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ATTINY261V-10SU (SOIC-20-300mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

ATTINY261V-10SU

MICROCHIPID: C185503SOIC-20-300mil · 20 Pins · Pitch 1.27mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · ATTINY261V-10SU (SOIC-20-300mil)1OC1A•OC1OE22IO233V34(OC1B/PCINT15VCC6GND7NC8IO09IO410IO520IO919PA1(ADC1/DO/18IO1917PA3(AREF/PCI16AGND15AVCC14PA4(ADC3/ICP13PA5(ADC4/AIN12PA6(ADC5/AIN11PA7(ADC6/AINGrid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.817.812.77.62.5-2.5-7.6-12.7-17.8mm
2. 2D FOOTPRINT
1234567891011121314151617181920E=7.50mm · Pitch e=1.27mmD=12.80mm-9-7-5-3-11357997531-1-3-5-7-9mm
3. 3D CAD MODEL
Package Body: 7.50mm × 12.80mm · Pitch: 1.27mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (20/20)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1OC1A•OC1OE2I/OMultiplexed I/O & Peripheral Pin OC1A•OC1OE2 (PWM)
2IO2I/OGeneral Purpose Digital I/O Pin IO2
33V3Power3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4(OC1B/PCINT11)PB3I/OMultiplexed I/O & Peripheral Pin (OC1B/PCINT11)PB3 (PWM)
5VCCPowerPower Supply Input (VCC — 1.8V to 5.5V)
6GNDGNDGround Reference Pin (GND)
7NCNCNo Connect (Leave Floating)
8IO0I/OGPIO0 / RTC_GPIO0 (Chip Boot Mode Strapping Pin)
9IO4I/OGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5I/OGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11PA7(ADC6/AIN1/PCINT7)I/OMultiplexed I/O & Peripheral Pin PA7(ADC6/AIN1/PCINT7) (ADC)
12PA6(ADC5/AIN0/PCINT6)I/OMultiplexed I/O & Peripheral Pin PA6(ADC5/AIN0/PCINT6) (ADC)
13PA5(ADC4/AIN2/PCINT5)I/OMultiplexed I/O & Peripheral Pin PA5(ADC4/AIN2/PCINT5) (ADC)
14PA4(ADC3/ICP0/PCINT4)I/OMultiplexed I/O & Peripheral Pin PA4(ADC3/ICP0/PCINT4) (ADC)
15AVCCPowerPower Supply Input (AVCC — 1.8V to 5.5V)
16AGNDGNDGround Reference Pin (AGND)
17PA3(AREF/PCINT3)I/OMultiplexed I/O & Peripheral Pin PA3(AREF/PCINT3) (ADC)
18IO19I/OGPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19PA1(ADC1/DO/PCINT1)I/OMultiplexed I/O & Peripheral Pin PA1(ADC1/DO/PCINT1) (ADC)
20IO9I/OGPIO9 / RTC_GPIO9 / TOUCH9 / ADC1_CH8 / FSPIHD
PIN 1 OC1A•OC1OE2
I/O
Multiplexed I/O & Peripheral Pin OC1A•OC1OE2 (PWM)
Design note: Signal terminal OC1A•OC1OE2 (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: OC1A•OC1OE2. Supported peripheral buses: PWM.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 6 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: ATTINY261V-10SU (MICROCHIP · SOIC-20-300mil)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
ATTINY261V-10SU (SOIC-20-300mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
ATTINY261V-10SU (SOIC-20-300mil) - 2. Standard Pinout (Top View)
True package pinout (20 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
ATTINY261V-10SU (SOIC-20-300mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
ATTINY261V-10SU (SOIC-20-300mil) - 4. Package Dimensions (D×E×A)
SOIC-20-300mil · 7.50×12.80mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
ATTINY261V-10SU (SOIC-20-300mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (20 Pads)Expand ›
6. Application SchematicSCHEMATIC
ATTINY261V-10SU (SOIC-20-300mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (6 figures · Page 1/1)
Showing 1–6 of 6 uncropped original figures for ATTINY261V
P1 · p01_fig01652×376px
ATTINY261V-10SU (SOIC-20-300mil) — 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash
8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash
P98 · p98_fig011573×1926px
ATTINY261V-10SU (SOIC-20-300mil) — Figure 12-10. Compare Match Output Unit, Schematic clkI/O
Figure 12-10. Compare Match Output Unit, Schematic clkI/O
P98 · p98_fig01P98
ATTINY261V-10SU (SOIC-20-300mil) — Datasheet Page 98 (p98_fig01)
Datasheet Page 98 (p98_fig01)
P99 · p99_fig012050×866px
ATTINY261V-10SU (SOIC-20-300mil) — Figure 12-11. Normal Mode, Timing Diagram
Figure 12-11. Normal Mode, Timing Diagram
P2 · p02_fig01All Packages in PDF
ATTINY261V-10SU (SOIC-20-300mil) — Figure 1-1. Pinout ATtiny261/461/861 and ATtiny261V/461V/861V
Figure 1-1. Pinout ATtiny261/461/861 and ATtiny261V/461V/861V
P231 · p231_fig01All Packages in PDF
ATTINY261V-10SU (SOIC-20-300mil) — ATtiny261/461/861
ATtiny261/461/861

