![25AA256-E/MF (DFN-8-EP(5x6)) — 25AA256/25LC256 | PRODUCT IDENTIFICATION SYSTEM (NON-AUTOMOTIVE) | To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. | PART NO. [X] /XX | Package Tape and Reel Device | Tape and R](/api/v1/assets/C1350893/extracted/figures/p32_fig01.png)
![25AA256-E/MF (DFN-8-EP(5x6)) — 25AA256/25LC256 [DIP-8]](/api/v1/assets/C511298/extracted/figures/p21_fig01.png)
DIP-8 · 8P
Synchronized Pinout (Symbol / 2D / 3D) (9/9)
Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D| Pin | Symbol | Type | Function (EN) |
|---|---|---|---|
| 1 | CS | I/O | Multiplexed I/O & Peripheral Pin CS (General) |
| 2 | SO | I/O | Multiplexed I/O & Peripheral Pin SO (General) |
| 3 | WP | I/O | Multiplexed I/O & Peripheral Pin WP (General) |
| 4 | VSS | GND | Ground Reference Pin (VSS) |
| 5 | SI | I/O | Multiplexed I/O & Peripheral Pin SI (General) |
| 6 | SCK | I/O | Multiplexed I/O & Peripheral Pin SCK (SPI) |
| 7 | HOLD | I/O | Multiplexed I/O & Peripheral Pin HOLD (General) |
| 8 | VCC | Power | Power Supply Input (VCC — 2.5V-5.5V) |
| 9 | EP | GND | Exposed Thermal & Ground Pad (EP) |
PIN 1 CS
I/OMultiplexed I/O & Peripheral Pin CS (General)
Design note: ChipSelectInput
IPC-7351B Solder Density & Span C/G/Z Tuner
Extracted Drawings Gallery (6 Standard Drawings + 11 Extracted Figures)
Read the original datasheet PDF directly or click any drawing to view fullscreen1. Realistic 3D PackageREPRESENTATIVE
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
True package pinout (9 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
DFN-8-EP(5x6) · 5.00×6.00mm · Pitch 1.27mmExpand ›
5. Recommended Land PatternLAND PATTERN
IPC-7351B Footprint (9 Pads)Expand ›
6. Application SchematicSCHEMATIC
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (11 figures · Page 1/1)
Showing 1–11 of 11 uncropped original figures for 25AA256
P1 · p01_fig01376×200px
P1 · p01_fig021777×712px
P1 · p01_fig02P1
P14 · p14_fig011777×2563px
P14 · p14_fig01P14
P22 · p22_fig011297×1485px
P23 · p23_fig01990×909px
P23 · p23_fig01P23
P32 · p32_fig011776×1647px
P29 · p29_fig011777×1328px
P21 · p21_fig01All Packages in PDF
Technical Specifications & Part Details (25AA256-E/MF)
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)Detailed Overview:25AA256-E/MF (DFN-8-EP(5x6)) is a 8-pin standard electronic & interconnect component featuring a 6.00 × 5.00 × 1.00 mm mechanical envelope (lead pitch e = 1.27 mm). Rated for 2.5V-5.5V supply operation across -40°C to +125°C with integrated SPI interfaces.
Operating Supply VoltageV_CC / V_DD
2.5V-5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to +125°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
10 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
6.00 × 5.00 × 1.00 mm (A1=0.03 mm)
Package family: DFN (DFN-8-EP(5x6))
Pin Count & Lead PitchN / e
8 Pins | Pitch e = 1.27 mm (50.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
SPI
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.
5-Point Standards Verification
Automated compliance checks prior to exportIEEE-315 Symbol9 auto-grouped pins
IPC-7351B Land Pattern9 pads · Pitch 1.27mm
IPC-7525 60% Solder PasteEPAD 4.10×2.40mm windowed grid
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
Hardware Verification & Community Engineering Reviews
Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet5.00 PCB Verified
IPC-7351B
Select package variant or sibling MPN sharing this datasheetFamily Variants & Same Datasheet Chips — 25AA256 (2)
DFN-8-EP(5x6) · 9P
Mechanical Dimensions & Land Pattern (DFN-8-EP(5x6))
Extracted from Datasheet & IPC-7351B NormalizedPackage Body (D × E)Nominal
6.00 × 5.00 mm
Height (A) & Pitch (e)IPC-7351B
A=1.00mm · e=1.27mm
Pad Size (W × L)Level B
0.65 × 1.10 mm
Pins / Total PadsTopology
9P / 9Pad (DUAL_ROW)
Recommended Companion BOM & Drop-In Equivalents
Passive external components per reference schematic and 1:1 pin-compatible alternatives| Designator / Replacement MPN | Value / Package | Function & PCB Layout Rule |
|---|---|---|
| N/A BOM | Per application circuit DFN-8-EP(5x6) | Size power & signal trace widths for rated load current following IPC-2221 clearance rules. |
Technical Frequently Asked Questions (FAQ) — 25AA256-E/MF (DFN-8-EP(5x6))
Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formatsWhat is the Pinout and operating voltage specification of 25AA256-E/MF (DFN-8-EP(5x6))?
Manufactured by MICROCHIP, the 25AA256-E/MF is housed in a DFN-8-EP(5x6) package with 9 pins and a 1.27 mm lead pitch, supporting a VCC supply range of 2.5V-5.5V. Key pins include: 1 (CS: Multiplexed I/O & Peripheral Pin CS (General)), 2 (SO: Multiplexed I/O & Peripheral Pin SO (General)), 3 (WP: Multiplexed I/O & Peripheral Pin WP (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (SI: Multiplexed I/O & Peripheral Pin SI (General)), 6 (SCK: Multiplexed I/O & Peripheral Pin SCK (SPI)).
What are the IPC-7351B PCB Footprint dimensions for 25AA256-E/MF?
Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), 25AA256-E/MF (DFN-8-EP(5x6)) has a nominal body envelope of 5.00 × 6.00 mm, pitch e = 1.27 mm, and 9 copper pads plus a central exposed thermal pad (EPAD) of 4.10 × 2.40 mm with a 60% IPC-7525 windowed solder paste grid.
Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for 25AA256-E/MF?
You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for 25AA256-E/MF (MICROCHIP, DFN-8-EP(5x6)) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.
Static Reference Appendix: Pinout Table (9 pins) & 25AA256 Family VariantsExpand static table
| Pin # | Signal Name | Electrical Type | Functional Description & Design Notes |
|---|---|---|---|
| 1 | CS | Digital_IO | Signal terminal CS (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: CS. Supported peripheral buses: General. |
| 2 | SO | Digital_IO | Signal terminal SO (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: SO. Supported peripheral buses: General. |
| 3 | WP | Digital_IO | Signal terminal WP (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: WP. Supported peripheral buses: General. |
| 4 | VSS | GND | 0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks. |
| 5 | SI | Digital_IO | Signal terminal SI (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: SI. Supported peripheral buses: General. |
| 6 | SCK | Digital_IO | Signal terminal SCK (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: SCK. Supported peripheral buses: SPI. |
| 7 | HOLD | Digital_IO | Signal terminal HOLD (I/O, 2.5V-5.5V domain). Multiplexed alternate functions: HOLD. Supported peripheral buses: General. |
| 8 | VCC | Power_In | Primary positive power supply input (VCC) operating in the 2.5V-5.5V domain (Max rating: 5.5V). |
| 9 | EP | GND | Bottom exposed die attach pad (EP) providing primary thermal conduction path to the PCB and low-inductance 0V ground return. |