyExpand ›

2. Standard Pinout (Top View)CLEANROOM PINOUT

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 2. Standard Pinout (Top View)

True package pinout (29 pins)Expand ›

3. Original Datasheet PinoutPDF PINOUT

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 3. Original Datasheet Pinout

Uncropped datasheet pin diagramExpand ›

4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 4. Package Dimensions (D×E×A)

QFN-28-EP(6x6) · 6.00×6.00mm · Pitch 0.65mmExpand ›

5. Recommended Land PatternLAND PATTERN

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 5. Recommended Land Pattern

IPC-7351B Footprint (29 Pads)Expand ›

6. Application SchematicSCHEMATIC

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 6. Application Schematic

Typical Application SchematicExpand ›

Original Datasheet Pinouts & Technical Drawings (13 figures · Page 1/2)

Showing 1–12 of 13 uncropped original figures for PIC16F1827T

P1 · p01_fig01752×399px

PIC16(L)F1826/27

P1 · p01_fig01P1

Datasheet Page 1 (p01_fig01)

P2 · p02_fig011777×1640px

PIC16F1827T-I/ML (QFN-28-EP(6x6)) — DS41391D-page 2  2011 Microchip Technology Inc. | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Inc

DS41391D-page 2  2011 Microchip Technology Inc. | Trademarks | FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Inc

P2 · p02_fig02788×285px

ISBN: 978-1-61341-124-7

P131 · p131_fig011582×803px

FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM

P204 · p204_fig01867×516px

FIGURE 24-1: CAPTURE MODE OPERATION BLOCK DIAGRAM

P206 · p206_fig011716×698px

FIGURE 24-2: COMPARE MODE OPERATION BLOCK DIAGRAM

P206 · p206_fig021784×630px

PIC16(L)F1827 CCP4

P224 · p224_fig011738×565px

FIGURE 24-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRxSYNC = 0)

P224 · p224_fig021777×682px

FIGURE 24-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STRxSYNC = 1)

P323 · p323_fig011416×1013px

FIGURE 28-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING

P323 · p323_fig01P323

Datasheet Page 323 (p323_fig01)

Page 1 / 2 (13 extracted figures)

Technical Specifications & Part Details (PIC16F1827T-I/ML)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)

Standard Electronic & Interconnect Component

Detailed Overview:PIC16F1827T-I/ML (QFN-28-EP(6x6)) is a 28-pin standard electronic & interconnect component featuring a 6.00 × 6.00 × 1.00 mm mechanical envelope (lead pitch e = 0.65 mm). Rated for 1.8V-5.5V supply operation across -40°C ~ +85°C (Industrial Grade) with integrated SPI, I2C, ADC, DAC, PWM interfaces.

Operating Supply VoltageV_CC / V_DD

1.8V-5.5V

Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins

Ambient Operating TemperatureT_A

-40°C ~ +85°C (Industrial Grade)

Industrial temperature grade; T_J(max) = +125°C

Clock / RF Operating Frequencyf_CLK / f_RF

32 MHz

Extracted from authoritative PDF specification tables

Current & Power RatingI_OUT / I_CC

I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA

Observe per-pin absolute maximum current limits

Package Envelope (D × E × A)D × E × A

6.00 × 6.00 × 1.00 mm (A1=0.03 mm)

Package family: QFN (QFN-28-EP(6x6))

Pin Count & Lead PitchN / e

28 Pins | Pitch e = 0.65 mm (25.6 mil)

Normalized to Center-to-Center Span C per IPC-7351B

Integrated Peripheral InterfacesBuses

SPI, I2C, ADC, DAC, PWM

Cross-linked with 4D Pinout & Schematic Symbol

Reflow & Moisture SensitivityIPC / MSL

IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3

60% windowed solder paste stencil on thermal EPAD

Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.

Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export

5/5 PASS

IEEE-315 Symbol29 auto-grouped pins

IPC-7351B Land Pattern29 pads · Pitch 0.65mm

IPC-7525 60% Solder PasteEPAD 4.20×4.20mm windowed grid

DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm

3D STEP AP214 & GLBAligned coordinate origin (0,0,0)

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet

5.00 PCB Verified

Mechanical Dimensions & Land Pattern (QFN-28-EP(6x6))

Extracted from Datasheet & IPC-7351B Normalized

Package Body (D × E)Nominal

6.00 × 6.00 mm

Height (A) & Pitch (e)IPC-7351B

A=1.00mm · e=0.65mm

Pad Size (W × L)Level B

0.28 × 0.80 mm

Pins / Total PadsTopology

29P / 29Pad (QUAD_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives

DFM READY

Designator / Replacement MPN	Value / Package	Function & PCB Layout Rule
N/A BOM	Per application circuit QFN-28-EP(6x6)	Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16F1827T-I/ML (QFN-28-EP(6x6))

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats

IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16F1827T-I/ML (QFN-28-EP(6x6))?

Manufactured by MICROCHIP, the PIC16F1827T-I/ML is housed in a QFN-28-EP(6x6) package with 29 pins and a 0.65 mm lead pitch, supporting a VCC supply range of 1.8V-5.5V. Key pins include: 1 (RA5/MCLR#/VPP: Multiplexed I/O & Peripheral Pin RA5/MCLR#/VPP (General)), 2 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 3 (VSS: Ground Reference Pin (VSS)), 4 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 5 (VSS: Ground Reference Pin (VSS)), 6 (NC: Multiplexed I/O & Peripheral Pin NC (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16F1827T-I/ML?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16F1827T-I/ML (QFN-28-EP(6x6)) has a nominal body envelope of 6.00 × 6.00 mm, pitch e = 0.65 mm, and 29 copper pads plus a central exposed thermal pad (EPAD) of 4.20 × 4.20 mm with a 60% IPC-7525 windowed solder paste grid.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16F1827T-I/ML?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16F1827T-I/ML (MICROCHIP, QFN-28-EP(6x6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (29 pins) & PIC16F1827T Family VariantsExpand static table

Pin #	Signal Name	Electrical Type	Functional Description & Design Notes
1	RA5/MCLR#/VPP	Digital_IO	Signal terminal RA5/MCLR#/VPP (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA5/MCLR#/VPP. Supported peripheral buses: General.
2	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
3	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
4	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
5	VSS	GND	0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
6	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
7	RB0	Digital_IO	Signal terminal RB0 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: General.
8	RB1	Digital_IO	Signal terminal RB1 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
9	RB2	Digital_IO	Signal terminal RB2 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
10	RB3	Digital_IO	Signal terminal RB3 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB3. Supported peripheral buses: General.
11	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
12	RB4	Digital_IO	Signal terminal RB4 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
13	RB5	Digital_IO	Signal terminal RB5 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
14	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
15	RB6	Digital_IO	Signal terminal RB6 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB6. Supported peripheral buses: General.
16	RB7	Digital_IO	Signal terminal RB7 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RB7. Supported peripheral buses: General.
17	VDD	Power_In	Primary positive power supply input (VDD) operating in the 1.8V-5.5V domain (Max rating: 5.5V).
18	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
19	VDD	Power_In	Primary positive power supply input (VDD) operating in the 1.8V-5.5V domain (Max rating: 5.5V).
20	RA6	Digital_IO	Signal terminal RA6 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA6. Supported peripheral buses: General.
21	RA7	Digital_IO	Signal terminal RA7 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA7. Supported peripheral buses: General.
22	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
23	RA0	Digital_IO	Signal terminal RA0 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA0. Supported peripheral buses: General.
24	RA1	Digital_IO	Signal terminal RA1 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA1. Supported peripheral buses: General.
25	NC	NC	Signal terminal NC (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
26	RA2	Digital_IO	Signal terminal RA2 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
27	RA3	Digital_IO	Signal terminal RA3 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA3. Supported peripheral buses: General.
28	RA4	Digital_IO	Signal terminal RA4 (I/O, 1.8V-5.5V domain). Multiplexed alternate functions: RA4. Supported peripheral buses: General.
29	EP	GND	Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return.

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