Technical Specifications & Part Details (ATTINY261V-10SU)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:ATTINY261V-10SU (SOIC-20-300mil) is a 20-pin standard electronic & interconnect component featuring a 12.80 × 7.50 × 2.70 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 1.8V to 5.5V supply operation across -65°C to +150°C with integrated SPI, I2C, ADC, PWM, RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
1.8V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-65°C to +150°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
4 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
12.80 × 7.50 × 2.70 mm (A1=0.20 mm)
Package family: SOIC (SOIC-20-300mil)
Pin Count & Lead PitchN / e
20 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
SPI, I2C, ADC, PWM, RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol20 auto-grouped pins
OK
IPC-7351B Land Pattern20 pads · Pitch 1.27mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (SOIC-20-300mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
12.80 × 7.50 mm
Height (A) & Pitch (e)IPC-7351B
A=2.70mm · e=1.27mm
Pad Size (W × L)Level B
0.60 × 1.90 mm
Pins / Total PadsTopology
20P / 20Pad (DUAL_ROW)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
SOIC-20-300mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — ATTINY261V-10SU (SOIC-20-300mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of ATTINY261V-10SU (SOIC-20-300mil)?

Manufactured by MICROCHIP, the ATTINY261V-10SU is housed in a SOIC-20-300mil package with 20 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 1.8V to 5.5V. Key pins include: 1 (OC1A•OC1OE2: Multiplexed I/O & Peripheral Pin OC1A•OC1OE2 (PWM)), 2 (IO2: General Purpose Digital I/O Pin IO2), 3 (3V3: 3.3V Main Power Supply Rail (3.0V ~ 3.6V)), 4 ((OC1B/PCINT11)PB3: Multiplexed I/O & Peripheral Pin (OC1B/PCINT11)PB3 (PWM)), 5 (VCC: Power Supply Input (VCC — 1.8V to 5.5V)), 6 (GND: Ground Reference Pin (GND)).

What are the IPC-7351B PCB Footprint dimensions for ATTINY261V-10SU?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), ATTINY261V-10SU (SOIC-20-300mil) has a nominal body envelope of 7.50 × 12.80 mm, pitch e = 1.27 mm, and 20 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for ATTINY261V-10SU?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for ATTINY261V-10SU (MICROCHIP, SOIC-20-300mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (20 pins) & ATTINY261V Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1OC1A•OC1OE2Digital_IOSignal terminal OC1A•OC1OE2 (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: OC1A•OC1OE2. Supported peripheral buses: PWM.
2IO2Digital_IOGeneral Purpose Digital I/O Pin IO2
33V3Power_In3.3V Main Power Supply Rail (3.0V ~ 3.6V)
4(OC1B/PCINT11)PB3Digital_IOSignal terminal (OC1B/PCINT11)PB3 (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: (OC1B/PCINT11)PB3. Supported peripheral buses: PWM.
5VCCPower_InPrimary positive power supply input (VCC) operating in the 1.8V to 5.5V domain (Max rating: 5.5V).
6GNDGND0V electrical ground return terminal (GND) for internal core logic, I/O drivers, and analog sub-blocks.
7NCNo_ConnectNo Connect (Leave Floating)
8IO0Digital_IOGPIO0 / RTC_GPIO0 (Chip Boot Mode Strapping Pin)
9IO4Digital_IOGPIO4 / RTC_GPIO4 / TOUCH4 / ADC1_CH3
10IO5Digital_IOGPIO5 / RTC_GPIO5 / TOUCH5 / ADC1_CH4
11PA7(ADC6/AIN1/PCINT7)AnalogSignal terminal PA7(ADC6/AIN1/PCINT7) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA7(ADC6/AIN1/PCINT7). Supported peripheral buses: ADC.
12PA6(ADC5/AIN0/PCINT6)AnalogSignal terminal PA6(ADC5/AIN0/PCINT6) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA6(ADC5/AIN0/PCINT6). Supported peripheral buses: ADC.
13PA5(ADC4/AIN2/PCINT5)AnalogSignal terminal PA5(ADC4/AIN2/PCINT5) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA5(ADC4/AIN2/PCINT5). Supported peripheral buses: ADC.
14PA4(ADC3/ICP0/PCINT4)AnalogSignal terminal PA4(ADC3/ICP0/PCINT4) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA4(ADC3/ICP0/PCINT4). Supported peripheral buses: ADC.
15AVCCPower_InPrimary positive power supply input (AVCC) operating in the 1.8V to 5.5V domain (Max rating: 5.5V).
16AGNDGND0V electrical ground return terminal (AGND) for internal core logic, I/O drivers, and analog sub-blocks.
17PA3(AREF/PCINT3)Digital_IOSignal terminal PA3(AREF/PCINT3) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA3(AREF/PCINT3). Supported peripheral buses: ADC.
18IO19Digital_IOGPIO19 / RTC_GPIO19 / USB_D- / U1RTS / ADC2_CH8
19PA1(ADC1/DO/PCINT1)AnalogSignal terminal PA1(ADC1/DO/PCINT1) (I/O, 1.8V to 5.5V domain). Multiplexed alternate functions: PA1(ADC1/DO/PCINT1). Supported peripheral buses: ADC.
20IO9Digital_IOGPIO9 / RTC_GPIO9 / TOUCH9 / ADC1_CH8 / FSPIHD
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