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PIC16F57-I/P (DIP-28-600mil) — Symbol, Footprint IPC-7351B & 3D STEP Model

PIC16F57-I/P

MICROCHIPID: C11984DIP-28-600mil · 28 Pins · Pitch 2.54mmIPC-7351B Verified5.0 (0)
SYNCHRONIZED 4D CROSS-PROBE MODETouch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
1. SYMBOL
U1 · PIC16F57-I/P (DIP-28-600mil)1T0/CKI2VDD3NC4VSS5NC6RA07RA18RA29RA310RB011RB112RB213RB314RB428MCLR/VPP27OSC1/CLKIN26OSC2/CLKOUT25RC724RC623RC522RC421RC320FSR19PCL18OPTION17STATUS16RB6/ICSPCLK15RB5Grid Pitch = 2.54mm (IEEE-315)-17.8-12.7-7.6-2.52.57.612.717.822.917.812.77.62.5-2.5-7.6-12.7-17.8-22.9mm
2. 2D FOOTPRINT
12345678910111213141516171819202122232425262728E=14.35mm · Pitch e=2.54mmD=35.02mm-18-16-14-12-10-8-6-4-202468101214161827252321191715131197531-1-3-5-7-9-11-13-15-17-19-21-23-25-27mm
3. 3D CAD MODEL
Package Body: 14.35mm × 35.02mm · Pitch: 2.54mm · Ruler Step: 1.00mmSynced <100ms

Synchronized Pinout (Symbol / 2D / 3D) (28/28)

Touch or hover any pin to highlight concurrently across Symbol, Footprint and 3D
PinSymbolTypeFunction (EN)
1T0/CKII/OMultiplexed I/O & Peripheral Pin T0/CKI (General)
2VDDPowerPower Supply Input (VDD — 2.0V to 5.5V)
3NCI/OMultiplexed I/O & Peripheral Pin NC (General)
4VSSGNDGround Reference Pin (VSS)
5NCI/OMultiplexed I/O & Peripheral Pin NC (General)
6RA0I/OMultiplexed I/O & Peripheral Pin RA0 (General)
7RA1I/OMultiplexed I/O & Peripheral Pin RA1 (General)
8RA2I/OMultiplexed I/O & Peripheral Pin RA2 (General)
9RA3I/OMultiplexed I/O & Peripheral Pin RA3 (General)
10RB0I/OMultiplexed I/O & Peripheral Pin RB0 (General)
11RB1I/OMultiplexed I/O & Peripheral Pin RB1 (General)
12RB2I/OMultiplexed I/O & Peripheral Pin RB2 (General)
13RB3I/OMultiplexed I/O & Peripheral Pin RB3 (General)
14RB4I/OMultiplexed I/O & Peripheral Pin RB4 (General)
15RB5I/OMultiplexed I/O & Peripheral Pin RB5 (General)
16RB6/ICSPCLKI/OMultiplexed I/O & Peripheral Pin RB6/ICSPCLK (General)
17STATUSI/OMultiplexed I/O & Peripheral Pin STATUS (General)
18OPTIONI/OMultiplexed I/O & Peripheral Pin OPTION (General)
19PCLI/OMultiplexed I/O & Peripheral Pin PCL (General)
20FSRI/OMultiplexed I/O & Peripheral Pin FSR (General)
21RC3I/OMultiplexed I/O & Peripheral Pin RC3 (General)
22RC4I/OMultiplexed I/O & Peripheral Pin RC4 (General)
23RC5I/OMultiplexed I/O & Peripheral Pin RC5 (General)
24RC6I/OMultiplexed I/O & Peripheral Pin RC6 (General)
25RC7I/OMultiplexed I/O & Peripheral Pin RC7 (General)
26OSC2/CLKOUTI/OMultiplexed I/O & Peripheral Pin OSC2/CLKOUT (RTC/CLK)
27OSC1/CLKINI/OMultiplexed I/O & Peripheral Pin OSC1/CLKIN (RTC/CLK)
28MCLR/VPPI/OMultiplexed I/O & Peripheral Pin MCLR/VPP (General)
PIN 1 T0/CKI
I/O
Multiplexed I/O & Peripheral Pin T0/CKI (General)
Design note: Signal terminal T0/CKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: T0/CKI. Supported peripheral buses: General.
IPC-7351B Solder Density & Span C/G/Z Tuner

