LQFP-144(20x20) · 8P
8P
带DSP和FPU的高性能ARM Cortex-M7 MCU，具有512 KB Flash、216 MHz CPU、ART加速器、一级缓存和SDRAM
Electronic Component Library & IPC-7351B CAD Models — Page 298
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
3564
2D ECAD LibrariesIEEE-315 / IPC
10692
3D MCAD ModelsAP214 / GLB
7120
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (3580 · Page 298/299)
Showing 3565–3576 of 3580 componentsLQFP-48(7x7) · 8P
LQFP-64(10x10) · 8P
LQFP-144(20x20) · 8P
8P
超低功耗Arm Cortex-M3 MCU，具有256-KB Flash存储器、32 MHz CPU、LCD、USB和3x运算放大器
LQFP-48(7x7) · 8P
LQFP-64(10x10) · 8P
8P
超低功耗32位超值系列Arm Cortex-M3 MCU，具有256 KB Flash、32 MHz CPU、LCD和USB
LQFP-144(20x20) · 8P
8P
带FPU的超低功耗80 Mhz Arm Cortex-M4 MCU，具有512-KB Flash存储器和DFSDM
LQFP-32(7x7) · 8P
8P
带DSP和FPU的主流混合信号ARM Cortex-M4 MCU，具有32 KB Flash、72 MHz CPU、CCM、5 Msps 12位ADC、比较器和运算放大器
UFQFPN-32(5x5) · 8P
8P
带DSP和FPU的170MHz主流ARM Cortex-M4 MCU，具有32 KB Flash存储器、数学加速器和中等模拟电平集成
TSSOP-20 · 8P
8P
主流Arm Cortex-M0+ MCU，具有16 KB Flash存储器、8 KB RAM、64 MHz CPU、2x USART、定时器、ADC和通信接口， I/F、1.7-3.6V
LQFP-100(14x14) · 8P
8P
高性能和带 DP-FPU 的 DSP、512 Kbytes 闪存、564 Kbytes RAM、550 MHz CPU、L1 缓存、外部内存接口及部分外设的 Arm Cortex-M7 微控制器
LQFP-32(7x7) · 8P
8P
带DSP和FPU的170MHz主流ARM Cortex-M4 MCU，具有128 KB Flash存储器、数学加速器和中等模拟电平集成
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.