Electronic Component Library & IPC-7351B CAD Models — Page 286
Look up datasheet specifications, verify synchronized IEEE-315 Symbols / IPC-7351B Footprints / STEP AP214 3D models, and download directly for KiCad 8, Fusion 360 (.lbr), and Altium.
Split by MPN (3436 · Page 286/287)
Showing 3421–3432 of 3436 componentsFemale Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃
主流超值系列ARM Cortex-M3 MCU,具有32 KB Flash、24 MHz CPU、运动控制和CEC功能
主流增强型ARM Cortex-M3 MCU,具有64 KB Flash、72 MHz CPU、电机控制、USB和CAN
主流增强型ARM Cortex-M3 MCU,具有128 KB Flash、72 MHz CPU、电机控制、USB和CAN
主流增强型ARM Cortex-M3 MCU,具有128 KB Flash、72 MHz CPU、电机控制、USB和CAN
带DSP和FPU的主流混合信号ARM Cortex-M4 MCU,具有64 KB Flash、72 MHz CPU、CCM、5 Msps 12位ADC、比较器、运算放大器和高分辨率定时器
带DSP和FPU的高性能基础系列ARM Cortex-M4 MCU,具有512 KB Flash、180 MHz CPU、ART加速器和双QSPI
超低功耗Arm Cortex-M0+ MCU,具有16-KB Flash存储器和32 MHz CPU
超低功耗Arm Cortex-M3 MCU,具有128-KB Flash存储器、32 MHz CPU和USB
超低功耗Arm Cortex-M3 MCU,具有64-KB Flash存储器、32 MHz CPU、LCD和USB
Components by Package Family (IPC-7351B & IPC-7525)
Each package links to a dedicated directory with IPC pad calculation rules, 60% stencil grids, and copper keepoutsHigh-density MCUs & SoCs (RP2040, ESP32-S3, STM32) with 60% segmented paste windows on EPAD to prevent reflow voiding.
4-sided gull-wing microcontrollers (STM32F103C8T6 LQFP-48, LQFP-64, LQFP-100) verified for JLCPCB minimum DFM clearance.
Castellated Wi-Fi/BLE modules (ESP32-WROOM, MINI-1U, S3) with strictly defined antenna copper keepout zones.
USB-UART, Timer, Op-Amp & SPI Flash ICs (CH340G, NE555, W25Q128, TSSOP-20) supporting live Span C/G/Z toggling.
Ultra-high-density MCUs & SoCs (STM32H7, STM32G0 WLCSP-25, UFBGA-176) with circular NSMD pads and 3D solder ball arrays.
LDO voltage regulators & power MOSFETs featuring asymmetric heatsink tabs (AMS1117-3.3, SOT-23-5, TO-252).
Through-hole components, industrial terminal blocks & DIP ICs (NE555P DIP-8) with square Pin 1 polarity pad.