- · 8P
Electronic Component Library & IPC-7351B CAD Models — Page 285
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Verified ComponentsDRC PASS
3408
2D ECAD LibrariesIEEE-315 / IPC
10224
3D MCAD ModelsAP214 / GLB
6808
Land Pattern NormalizationIPC-7351B
100%
Split by MPN (3421 · Page 285/286)
Showing 3409–3420 of 3421 componentsUQFN-36(5x5) · 8P
Through Hole,Right Angle,P=2mm · 8P
8P
Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃
WLCSP-36 · 8P
LQFP-100(14x14) · 8P
8P
主流ARM Cortex-M0基本型系列MCU，具有64 KB Flash、48 MHz CPU和CEC功能
BGA-144 · 8P
8P
主流增强型ARM Cortex-M3 MCU，具有1 MB Flash、72 MHz CPU、电机控制、USB和CAN
UFBGA-144 · 8P
8P
带DSP和FPU的高性能基础系列ARM Cortex-M4 MCU，具有256 KB Flash、180 MHz CPU、ART加速器和双QSPI
UFBGA-144 · 8P
8P
带DSP和FPU的高性能基础系列ARM Cortex-M4 MCU，具有512 KB Flash、180 MHz CPU、ART加速器和双QSPI
TFBGA-100 · 8P
8P
高性能和带 DP-FPU 的 DSP、配备 2 MB 闪存、1376 KB SRAM、280 MHz CPU、L1 缓存、图形加速、外部内存接口、SMPS 和大量外围设备的 Arm Cortex-M7 微控制器
TSSOP-14 · 8P
WLCSP-64(3.4x3.7) · 8P
8P
带FPU的超低功耗80 Mhz Arm Cortex-M4 MCU，具有512-KB Flash存储器、USB设备和DFSDM
UFBGA-81 · 8P
8P
带FPU的超低功耗80 Mhz Arm Cortex-M4 MCU，具有1 MB Flash存储器、LCD、USB OTG和DFSDM
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsQFN / DFN / LGAQFN
IPC-7351B · 60% Paste WindowHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
LQFP / TQFP (4-Side Gull-Wing)QFP
IPC-7351B Toe/Heel Fillet4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated RF ModuleMODULE
IPC-7351B · Antenna KeepoutCastellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
SOIC / SOP / TSSOP / MSOPSOIC
IPC-7351B Level A / B / CUSB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
BGA / WLCSP (2D Ball Grid)BGA
JEDEC MO-275 / MO-211 NSMDUltra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
SOT-23 / SOT-223 / TO-252SOT
IPC-7351B Asymmetric TabLDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-Hole DIP / HeaderTHT
IPC-2221 / IPC-7251 Plated HoleThrough-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.