Live Embedded Datasheet PDF & Technical Drawing Gallery (6 Standard Drawings + 8 Extracted Figures)

Read the original datasheet PDF directly or click any drawing to view fullscreen
Open PDF in New Window ↗Read Datasheet PDF (.pdf)
PDF VIEWEROfficial Datasheet Document: PIC16F57-I/P (MICROCHIP · DIP-28-600mil)
Scroll, search text (Ctrl+F), or expand directly inside the embedded PDF reader below
1. Realistic 3D PackageREPRESENTATIVE
PIC16F57-I/P (DIP-28-600mil) - 1. Realistic 3D Package
Detailed solid 3D bodyExpand ›
2. Standard Pinout (Top View)CLEANROOM PINOUT
PIC16F57-I/P (DIP-28-600mil) - 2. Standard Pinout (Top View)
True package pinout (28 pins)Expand ›
3. Original Datasheet PinoutPDF PINOUT
PIC16F57-I/P (DIP-28-600mil) - 3. Original Datasheet Pinout
Uncropped datasheet pin diagramExpand ›
4. Package Dimensions (D×E×A)PACKAGE DIMENSIONS
PIC16F57-I/P (DIP-28-600mil) - 4. Package Dimensions (D×E×A)
DIP-28-600mil · 14.35×35.02mm · Pitch 2.54mmExpand ›
5. Recommended Land PatternLAND PATTERN
PIC16F57-I/P (DIP-28-600mil) - 5. Recommended Land Pattern
IPC-7351B Footprint (28 Pads)Expand ›
6. Application SchematicSCHEMATIC
PIC16F57-I/P (DIP-28-600mil) - 6. Application Schematic
Typical Application SchematicExpand ›
Original Datasheet Pinouts & Technical Drawings (8 figures · Page 1/1)
Showing 1–8 of 8 uncropped original figures for PIC16F57
P2 · p02_fig011777×1636px
PIC16F57-I/P (DIP-28-600mil) — DS41213D-page ii © 2007 Microchip Technology Inc. | Trademarks | SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. | All other trademarks mentioned herein are property of their respective companies. | © 2007, Microch
DS41213D-page ii © 2007 Microchip Technology Inc. | Trademarks | SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. | All other trademarks mentioned herein are property of their respective companies. | © 2007, Microch
P2 · p02_fig02782×282px
PIC16F57-I/P (DIP-28-600mil) — DS41213D-page ii © 2007 Microchip Technology Inc.
DS41213D-page ii © 2007 Microchip Technology Inc.
P42 · p42_fig01931×845px
PIC16F57-I/P (DIP-28-600mil) — FIGURE 8-1: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING™ CONNECTION
FIGURE 8-1: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING™ CONNECTION
P42 · p42_fig01P42
PIC16F57-I/P (DIP-28-600mil) — Datasheet Page 42 (p42_fig01)
Datasheet Page 42 (p42_fig01)
P43 · p43_fig011778×1752px
PIC16F57-I/P (DIP-28-600mil) — FIGURE 9-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 5 4 0
FIGURE 9-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 5 4 0
P71 · p71_fig01All Packages in PDF
PIC16F57-I/P (DIP-28-600mil) — PIC16F5X
PIC16F5X
P78 · p78_fig01All Packages in PDF
PIC16F57-I/P (DIP-28-600mil) — DS41213D-page 76 © 2007 Microchip Technology Inc. | 28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microch
DS41213D-page 76 © 2007 Microchip Technology Inc. | 28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microch
P79 · p79_fig01All Packages in PDF
PIC16F57-I/P (DIP-28-600mil) — © 2007 Microchip Technology Inc. DS41213D-page 77 | 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microc
© 2007 Microchip Technology Inc. DS41213D-page 77 | 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP] | Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microc

Technical Specifications & Part Details (PIC16F57-I/P)

