Electronic Component Library & IPC-7351B CAD Models — Page 300
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Split by MPN (3600 · Page 300/300)
Showing 3589–3600 of 3600 componentsLow-Dropout Linear Voltage Regulator (LDO)
Standard Electronic & Interconnect Component
Wireless Wi-Fi / Bluetooth LE SoC Module
主流Arm Cortex-M0+ 32位MCU,最高64KB闪存,18KB内存,2个USART,定时器,ADC,DAC,通信接口,1.7-3.6V
Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
USB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
Ultra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
LDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.