3883 器件上传PDF

全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (3904 款元器件 · 第 228/244)

显示 3633–3648 共 3904 款元器件

SOP-8 · 8P

MAX485ESA (SOP-8) - 3D模型 (SOP-8)

MAX485ESA

READY

8P4.9×3.9×1.75mmP=1.27mm

标准电子与连接器元件

SOT-23 · 3P

AO3400A (SOT-23) - 3D模型 (SOT-23)

AO3400A

READY

3P2.9×1.3×1.10mmP=1.9mm

标准电子与连接器元件

DIP-8 · 8P

AT24C02CN (DIP-8) - 3D模型 (DIP-8)

AT24C02CN

READY

8P9.6×6.3×4.20mmP=2.54mm1.7V to 5.5V

标准电子与连接器元件

TSSOP-20-175mil · 20P

CH32V003F4P6 (TSSOP-20-175mil) - 3D模型 (TSSOP-20-175mil)

CH32V003F4P6

WCH·TSSOP-20-175mil

READY

20P6.5×4.4×1.00mmP=0.65mm2.7V~5.5V

嵌入式微控制器芯片 (MCU)

MSOP-10 · 10P

CH340E (MSOP-10) - 3D模型 (MSOP-10)

CH340E

READY

10P3.0×3.0×1.10mmP=0.5mm3.3V to 5V

接口转换与时钟定时器芯片

SOP-8 · 8P

CH340N (SOP-8) - 3D模型 (SOP-8)

CH340N

READY

8P4.9×3.9×1.75mmP=1.27mm3.3V to 5V

接口转换与时钟定时器芯片

LQFP-64(10x10) · 64P

STM32F405RGT6 (LQFP-64(10x10)) - 3D模型 (LQFP-64(10x10))

STM32F405RGT6

ST·LQFP-64(10x10)

READY

64P10.0×10.0×1.60mmP=0.5mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

SOIC-8-EP · 9P

TPS5430DDAR (SOIC-8-EP) - 3D模型 (SOIC-8-EP)

TPS5430DDAR

READY

9P4.9×3.9×1.70mmP=1.27mm5.5 V to 36 V

标准电子与连接器元件

SOIC-8 · 8P

LM358DR (SOIC-8) - 3D模型 (SOIC-8)

LM358DR

READY

8P4.9×3.9×1.75mmP=1.27mm3 V to 32 V

标准电子与连接器元件

SOIC-8-208mil · 8P

W25Q128JVSIQ (SOIC-8-208mil) - 3D模型 (SOIC-8-208mil)

W25Q128JVSIQ

Winbond·SOIC-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

标准电子与连接器元件

LED0402-RD_WHITE · 2P

C9900204131 (LED0402-RD_WHITE) - 3D模型 (LED0402-RD_WHITE)

C9900204131

Generic·LED0402-RD_WHITE

READY

2P1.0×0.5×0.55mmP=1.08mm

标准电子与连接器元件

MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GT · 10P

C9900189595 (MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GT) - 3D模型 (MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GT)

C9900189595

Generic·MSOP-10_L3.0-W3.0-P0.50-LS4.9-BL_SJWCH5351A-GT

READY

10P3.0×3.0×1.10mmP=0.5mm

接口转换与时钟定时器芯片

SMD,16.6x13.2mm · 53P

ESP32-C3-MINI-1-H4X (SMD,16.6x13.2mm) - 3D模型 (SMD,16.6x13.2mm)

ESP32-C3-MINI-1-H4X

ESPRESSIF·SMD,16.6x13.2mm

READY

53P16.6×13.2×2.40mmP=0.8mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

QFN-104(10x10) · 105P

ESP32-P4NRW32X (QFN-104(10x10)) - 3D模型 (QFN-104(10x10))

ESP32-P4NRW32X

ESPRESSIF(乐鑫)·QFN-104(10x10)

READY

105P10.0×10.0×0.90mmP=0.35mm

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,27.5x18mm · 37P

ESP32-C5-WROOM-1-N16R8-V1.2 (SMD,27.5x18mm) - 3D模型 (SMD,27.5x18mm)

ESP32-C5-WROOM-1-N16R8-V1.2

ESPRESSIF·SMD,27.5x18mm

READY

37P27.5×18.0×3.30mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

SMD,27.5x18mm · 37P

ESP32-C5-WROOM-1 (SMD,27.5x18mm) - 3D模型 (SMD,27.5x18mm)

ESP32-C5-WROOM-1

ESPRESSIF·SMD,27.5x18mm

READY

37P27.5×18.0×3.30mmP=1.27mm3.0 ~ 3.6 V

Wi-Fi 与蓝牙低功耗 (BLE) 无线 SoC 模组

探索器件库封装厂商上传