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全部封装 RF模组 BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

器件库 (4104 款元器件 · 第 202/257)

显示 3217–3232 共 4104 款元器件

UFBGA-73(5x5) · 73P

STM32WL54JCI6 (UFBGA-73(5x5)) - 3D模型 (UFBGA-73(5x5))

STM32WL54JCI6

ST(意法半导体)·UFBGA-73(5x5)

READY

73P5.0×5.0×0.58mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-100(7x7) · 100P

STM32F373VCH6 (UFBGA-100(7x7)) - 3D模型 (UFBGA-100(7x7))

STM32F373VCH6

ST·UFBGA-100(7x7)

READY

100P7.0×7.0×0.53mmP=0.5mm

嵌入式微控制器芯片 (MCU)

UFBGA-132(7x7) · 132P

STM32U575QGI6 (UFBGA-132(7x7)) - 3D模型 (UFBGA-132(7x7))

STM32U575QGI6

ST(意法半导体)·UFBGA-132(7x7)

READY

132P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

WLCSP24 · 24P

STM32C092ECY6TR (WLCSP24) - 3D模型 (WLCSP24)

STM32C092ECY6TR

ST(意法半导体)·WLCSP24

READY

24P2.6×1.7×0.55mmP=0.31mm

嵌入式微控制器芯片 (MCU)

VFBGA-424(14x14) · 424P

STM32MP257DAK3 (VFBGA-424(14x14)) - 3D模型 (VFBGA-424(14x14))

STM32MP257DAK3

ST·VFBGA-424(14x14)

READY

424P14.0×14.0×0.80mmP=0.5mm

嵌入式微控制器芯片 (MCU)

- · 40P

LCKFB-DKX-STM32F103C8T6 (-) - 3D模型 (-)

LCKFB-DKX-STM32F103C8T6

READY

40P53.3×22.9×3.85mm

嵌入式微控制器芯片 (MCU)

LFLGA-86 · 86P

STM32WB5MMGH6TR (LFLGA-86) - 3D模型 (LFLGA-86)

STM32WB5MMGH6TR

READY

86P11.0×7.3×1.15mmP=0.45mm1.8 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265(14x14) · 265P

STM32H747XIH6 (TFBGA-265(14x14)) - 3D模型 (TFBGA-265(14x14))

STM32H747XIH6

ST·TFBGA-265(14x14)

READY

265P14.0×14.0×1.00mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-201 · 201P

STM32H725IGK6 (UFBGA-201) - 3D模型 (UFBGA-201)

STM32H725IGK6

READY

201P10.0×10.0×0.50mmP=0.65mm1.62 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H750XBH6U (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H750XBH6U

READY

265P14.0×14.0×1.03mmP=0.8mm

嵌入式微控制器芯片 (MCU)

UFBGA-143 · 143P

STM32F746ZGY6TR (UFBGA-143) - 3D模型 (UFBGA-143)

STM32F746ZGY6TR

READY

143P5.8×4.5×0.55mmP=0.4mm1.7 V to 3.6 V

嵌入式微控制器芯片 (MCU)

TFBGA-265 · 265P

STM32H745XIH3 (TFBGA-265) - 3D模型 (TFBGA-265)

STM32H745XIH3

READY

265P14.0×14.0×1.03mmP=0.8mm

嵌入式微控制器芯片 (MCU)

TFBGA-361 · 361P

STM32MP157DAC1 (TFBGA-361) - 3D模型 (TFBGA-361)

STM32MP157DAC1

READY

361P12.0×12.0×0.96mmP=0.5mm1.71 V to 3.6 V

嵌入式微控制器芯片 (MCU)

UFBGA-100 · 100P

STM32F103VBI6 (UFBGA-100) - 3D模型 (UFBGA-100)

STM32F103VBI6

READY

100P7.0×7.0×0.60mmP=0.5mm

嵌入式微控制器芯片 (MCU)

WLCSP-66(3.8x4.2) · 66P

STM32F383RCY6TR (WLCSP-66(3.8x4.2)) - 3D模型 (WLCSP-66(3.8x4.2))

STM32F383RCY6TR

ST·WLCSP-66(3.8x4.2)

READY

66P4.2×3.8×0.57mmP=0.4mm

嵌入式微控制器芯片 (MCU)

WLCSP-25(2.3x2.5) · 25P

STM32G081EBY6TR (WLCSP-25(2.3x2.5)) - 3D模型 (WLCSP-25(2.3x2.5))

STM32G081EBY6TR

ST·WLCSP-25(2.3x2.5)

READY

25P2.5×2.3×0.56mmP=0.4mm1.62 V - 3.6 V

嵌入式微控制器芯片 (MCU)

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