4114 PARTSUpload PDF

All Packages RF Module BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Components (4124 components · Page 93/258)

Showing 1473–1488 of 4124 components

FBGA-676 · 676P

A3PE1500-2FG676 (FBGA-676) - 3D Model (FBGA-676)

A3PE1500-2FG676

MICROCHIP·FBGA-676

READY

676P27.0×27.0×1.35mmP=1mm3 V to 3.6 V

Standard Electronic & Interconnect Component

- · 18P

COM5016-5P (-) - 3D Model (-)

COM5016-5P

READY

18P22.3×6.3×4.20mmP=2.54mm

Standard Electronic & Interconnect Component

- · 14P

COM5046P (-) - 3D Model (-)

COM5046P

READY

14P17.2×6.3×4.20mmP=2.54mm

Standard Electronic & Interconnect Component

- · 8P

MIC2536-2BMM TS (-) - 3D Model (-)

MIC2536-2BMM TS

READY

8P3.0×3.0×1.10mmP=0.65mm

Standard Electronic & Interconnect Component

CSP-196 · 196P

AGL125V2-CSG196 (CSP-196) - 3D Model (CSP-196)

AGL125V2-CSG196

MICROCHIP·CSP-196

READY

196P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

Standard Electronic & Interconnect Component

FPBGA-484(27x27) · 484P

A54SX32A-2FGG484 (FPBGA-484(27x27)) - 3D Model (FPBGA-484(27x27))

A54SX32A-2FGG484

MICROCHIP·FPBGA-484(27x27)

READY

484P27.0×27.0×1.35mmP=1mm

Standard Electronic & Interconnect Component

PBGA-329 · 329P

A54SX32A-FBG329 (PBGA-329) - 3D Model (PBGA-329)

A54SX32A-FBG329

MICROCHIP·PBGA-329

READY

329P31.0×31.0×1.35mmP=1.27mm

Standard Electronic & Interconnect Component

FPBGA-256(17x17) · 256P

M1AFS1500-FGG256 (FPBGA-256(17x17)) - 3D Model (FPBGA-256(17x17))

M1AFS1500-FGG256

MICROCHIP·FPBGA-256(17x17)

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard Electronic & Interconnect Component

VFBGA-400 · 400P

M2GL060-1VF400I (VFBGA-400) - 3D Model (VFBGA-400)

M2GL060-1VF400I

MICROCHIP·VFBGA-400

READY

400P17.0×17.0×0.85mmP=0.8mm

Standard Electronic & Interconnect Component

FPBGA-256 · 256P

P1AFS600-2FGG256I (FPBGA-256) - 3D Model (FPBGA-256)

P1AFS600-2FGG256I

MICROCHIP·FPBGA-256

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard Electronic & Interconnect Component

FPBGA-256 · 256P

M1AFS250-1FGG256I (FPBGA-256) - 3D Model (FPBGA-256)

M1AFS250-1FGG256I

MICROCHIP·FPBGA-256

READY

256P17.0×17.0×1.35mmP=1mm2.97 V to 3.63 V

Standard Electronic & Interconnect Component

SOIC-8 · 8P

AT25020AN-10SU-2.7 (SOIC-8) - 3D Model (SOIC-8)

AT25020AN-10SU-2.7

MICROCHIP·SOIC-8

READY

8P4.9×3.9×1.75mmP=1.27mm2.7V to 5.5V

Standard Electronic & Interconnect Component

DIP-8 · 8P

AT24C04-10PC-2.7 (DIP-8) - 3D Model (DIP-8)

AT24C04-10PC-2.7

MICROCHIP·DIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm4.5V to 5.5V

Standard Electronic & Interconnect Component

TSSOP-8 · 8P

AT24C16B-TH-B (TSSOP-8) - 3D Model (TSSOP-8)

AT24C16B-TH-B

MICROCHIP·TSSOP-8

READY

8P3.0×4.4×1.20mmP=0.65mm1.8V to 5.5V

Standard Electronic & Interconnect Component

PDIP-8 · 8P

AT25040A-10PU-2.7 (PDIP-8) - 3D Model (PDIP-8)

AT25040A-10PU-2.7

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm2.7V to 5.5V

Standard Electronic & Interconnect Component

QFN-64(9x9) · 65P

DSPIC33CK128MC506-E/MR (QFN-64(9x9)) - 3D Model (QFN-64(9x9))

DSPIC33CK128MC506-E/MR

MICROCHIP·QFN-64(9x9)

READY

65P9.0×9.0×0.90mmP=0.5mm3V to 3.6V

Standard Electronic & Interconnect Component

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