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet (EN)
Standard Electronic & Interconnect Component
Detailed Overview:PIC16F57-I/P (DIP-28-600mil) is a 28-pin standard electronic & interconnect component featuring a 35.02 × 14.35 × 4.20 mm mechanical envelope (lead pitch e = 2.54 mm). Rated for 2.0V to 5.5V supply operation across -40°C to 85°C with integrated RTC/CLK interfaces.
Operating Supply VoltageV_CC / V_DD
2.0V to 5.5V
Place 100nF + 10µF X7R decoupling capacitors < 2mm from supply pins
Ambient Operating TemperatureT_A
-40°C to 85°C
Industrial temperature grade; T_J(max) = +125°C
Clock / RF Operating Frequencyf_CLK / f_RF
20 MHz
Extracted from authoritative PDF specification tables
Current & Power RatingI_OUT / I_CC
I_GPIO(max) = ±20 mA / pin | I_VDD(total) ≤ 150 mA
Observe per-pin absolute maximum current limits
Package Envelope (D × E × A)D × E × A
35.02 × 14.35 × 4.20 mm (A1=0.51 mm)
Package family: DIP (DIP-28-600mil)
Pin Count & Lead PitchN / e
28 Pins | Pitch e = 2.54 mm (100.0 mil)
Normalized to Center-to-Center Span C per IPC-7351B
Integrated Peripheral InterfacesBuses
RTC/CLK
Cross-linked with 4D Pinout & Schematic Symbol
Reflow & Moisture SensitivityIPC / MSL
IPC-7351B Level B | J-STD-020 (Peak 260°C) | MSL-3
60% windowed solder paste stencil on thermal EPAD
Engineering Safety Alert: Verify Pin-1 chamfer orientation on Top Silkscreen prior to SMT pick-and-place assembly.
Engineering Safety Alert: Connect exposed thermal pad (if present) to internal ground plane via 0.3mm stitched thermal vias.

5-Point Standards Verification

Automated compliance checks prior to export
5/5 PASS
IEEE-315 Symbol28 auto-grouped pins
OK
IPC-7351B Land Pattern28 pads · Pitch 2.54mm
OK
IPC-7525 60% Solder PasteReflow 1:1 Standard
OK
DFM Rules JLCPCB / PCBWayMin pad clearance: 0.25mm
OK
3D STEP AP214 & GLBAligned coordinate origin (0,0,0)
OK

Hardware Verification & Community Engineering Reviews

Summary of electrical parameters, mechanical dimensions, voltage range and peripheral interfaces from Datasheet
5.00 PCB Verified

Mechanical Dimensions & Land Pattern (DIP-28-600mil)

Extracted from Datasheet & IPC-7351B Normalized
mm
Package Body (D × E)Nominal
35.02 × 14.35 mm
Height (A) & Pitch (e)IPC-7351B
A=4.20mm · e=2.54mm
Pad Size (W × L)Level B
1.60 × 1.60 mm
Pins / Total PadsTopology
28P / 28Pad (THT_DIP)

Recommended Companion BOM & Drop-In Equivalents

Passive external components per reference schematic and 1:1 pin-compatible alternatives
DFM READY
Designator / Replacement MPNValue / PackageFunction & PCB Layout Rule
N/A
BOM
Per application circuit
DIP-28-600mil
Size power & signal trace widths for rated load current following IPC-2221 clearance rules.

Technical Frequently Asked Questions (FAQ) — PIC16F57-I/P (DIP-28-600mil)

Quick answers covering Pinout, IPC-7351B Land Pattern dimensions, and CAD export formats
IPC-7351B / IEEE-315

What is the Pinout and operating voltage specification of PIC16F57-I/P (DIP-28-600mil)?

Manufactured by MICROCHIP, the PIC16F57-I/P is housed in a DIP-28-600mil package with 28 pins and a 2.54 mm lead pitch, supporting a VCC supply range of 2.0V to 5.5V. Key pins include: 1 (T0/CKI: Multiplexed I/O & Peripheral Pin T0/CKI (General)), 2 (VDD: Power Supply Input (VDD — 2.0V to 5.5V)), 3 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 4 (VSS: Ground Reference Pin (VSS)), 5 (NC: Multiplexed I/O & Peripheral Pin NC (General)), 6 (RA0: Multiplexed I/O & Peripheral Pin RA0 (General)).

What are the IPC-7351B PCB Footprint dimensions for PIC16F57-I/P?

Normalized from the official datasheet mechanical drawing per IPC-7351B (Density Level B Nominal), PIC16F57-I/P (DIP-28-600mil) has a nominal body envelope of 14.35 × 35.02 mm, pitch e = 2.54 mm, and 28 copper pads.

Where can I download KiCad (.kicad_mod, .kicad_sym), Fusion 360 (.lbr), and 3D STEP models for PIC16F57-I/P?

You can download the verified open-hardware (CERN-OHL-P-2.0) CAD library bundle for PIC16F57-I/P (MICROCHIP, DIP-28-600mil) directly on this page, including KiCad 8 Footprints (.kicad_mod), Schematic Symbols (.kicad_sym), Autodesk Fusion 360 / Eagle (.lbr), and 3D STEP AP214 / WebGL GLB models.

Static Reference Appendix: Pinout Table (28 pins) & PIC16F57 Family VariantsExpand static table
Pin #Signal NameElectrical TypeFunctional Description & Design Notes
1T0/CKIDigital_IOSignal terminal T0/CKI (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: T0/CKI. Supported peripheral buses: General.
2VDDPower_InPrimary positive power supply input (VDD) operating in the 2.0V to 5.5V domain (Max rating: 5.5V).
3NCNCSignal terminal NC (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
4VSSGND0V electrical ground return terminal (VSS) for internal core logic, I/O drivers, and analog sub-blocks.
5NCNCSignal terminal NC (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: NC. Supported peripheral buses: General.
6RA0Digital_IOSignal terminal RA0 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA0. Supported peripheral buses: General.
7RA1Digital_IOSignal terminal RA1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA1. Supported peripheral buses: General.
8RA2Digital_IOSignal terminal RA2 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA2. Supported peripheral buses: General.
9RA3Digital_IOSignal terminal RA3 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RA3. Supported peripheral buses: General.
10RB0Digital_IOSignal terminal RB0 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB0. Supported peripheral buses: General.
11RB1Digital_IOSignal terminal RB1 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB1. Supported peripheral buses: General.
12RB2Digital_IOSignal terminal RB2 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB2. Supported peripheral buses: General.
13RB3Digital_IOSignal terminal RB3 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB3. Supported peripheral buses: General.
14RB4Digital_IOSignal terminal RB4 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB4. Supported peripheral buses: General.
15RB5Digital_IOSignal terminal RB5 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB5. Supported peripheral buses: General.
16RB6/ICSPCLKDigital_IOSignal terminal RB6/ICSPCLK (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RB6/ICSPCLK. Supported peripheral buses: General.
17STATUSDigital_IOSignal terminal STATUS (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: STATUS. Supported peripheral buses: General.
18OPTIONDigital_IOSignal terminal OPTION (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OPTION. Supported peripheral buses: General.
19PCLDigital_IOSignal terminal PCL (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: PCL. Supported peripheral buses: General.
20FSRDigital_IOSignal terminal FSR (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: FSR. Supported peripheral buses: General.
21RC3Digital_IOSignal terminal RC3 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC3. Supported peripheral buses: General.
22RC4Digital_IOSignal terminal RC4 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC4. Supported peripheral buses: General.
23RC5Digital_IOSignal terminal RC5 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC5. Supported peripheral buses: General.
24RC6Digital_IOSignal terminal RC6 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC6. Supported peripheral buses: General.
25RC7Digital_IOSignal terminal RC7 (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: RC7. Supported peripheral buses: General.
26OSC2/CLKOUTDigital_IOSignal terminal OSC2/CLKOUT (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC2/CLKOUT. Supported peripheral buses: RTC/CLK.
27OSC1/CLKINDigital_IOSignal terminal OSC1/CLKIN (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: OSC1/CLKIN. Supported peripheral buses: RTC/CLK.
28MCLR/VPPDigital_IOSignal terminal MCLR/VPP (I/O, 2.0V to 5.5V domain). Multiplexed alternate functions: MCLR/VPP. Supported peripheral buses: General.
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